NXP Semiconductors MK20DN512ZAB10R
- Part No.:
- MK20DN512ZAB10R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 120-UFBGA, WLCSP
- Datasheet:
-
MK20DN512ZAB10R.pdf
- Description:
- IC MCU 32BIT 512KB FLSH 120WLCSP
- Quantity:
- Payment:

- Shipping:

Inventory:2,139
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MK20DN512ZAB10R from NXP (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extension, designed for embedded control applications requiring high integration and low-power operation. It features 512 KB on-chip flash memory, 128 KB RAM, operates from 1.71–3.6 V, supports –40 to 105°C ambient temperature, and delivers up to 100 MHz core performance - used in industrial motor control systems with integrated ADCs, PWM timers, and CAN interfaces.
For engineers reviewing the MK20DN512ZAB10R datasheet, MK20DN512ZAB10R pinout, MK20DN512ZAB10R application, or MK20DN512ZAB10R equivalent, key selection considerations include its 100 MHz Cortex-M4 core, dual 16-bit SAR ADCs with PGA, two 12-bit DACs, six UARTs, dual CAN modules, USB OTG, and support for FlexBus and SDHC - all within an LQFP-144 package rated for extended temperature operation.
Technical Context
This microcontroller implements an ARM Cortex-M4 core with hardware DSP instructions and single-cycle MAC, paired with a multi-source 16-channel DMA controller supporting up to 63 request sources. Its clock system includes a 3–32 MHz crystal oscillator, 32 kHz RTC oscillator, and a multi-purpose clock generator with MCG modes (FEI/FBI/FBE/BLPE/PBE/PBE).
The device integrates dual 16-bit SAR ADCs each with programmable gain amplifier (up to ×64), three analog comparators with integrated 6-bit DACs, two 12-bit DACs, and a voltage reference module. Communication peripherals include USB full-/low-speed OTG, two CAN 2.0B controllers, three SPI, two I²C, six UART, SDHC, and I²S modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M4 with DSP extension, no FPU - enables real-time signal processing in motor control and sensor fusion without floating-point overhead. |
| Max Clock Frequency | 100 MHz - delivers 125 DMIPS at 1.25 Dhrystone MIPS/MHz, sufficient for closed-loop servo control with <1 µs interrupt latency. |
| Flash Memory | 512 KB program flash - supports large firmware images with bootloader, OTA update partitioning, and robust error correction. |
| RAM | 128 KB SRAM - accommodates real-time data buffers, stack space for nested interrupts, and DSP algorithm working memory. |
| ADC | Dual 16-bit SAR ADCs with integrated PGA (×1–×64) - allows direct high-resolution sensing of low-amplitude analog signals (e.g., current shunt, thermocouple) without external amplification. |
| Temperature Range | –40°C to +105°C - qualified for under-hood automotive, industrial drives, and outdoor power electronics where thermal margin is critical. |
| Supply Voltage | 1.71 V to 3.6 V - compatible with single-cell Li-ion, 3.3 V rail, and wide-input DC-DC converters in battery-powered and mains-connected systems. |
Pinout & Package
Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VSS, VSSA | Power and ground rails | Separate digital/analog supplies enable noise isolation; VDDA must track VDD within ±0.1 V for ADC/DAC accuracy. |
| PTA0–PTA31, PTB0–PTB19, etc. | GPIO with multiplexed peripheral functions | Each port pin supports up to 8 alternate functions (e.g., UART0_TX, ADC0_SE4a, TPM0_CH0); configurable pull-up/down and slew rate. |
| EXTAL/XTAL, EXTAL32/XTAL32 | Crystal oscillator inputs | Supports main 3–32 MHz crystal and 32.768 kHz RTC crystal - required for precise timing, USB clock recovery, and low-power wake-up. |
| USB_DP/USB_DM | USB 2.0 full-/low-speed differential pair | Integrated transceiver eliminates external PHY; requires 1.5 kΩ pull-up on DP for full-speed enumeration. |
| CAN0_TX/CAN0_RX, CAN1_TX/CAN1_RX | CAN 2.0B interface pins | Direct connection to isolated CAN transceivers; supports bit rates up to 1 Mbps with programmable timing quanta. |
Key Features
| Feature | Design Value |
|---|---|
| Low-power modes | Seven power modes including VLLS1/VLLS2/VLLS3 (sub-10 µA stop currents) - enables battery life extension in always-on sensor nodes and energy harvesting systems. |
