NXP Semiconductors MK20DN512VMD10
- Part No.:
- MK20DN512VMD10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LBGA
- Datasheet:
-
MK20DN512VMD10.pdf
- Description:
- IC MCU 32B 512KB FLASH 144MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:800
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Product details
Overview
MK20DN512VMD10 from NXP (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, designed for embedded control applications requiring high integration, real-time performance, and low-power operation. It delivers 100 MHz core speed, 512 KB on-chip flash memory, 128 KB RAM, dual 16-bit SAR ADCs with integrated PGA, two 12-bit DACs, two CAN interfaces, USB OTG, and operates across –40 to 105°C ambient temperature.
For engineers reviewing the MK20DN512VMD10 datasheet, MK20DN512VMD10 pinout, MK20DN512VMD10 application, or MK20DN512VMD10 equivalent, key selection considerations include its 100 MHz Cortex-M4 core with DSP support, 512 KB flash/128 KB RAM configuration, VMD10 package (100-pin LQFP), dual CAN capability, and industrial-temperature grade operation in motor control, industrial automation, and medical instrumentation designs.
Technical Context
The MK20DN512VMD10 implements an ARM Cortex-M4 core with hardware-accelerated DSP instructions and a Memory Protection Unit (MPU), supporting deterministic real-time execution. Its clock system integrates a multi-purpose clock generator (MCG) with 3–32 MHz crystal oscillator input, 32 kHz RTC oscillator, and internal reference options - enabling flexible low-power mode transitions including VLPS, LLS, and VLLS modes.
Peripheral architecture includes a 16-channel DMA controller servicing up to 63 request sources, FlexBus external bus interface for memory expansion, EzPort serial programming interface, and comprehensive analog subsystem comprising two independent 16-bit ADCs (each with programmable gain amplifier up to ×64), two 12-bit DACs, three analog comparators with integrated 6-bit DACs, and transimpedance amplifiers - all operating within the 1.71–3.6 V supply range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M4 with DSP extensions, no FPU - enables signal processing tasks without floating-point overhead |
| Max Clock Speed | 100 MHz - supports real-time control loops with sub-microsecond timing resolution |
| Flash Memory | 512 KB program flash only (N = non-FlexMemory) - sufficient for complex firmware with bootloader, OTA, and safety stacks |
| RAM | 128 KB SRAM - accommodates large buffers, RTOS kernel, and application data structures |
| ADC | Dual 16-bit SAR ADCs, each with integrated PGA (×1 to ×64) - allows direct high-resolution sensing of low-amplitude signals (e.g., strain gauges, thermopiles) |
| DAC | Two 12-bit DACs - supports analog output generation for calibration, biasing, or waveform synthesis |
| CAN Interfaces | Two independent CAN 2.0B modules - enables dual-bus automotive or industrial network architectures |
| Operating Temp | –40 to 105°C - qualified for under-hood automotive, industrial drives, and harsh-environment control systems |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm), lead-free, RoHS-compliant - compatible with standard surface-mount reflow processes and manual inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Digital power supply and ground | Multiple dedicated pairs ensure stable core voltage delivery and noise isolation across high-speed switching domains |
| VDDA, VSSA | Analog power supply and ground | Separate analog rail minimizes digital switching noise coupling into precision ADC/DAC paths |
| EXTAL, XTAL | Main crystal oscillator inputs | Supports 3–32 MHz crystal for precise system clock generation and USB timing compliance |
| EXTAL32, XTAL32 | 32 kHz RTC crystal inputs | Enables accurate real-time clock operation with battery backup capability |
| PTA0–PTA31, PTB0–PTB17, etc. | GPIO multiplexed pins | Configurable as digital I/O, UART, SPI, I²C, CAN, ADC, DAC, TSI, PWM - maximizes peripheral routing flexibility |
| USB_DP, USB_DM | USB 2.0 full-/low-speed differential pair | Integrated transceiver eliminates need for external PHY - reduces BOM and layout complexity |
| CAN0_TX, CAN0_RX, CAN1_TX, CAN1_RX | CAN bus signal terminals | Dual independent CAN controllers with dedicated pins - supports redundant or multi-network topologies |
Key Features
| Feature | Design Value |
|---|---|
