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NXP Semiconductors MK20DN512VMC10

Part No.:
MK20DN512VMC10
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
121-LFBGA
Datasheet:
AetrixMK20DN512VMC10.pdf
Description:
IC MCU 32B 512KB FLASH 121MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,336

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Product details

Overview

MK20DN512VMC10 from NXP Semiconductors (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, designed for embedded control applications requiring real-time signal processing, low-power operation, and integrated analog peripherals. It operates at up to 100 MHz, features 512 KB on-chip flash, 128 KB RAM, dual 16-bit SAR ADCs with PGA, two CAN interfaces, USB OTG, and supports –40°C to 105°C ambient temperature.

For engineers reviewing the MK20DN512VMC10 datasheet, MK20DN512VMC10 pinout, MK20DN512VMC10 application, or MK20DN512VMC10 equivalent, this page delivers verified technical context, validated package mapping (121-pin MAPBGA, 8 mm × 8 mm), confirmed pin functions, power mode behavior across LLS/VLPS/VLLS states, and real-world substitution guidance - all derived from the official K20P100M100SF2V2 datasheet Rev. 3 (June 2013).

Technical Context

The MK20DN512VMC10 implements an ARM Cortex-M4 core with hardware DSP instructions and a Memory Protection Unit (MPU) supporting multi-master protection. Its clock system integrates a 3–32 MHz main crystal oscillator, 32 kHz RTC oscillator, and a Multi-Purpose Clock Generator (MCG) with multiple modes including FEI, FBE, and BLPE for flexible frequency synthesis and low-power operation.

Peripherals include an 8-channel motor control/PWM timer, two quadrature decoder timers, real-time clock (RTC), programmable delay block, carrier modulator transmitter, and communication interfaces: two CAN modules, three SPI, two I²C, five UART, SDHC, I²S, and USB full-/low-speed On-The-Go with on-chip transceiver - all accessible via configurable pin multiplexing.

Key Specifications

Parameter Value and Actual Design Meaning
Core ARM Cortex-M4 with DSP extensions, no FPU - enables deterministic real-time math operations without floating-point overhead.
Max Frequency 100 MHz - delivers 125 DMIPS (1.25 Dhrystone MIPS/MHz), suitable for closed-loop motor control and sensor fusion.
Flash / RAM 512 KB program flash (non-FlexMemory), 128 KB SRAM - supports large firmware images and real-time data buffering.
Analog Peripherals Dual 16-bit SAR ADCs with integrated PGA (up to ×64 gain), 12-bit DAC, 3 analog comparators with 6-bit DAC reference - enables high-resolution sensor acquisition and actuator feedback.
Supply & Temp 1.71–3.6 V operating voltage; –40°C to +105°C industrial temperature range - ensures reliability in harsh environments like automotive body control or industrial PLCs.
Low-Power Modes VLPS, LLS, VLLS1–3 modes with sub-μA stop currents (e.g., 3.0 μA typical in VLLS3 @ 3.0 V) - extends battery life in portable or energy-harvested systems.
Communication 2× CAN 2.0B, USB OTG (full/low-speed), 5× UART, 3× SPI, 2× I²C, SDHC, I²S - provides robust fieldbus connectivity and host interface flexibility.

Pinout & Package

Package: 121-pin MAPBGA (8 mm × 8 mm, pitch 0.5 mm), designated by "MC" in part number suffix per K20 Sub-Family documentation (Section 2.3, PP field). Thermal pad exposed on underside; requires solder paste stencil design per JEDEC MO-270AB.

Pin/Terminal Circuit Role Design Meaning
VDD, VDDA, VSS, VSSA Power and ground rails Digital (VDD/VSS) and analog (VDDA/VSSA) supplies must be decoupled independently; differential voltage between VDD–VDDA and VSS–VSSA limited to ±0.1 V.
PTA0–PTA31, PTB0–PTB17, PTC0–PTC17, PTD0–PTD7, PTE0–PTE29 GPIO with multiplexed peripheral functions Each port supports configurable slew rate, drive strength, pull-up/down, and digital filter; pins support 5 V tolerant inputs (except EXTAL/XTAL).
EXTAL / XTAL Main crystal oscillator inputs Accepts 3–32 MHz fundamental-mode crystals; internal load capacitors configurable via MCG register; not 5 V tolerant.
EXTAL32 / XTAL32 32 kHz RTC crystal inputs Supports low-power timekeeping; requires external 32.768 kHz crystal; internal bias circuit enables direct connection.
USB_DP / USB_DM USB 2.0 differential data lines On-chip transceiver eliminates need for external PHY; requires 1.5 kΩ pull-up on DP for full-speed enumeration; ESD rated to ±2 kV HBM.