| FlexBus interface | External 16-bit parallel bus with wait-state control - supports NOR flash, SRAM, and FPGA glue logic for memory expansion beyond on-chip limits. |
| Hardware CRC module | Configurable 16-/32-bit CRC engine with polynomial preset - accelerates firmware integrity checks and communication frame validation without CPU load. |
| TSI touch interface | Capacitive touch sensing on up to 16 channels with automatic calibration - enables robust human-machine interface on control panels without external ICs. |
| Memory protection unit (MPU) | 8-region MPU with multi-master access control - enforces privilege separation between RTOS tasks and prevents accidental memory corruption. |
Applications
| Industrial Motor Control | Automotive Body Control Module |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC compressors and industrial pumps. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms using DSP instructions, synchronized PWM generation via TPM modules, and current/voltage feedback acquisition via dual ADCs with PGA. Use Value: Enables sub-microsecond current loop response, reduces external component count by integrating ADCs, DACs, and CAN, and meets ASIL-B functional safety requirements via MPU and watchdog co-verification. |
Use Scenario: Centralized control of door locks, window lifts, lighting, and mirror adjustment in passenger vehicles. IC Role / Device Role / Timing Role: CAN message handling (ISO 11898-1), LIN gateway functionality via UART, secure EEPROM emulation using FlexNVM, and low-power wake-up via TSI or CAN bus activity. Use Value: Integrates dual CAN controllers for body and powertrain networks, supports secure boot via flash protection, and achieves <10 µA sleep current for battery drain compliance over 10-year vehicle lifetime. |
| Medical Infusion Pump | Smart Grid Edge Sensor Node |
Use Scenario: Precision fluid delivery with pressure monitoring, flow sensing, and user interface in portable infusion devices. IC Role / Device Role / Timing Role: High-accuracy analog front-end (dual 16-bit ADCs + PGA) for pressure transducer and motor current measurement, real-time alarm generation via CMP modules, and USB HID interface for configuration and diagnostics. Use Value: Eliminates need for external precision op-amps and ADC drivers; built-in voltage reference ensures stable 12-bit DAC output for pump actuator control; USB OTG enables field firmware updates without proprietary tools. |
Use Scenario: Distributed monitoring of transformer temperature, line voltage harmonics, and fault current in medium-voltage substations. IC Role / Device Role / Timing Role: Simultaneous sampling of multiple AC waveforms via dual ADCs with hardware trigger synchronization, FFT computation using DSP instructions, and secure data transmission via CAN or UART-to-LoRaWAN bridge. Use Value: On-chip 16-bit ADCs with PGA allow direct connection to CT/PT sensors; 128 KB RAM holds multi-cycle waveform buffers; extended temperature rating ensures reliability in uncooled outdoor enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MKE15Z64VLD4 | ARM Cortex-M0+, 64 KB flash, 8 KB RAM, 48 MHz max - lower performance, no DSP, no CAN FD, no USB. | Suitable for cost-sensitive, low-complexity control (e.g., simple lighting, fan speed) but lacks motor control peripherals and CAN 2.0B. | Select when BOM cost is primary constraint and 100 MHz performance, dual ADCs, or USB are unnecessary. |
| MIMXRT1021DAG5A | ARM Cortex-M7, 528 MHz, 256 KB SRAM, no on-chip flash - higher performance, external QSPI flash required, no integrated CAN transceivers. | Targeted at HMI-rich edge AI inference or advanced protocol stacks (e.g., EtherCAT, OPC UA), not drop-in replacement for legacy K20-based designs. | Choose only for new designs requiring >1000 DMIPS or advanced graphics; not suitable for pin- or code-compatible upgrade of MK20DN512ZAB10R. |
Compared with MK20DN512ZAB10R, MKE15Z64VLD4 offers lower cost and power but sacrifices DSP capability, CAN, and USB - making it unsuitable for complex real-time control. MIMXRT1021DAG5A provides vastly higher compute throughput but requires redesign of power, clock, memory, and peripheral layout - eliminating drop-in feasibility.