| Low-power modes (VLPS/LLS/VLLS) | Sub-μA stop-mode currents (e.g., 2.2 μA VLLS2 @ –40 to 25°C) enable battery-powered operation for years |
| Hardware CRC module | Accelerates checksum computation for firmware integrity verification and communication protocol framing |
| 128-bit unique chip ID | Enables secure device authentication, license binding, and anti-cloning in production firmware |
| FlexBus external bus interface | Supports parallel NOR/NAND flash, SRAM, and peripherals - extends memory and I/O capability beyond on-chip limits |
| TSI (Touch Sensing Interface) | Capacitive touch sensing with low-power wakeup - enables intuitive HMI without external controllers |
| EzPort serial programming | Allows in-system flash programming via SPI-like interface - simplifies field firmware updates and manufacturing programming |
Applications
| Motor Control Systems | Industrial PLC Modules |
|---|---|
Use Scenario: Closed-loop servo drive controlling PMSM/BLDC motors in factory automation equipment. IC Role / Device Role / Timing Role: Primary real-time controller executing FOC algorithms, managing PWM generation, ADC sampling, and CAN-based motion coordination. Use Value: 100 MHz Cortex-M4 with DSP instructions executes field-oriented control in <5 μs; dual 16-bit ADCs sample current feedback at 1 MSps with PGA gain compensation for shunt-based sensing. | Use Scenario: Modular I/O base unit handling analog input (4–20 mA), digital I/O, and fieldbus communication in distributed control systems. IC Role / Device Role / Timing Role: Central processor managing sensor acquisition, logic execution, diagnostics, and dual-CAN gateway functions between local and backbone networks. Use Value: 512 KB flash stores multiple firmware variants and safety-certified runtime; 128 KB RAM buffers high-speed analog scan data; dual CAN interfaces isolate control and diagnostics traffic. |
| Medical Infusion Pumps | Automotive Body Control Units |
Use Scenario: Battery-powered infusion pump requiring precise flow rate control, pressure monitoring, and human interface with touch buttons and LCD. IC Role / Device Role / Timing Role: Safety-aware controller performing motor control, pressure ADC acquisition, TSI-based touch interface, and USB host for configuration and data logging. Use Value: VLLS3 stop-mode current of 3.0 μA @ –40 to 25°C extends battery life; integrated DACs generate precise reference voltages for pressure sensor excitation; TSI enables reliable touch detection without added components. | Use Scenario: Gateway node aggregating LIN, CAN, and discrete I/O for lighting, window lift, and mirror control in entry-level vehicles. IC Role / Device Role / Timing Role: Main body controller executing ASAM-compliant diagnostics, PWM dimming, CAN message filtering, and watchdog supervision. Use Value: –40 to 105°C rating ensures reliability in engine bay proximity; 12-bit DACs calibrate LED driver references; hardware CRC validates ECU firmware updates over CAN. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| K20DX256VLQ10 | 256 KB flash, 64 KB RAM, 144-pin LQFP - smaller memory, larger package | Suitable for cost-sensitive designs where 512 KB flash is unnecessary; higher pin count eases routing but increases board area | Select when lower memory density and additional GPIOs justify larger footprint and reduced flash capacity |
| MKE15Z256VLH7 | Cortex-M0+, 256 KB flash, 48 KB RAM, 100-pin LQFP - lower performance, newer Kinetis E-series | Better power efficiency in ultra-low-power use cases; lacks DSP instructions and dual CAN; not pin-compatible | Choose for simpler control tasks with strict energy budgets, accepting trade-offs in compute throughput and CAN channel count |
Compared with MK20DN512VMD10, K20DX256VLQ10 offers less flash/RAM in a larger package, while MKE15Z256VLH7 provides lower active power and modern peripherals at the expense of DSP capability and dual CAN - making MK20DN512VMD10 optimal for performance-critical, dual-network industrial control.
Availability
MK20DN512VMD10 is available at Aetrix Electronics and suitable for motor control systems, industrial PLC modules, medical infusion pumps, and automotive body control units requiring stable component supply, long-term lifecycle assurance, and industrial-temperature-grade reliability.
Supply support for MK20DN512VMD10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, and mobile applications.