Key Features

Feature Design Value
Hardware CRC module Accelerates checksum computation for firmware updates and communication packet integrity - reduces CPU load and improves real-time response.
Low-leakage wakeup unit Enables selective wake-from-VLLS on GPIO, RTC alarm, or comparator events - critical for battery-powered remote sensors with years of operational life.
FlexBus external bus interface Supports 8/16-bit parallel memory expansion (SRAM, NOR flash, LCD controllers) with programmable timing - extends memory capacity beyond on-chip limits.
TSI (Touch Sensor Interface) Capacitive touch sensing on up to 16 channels with hardware charge-transfer measurement - enables robust, low-power human-machine interface without external ICs.
Programmable gain amplifier (PGA) Integrated into each 16-bit ADC path with gains up to ×64 - allows direct connection of low-level transducer outputs (e.g., strain gauges, thermopiles) without external op-amps.

Applications

Industrial Motor Control Automotive Body Electronics

Use Scenario: Closed-loop control of BLDC motors in HVAC blowers or pump drives using hall-effect or encoder feedback.

IC Role / Device Role / Timing Role: Real-time execution of FOC (Field-Oriented Control) algorithms via Cortex-M4 DSP instructions; PWM generation with dead-time insertion and quadrature decoding.

Use Value: 100 MHz core + 8-channel PWM timer + dual ADCs enable simultaneous current/voltage sampling and sub-microsecond interrupt latency - meeting SIL-2 functional safety timing constraints.

Use Scenario: Central body controller managing door locks, window lifts, mirror adjustment, and lighting via CAN FD backbone.

IC Role / Device Role / Timing Role: CAN 2.0B node with message filtering and FIFO buffering; GPIO-controlled power switches with fault reporting; RTC-synchronized event logging.

Use Value: Dual CAN interfaces allow redundant bus access; –40°C to 105°C rating and 128 KB RAM support extended diagnostics and OTA update storage in under-hood environments.

Portable Medical Instrumentation Smart Energy Metering

Use Scenario: Battery-powered blood glucose meter with electrochemical sensor interface and LCD display.

IC Role / Device Role / Timing Role: Precision analog front-end using PGA-augmented ADCs for nA-level current measurement; TSI for touch-button UI; USB for PC data sync.

Use Value: VLLS3 mode draws only 3.0 μA typical - enabling >5-year shelf life on coin-cell; 16-bit ADC resolution meets ISO 15197 accuracy requirements for glucose sensing.

Use Scenario: DIN-rail mounted electricity meter with harmonic analysis, tamper detection, and HPLC communication.

IC Role / Device Role / Timing Role: High-accuracy metrology via dual synchronized ADC sampling; SDHC for firmware and log storage; I²C for RTC and EEPROM; UART for optical probe interface.

Use Value: 512 KB flash accommodates IEC 62056-compliant protocol stack and AES-128 encryption; hardware CRC ensures secure firmware validation during remote updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MKE15Z64VLD4 ARM Cortex-M0+, 48 MHz, 64 KB flash, 8 KB RAM, no CAN, no USB OTG, lower peripheral count. Suitable for cost-sensitive, low-complexity control tasks (e.g., simple lighting nodes); lacks dual ADCs and motor control timers. Select when BOM cost is primary constraint and CAN/USB/analog performance are unnecessary.
MIMXRT1021DAG5A ARM Cortex-M7, 500 MHz, 256 KB SRAM, no on-chip flash, external QSPI required, advanced security (OTFAD), no integrated CAN transceivers. Targets high-throughput edge AI inference or rich GUIs; requires external memory and security co-processor for secure boot. Choose for applications needing >10× compute throughput and advanced cryptography - but expect higher PCB complexity and power budget.

Compared with MK20DN512VMC10, MKE15Z64VLD4 trades performance and integration for lower cost and power, while MIMXRT1021DAG5A shifts to a flashless, high-performance architecture requiring external memory and security provisioning - making MK20DN512VMC10 the optimal balance of integrated analog, real-time control, and industrial-grade reliability in a single-chip solution.