Availability
MK20DN512ZAB10R is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, and medical infusion pump designs requiring stable component supply across long product lifecycles.
Supply support for MK20DN512ZAB10R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based microcontrollers and edge processing.
The Kinetis K20 family, including MK20DN512ZAB10R, was engineered for high-integration embedded control in harsh environments - emphasizing mixed-signal precision, real-time responsiveness, and extended temperature reliability for industrial and transportation systems.
FAQ
What is the maximum operating frequency of the MK20DN512ZAB10R?
The MK20DN512ZAB10R operates at up to 100 MHz using its ARM Cortex-M4 core with DSP extension. This frequency is achievable with proper decoupling, stable 3.3 V supply, and correct clock configuration (e.g., MCG in FEE mode). At this speed, the MK20DN512ZAB10R delivers 125 DMIPS and supports real-time control loops with sub-microsecond interrupt latency.
Does the MK20DN512ZAB10R include USB functionality?
Yes, the MK20DN512ZAB10R integrates a full-/low-speed USB On-The-Go controller with an on-chip transceiver. It supports USB 2.0 compliance, device/host/OTG roles, and requires only external 1.5 kΩ pull-up on USB_DP for full-speed enumeration. No external PHY is needed, reducing BOM count and PCB area for the MK20DN512ZAB10R design.
What analog peripherals are integrated into the MK20DN512ZAB10R?
The MK20DN512ZAB10R integrates two independent 16-bit SAR ADCs, each with a programmable gain amplifier (PGA) supporting gains from ×1 to ×64; three analog comparators (each with a 6-bit DAC and programmable reference); two 12-bit DACs; and a precision voltage reference module. These enable direct high-fidelity analog signal acquisition and conditioning without external signal-chain components in the MK20DN512ZAB10R application.
Is the MK20DN512ZAB10R qualified for automotive applications?
The MK20DN512ZAB10R is specified for –40°C to +105°C ambient operation and includes automotive-grade features such as dual CAN 2.0B controllers, hardware CRC, memory protection unit (MPU), and robust ESD ratings (±2 kV HBM). While not AEC-Q100 certified out-of-box, it is widely deployed in automotive body control modules and infotainment gateways where system-level qualification is performed - confirming suitability for non-safety-critical automotive use cases of the MK20DN512ZAB10R.
What package type does the MK20DN512ZAB10R use?
The MK20DN512ZAB10R uses a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch), designated by the "LQ" suffix in its part number. This package supports standard surface-mount assembly, offers excellent thermal dissipation for industrial environments, and provides full access to all GPIO, peripheral, and power pins required for complex embedded designs using the MK20DN512ZAB10R.
MK20DN512ZAB10R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 120-UFBGA, WLCSP
- Series:
- Kinetis K20
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 79
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK20DN512ZAB10R FAQ
1.How can I place an order for MK20DN512ZAB10R through Aetrix?
Please submit a Request for Quotation (RFQ) for MK20DN512ZAB10R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK20DN512ZAB10R reliable?
The price and inventory of MK20DN512ZAB10R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK20DN512ZAB10R is usually 5 days.
3.What payment methods are accepted for MK20DN512ZAB10R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK20DN512ZAB10R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK20DN512ZAB10R?
MK20DN512ZAB10R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK20DN512ZAB10R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK20DN512ZAB10R?
For technical support, including MK20DN512ZAB10R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK20DN512ZAB10R requirements.
6.How does Aetrix verify that MK20DN512ZAB10R is sourced from the original manufacturer or authorized distributors?
All MK20DN512ZAB10R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK20DN512ZAB10R meets industry standards.
7.What is the process for return or replacement of MK20DN512ZAB10R?
All MK20DN512ZAB10R units undergo pre-shipment inspection (PSI). If there is an issue with MK20DN512ZAB10R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK20DN512ZAB10R part is unused and in its original packaging.
Return procedure for MK20DN512ZAB10R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MK20DN512ZAB10R Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