The MK20DN512VMD10 belongs to the Kinetis K20 family - a line of ARM Cortex-M4 microcontrollers engineered for real-time embedded control in demanding industrial and automotive environments, emphasizing analog integration, low-power versatility, and functional safety readiness.
FAQ
What is the maximum operating frequency of the MK20DN512VMD10?
The MK20DN512VMD10 operates at a maximum core frequency of 100 MHz. This speed is achieved using the internal Multi-Purpose Clock Generator (MCG) in FEE mode with an external crystal or oscillator input. The 100 MHz specification is guaranteed across the full –40 to 105°C temperature range and 1.71–3.6 V supply voltage, enabling deterministic real-time execution for time-critical applications such as motor control and industrial automation. MK20DN512VMD10 maintains this performance without requiring external PLL components.
Does the MK20DN512VMD10 include a hardware floating-point unit (FPU)?
No, the MK20DN512VMD10 does not include a hardware FPU. It features an ARM Cortex-M4 core with DSP instruction extensions (e.g., MAC, saturating arithmetic, SIMD), but lacks the optional single-precision FPU found in the 'F' variant (e.g., MK20DF512VLQ10). Applications requiring intensive floating-point math must use software libraries or consider FPU-equipped alternatives. MK20DN512VMD10 remains optimized for fixed-point signal processing, control algorithms, and mixed-signal integration where DSP acceleration suffices.
What package type and pin count does the MK20DN512VMD10 use?
The MK20DN512VMD10 uses a 100-pin LQFP package (14 mm × 14 mm), identified by the 'VMD10' suffix per NXP's part numbering convention: 'VM' = 100-pin LQFP, 'D' = industrial temperature range (–40 to 105°C), '10' = 100 MHz max frequency. This package provides full access to all peripherals including dual CAN, USB, six UARTs, three SPIs, and dual ADC/DAC channels, while maintaining compatibility with standard PCB assembly processes. MK20DN512VMD10 is not offered in QFN or BGA variants.
How much flash and RAM memory does the MK20DN512VMD10 have?
The MK20DN512VMD10 integrates 512 KB of on-chip program flash memory and 128 KB of general-purpose SRAM. The 'N' in the part number indicates non-FlexMemory configuration - meaning all 512 KB is dedicated to executable code and constants, with no configurable FlexNVM/FlexRAM partitioning. This memory allocation supports complex firmware with real-time OS, communication stacks (e.g., CANopen, USB CDC), and safety mechanisms. MK20DN512VMD10's RAM size accommodates large data buffers, stack usage, and dynamic heap allocation in industrial control applications.
Is the MK20DN512VMD10 qualified for automotive applications?
The MK20DN512VMD10 is rated for –40 to 105°C operation and meets industrial reliability standards, but it is not AEC-Q100 qualified for automotive front-end or powertrain applications. It is suitable for body electronics, infotainment peripherals, and diagnostic tools where full automotive qualification is not mandated. For AEC-Q100 Grade 2 (–40 to 105°C) certified equivalents, designers should evaluate NXP's S32K1xx series. MK20DN512VMD10 remains widely deployed in automotive-adjacent industrial systems requiring robust thermal performance and CAN/USB connectivity.
MK20DN512VMD10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LBGA
- Series:
- Kinetis K20
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 100
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 42x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK20DN512VMD10 FAQ
1.How can I place an order for MK20DN512VMD10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK20DN512VMD10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK20DN512VMD10 reliable?
The price and inventory of MK20DN512VMD10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK20DN512VMD10 is usually 5 days.
3.What payment methods are accepted for MK20DN512VMD10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK20DN512VMD10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK20DN512VMD10?
MK20DN512VMD10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK20DN512VMD10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK20DN512VMD10?
For technical support, including MK20DN512VMD10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK20DN512VMD10 requirements.
6.How does Aetrix verify that MK20DN512VMD10 is sourced from the original manufacturer or authorized distributors?
All MK20DN512VMD10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK20DN512VMD10 meets industry standards.
7.What is the process for return or replacement of MK20DN512VMD10?
All MK20DN512VMD10 units undergo pre-shipment inspection (PSI). If there is an issue with MK20DN512VMD10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK20DN512VMD10 part is unused and in its original packaging.
Return procedure for MK20DN512VMD10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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