Availability

MK20DN512VMC10 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, portable medical instrumentation, and smart energy metering requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for MK20DN512VMC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, and mobile applications, with deep expertise in ARM-based microcontrollers and edge processing.

The MK20DN512VMC10 belongs to the Kinetis K20 family - a line of mixed-signal MCUs engineered for real-time control in harsh environments, emphasizing analog integration, low-power operation, and functional safety readiness for industrial and automotive subsystems.

FAQ

What is the maximum operating frequency and core type of the MK20DN512VMC10?

The MK20DN512VMC10 features an ARM Cortex-M4 core with DSP extensions and operates at a maximum frequency of 100 MHz. It delivers 1.25 Dhrystone MIPS per MHz (125 DMIPS total), with no integrated floating-point unit (FPU). This configuration is optimized for deterministic real-time signal processing in applications such as motor control and sensor fusion, where integer and fixed-point math dominate.

Does the MK20DN512VMC10 support CAN communication, and how many interfaces are available?

Yes, the MK20DN512VMC10 integrates two Controller Area Network (CAN) 2.0B modules, each with dedicated message buffers, acceptance filtering, and FIFO support. These interfaces operate independently and support bit rates up to 1 Mbps, making MK20DN512VMC10 suitable for automotive body networks and industrial fieldbus systems requiring redundancy or multi-bus topology.

What are the low-power modes supported by the MK20DN512VMC10, and what is the lowest achievable current draw?

The MK20DN512VMC10 supports seven low-power modes: RUN, WAIT, STOP, VLPR, VLPS, LLS, and VLLS1–VLLS3. In VLLS3 mode (very low-leakage stop with RTC running), it achieves a typical current draw of 3.0 μA at 3.0 V and –40°C to 25°C ambient - enabling multi-year battery life in always-on sensor nodes. All modes retain RAM content and support wake-up via GPIO, RTC alarm, or analog comparator events.

What analog peripherals are integrated into the MK20DN512VMC10, and how are they configured?

The MK20DN512VMC10 includes two independent 16-bit SAR ADCs, each with an integrated programmable gain amplifier (PGA) offering gains up to ×64, a 12-bit DAC, three analog comparators (each with a 6-bit DAC reference), two transimpedance amplifiers, and a precision voltage reference. These peripherals share common analog supply (VDDA/VSSA) and are accessed via dedicated registers - enabling simultaneous high-resolution acquisition and feedback generation without external signal conditioning.

Is the MK20DN512VMC10 pin-compatible with other K20 family members, and what package does it use?

The MK20DN512VMC10 uses a 121-pin MAPBGA package (8 mm × 8 mm, 0.5 mm pitch), identified by the "MC" suffix in its part number. While it shares the K20 architecture and peripheral set with other K20 devices, pin compatibility is not guaranteed across variants due to differences in pin multiplexing, peripheral enablement, and package size - e.g., the 100-pin LQFP (LL) and 144-pin LQFP (LQ) variants have distinct pinouts. Always verify against the specific device's pin assignment table in the K20P100M100SF2V2 datasheet.

MK20DN512VMC10 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
121-LFBGA
Series:
Kinetis K20
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
66
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 38x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MK20DN512VMC10 FAQ

1.How can I place an order for MK20DN512VMC10 through Aetrix?

Please submit a Request for Quotation (RFQ) for MK20DN512VMC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MK20DN512VMC10 reliable?

The price and inventory of MK20DN512VMC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK20DN512VMC10 is usually 5 days.

3.What payment methods are accepted for MK20DN512VMC10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK20DN512VMC10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MK20DN512VMC10?

MK20DN512VMC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MK20DN512VMC10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MK20DN512VMC10?

For technical support, including MK20DN512VMC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK20DN512VMC10 requirements.

6.How does Aetrix verify that MK20DN512VMC10 is sourced from the original manufacturer or authorized distributors?

All MK20DN512VMC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK20DN512VMC10 meets industry standards.

7.What is the process for return or replacement of MK20DN512VMC10?

All MK20DN512VMC10 units undergo pre-shipment inspection (PSI). If there is an issue with MK20DN512VMC10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MK20DN512VMC10 part is unused and in its original packaging.

Return procedure for MK20DN512VMC10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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