NXP Semiconductors MK20DN512ZVMC10
- Part No.:
- MK20DN512ZVMC10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 121-LFBGA
- Datasheet:
-
MK20DN512ZVMC10.pdf
- Description:
- IC MCU 32B 512KB FLASH 121MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,414
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MK20DN512ZVMC10 from NXP (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, operating at up to 100 MHz, featuring 512 KB on-chip flash memory, 128 KB RAM, and integrated analog peripherals including dual 16-bit SAR ADCs and two 12-bit DACs. It targets industrial control, motor drive, and sensor fusion applications requiring deterministic real-time response and mixed-signal integration.
For engineers reviewing the MK20DN512ZVMC10 datasheet, MK20DN512ZVMC10 pinout, MK20DN512ZVMC10 application, or MK20DN512ZVMC10 equivalent, key selection considerations include its -40°C to +105°C extended temperature grade, dual CAN 2.0B interfaces, USB On-The-Go support, FlexBus external interface, and low-power stop modes down to 2.1 µA in VLLS1 mode.
Technical Context
This MCU implements an ARM Cortex-M4 core with hardware-accelerated DSP instructions and a Memory Protection Unit (MPU) supporting multi-master protection. Its clock system includes a 3–32 MHz main crystal oscillator, 32 kHz RTC oscillator, and a multi-purpose clock generator enabling flexible frequency synthesis across power modes.
The peripheral set integrates eight-channel PWM/motor control timers, two quadrature decoder timers, real-time clock, carrier modulator transmitter, and six UARTs - all synchronized to a common bus architecture with 16-channel DMA supporting up to 63 request sources for efficient data movement without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M4 with DSP, no FPU - delivers 1.25 DMIPS/MHz for deterministic signal processing |
| Max Clock Frequency | 100 MHz - enables sub-microsecond interrupt latency and high-throughput peripheral handling |
| Flash Memory | 512 KB program flash - sufficient for complex firmware with bootloader, OTA update partition, and safety-critical code separation |
| RAM | 128 KB SRAM - supports large buffers for communication stacks (USB, CAN FD), FFT operations, and real-time OS tasks |
| Operating Voltage | 1.71–3.6 V - compatible with single-cell Li-ion, 3.3 V logic rails, and industrial 24 V systems via local regulation |
| Temperature Range | -40°C to +105°C - qualified for under-hood automotive, factory automation, and outdoor embedded equipment |
| Analog Peripherals | Dual 16-bit SAR ADCs with PGA (x64), two 12-bit DACs, three analog comparators - enables closed-loop analog sensing and actuation without external signal conditioning |
| Communication Interfaces | 2× CAN 2.0B, 6× UART, 3× SPI, 2× I²C, USB OTG, SDHC, I²S - supports multi-protocol industrial networking and human-machine interface connectivity |
Pinout & Package
Package: 121-pin MAPBGA (8 mm × 8 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VSS, VSSA | Power and ground domains | Separate digital/analog supplies enable noise isolation; VDDA must track VDD within ±0.1 V for ADC/DAC accuracy |
| EXTAL/XTAL | Main crystal oscillator input/output | Supports 3–32 MHz crystals; required for high-precision timing, USB clock derivation, and system boot stability |
| EXTAL32/XTAL32 | 32 kHz RTC oscillator input/output | Enables battery-backed real-time clock operation with <2 ppm drift over temperature |
| PTA0–PTA31, PTB0–PTB17, etc. | GPIO multiplexed signals | Each port pin supports multiple functions (UART, SPI, ADC, PWM); configured via PORTx_PCRn registers with slew rate and drive strength control |
| USB_DP/USB_DM | USB 2.0 full/low-speed differential pair | Integrated transceiver eliminates external PHY; requires 1.5 kΩ pull-up on DP for device enumeration |
| CAN0_TX/CAN0_RX, CAN1_TX/CAN1_RX | CAN 2.0B controller I/O | Direct connection to external CAN transceivers; supports bit rates up to 1 Mbps with programmable timing quanta |
Key Features
| Feature | Design Value |
|---|---|
| Low-power stop modes | VLLS1 mode draws only 2.1 µA at 3.0 V, retaining RAM and wake-up on GPIO/RTC - ideal for battery-powered remote sensors |
| FlexBus external interface | 8/16-bit parallel bus supporting SRAM, NOR flash, and FPGA glueless interfacing with configurable wait states and burst capability |
| Hardware CRC module | Performs IEEE-802.3 CRC-32 in one clock cycle per 32-bit word - accelerates firmware integrity checks and communication frame validation |
| TSI touch sensing interface | Capacitive touch sensing on up to 16 channels with automatic calibration and noise immunity - enables robust HMI without external controllers |
| Programmable gain amplifier (PGA) | Integrated x1–x64 gain stages per ADC channel eliminate need for external op-amp signal conditioning in precision sensor front-ends |
| 128-bit unique chip ID | Factory-programmed serial number used for secure device authentication, license binding, and field firmware traceability |
Applications
| Industrial Motor Control | Automotive Body Electronics |
|---|---|
Use Scenario: Closed-loop control of BLDC motors in HVAC blowers and pump drives using space-vector PWM and current feedback. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms, synchronized ADC sampling of phase currents, and generation of 8-channel complementary PWM outputs with dead-time insertion. Use Value: Integrated 16-bit ADCs with PGA and motor timer with quadrature decoding reduce BOM count by eliminating external current sense amplifiers and dedicated motor control ICs. | Use Scenario: Central body controller managing door locks, window lifts, mirror adjustment, and lighting via CAN and LIN networks. IC Role / Device Role / Timing Role: Dual CAN 2.0B interfaces handle high-priority chassis messaging and diagnostics; six UARTs support legacy LIN gatewaying and debug interfaces. Use Value: Extended -40°C to +105°C operation ensures reliability in engine bay proximity; hardware CRC accelerates ECU-to-ECU message authentication per ISO 14229. |
| Smart Energy Metering | Medical Sensor Hub |
Use Scenario: Polyphase electricity meter with harmonic analysis, tamper detection, and secure data logging via SDHC and USB. IC Role / Device Role / Timing Role: Simultaneous sampling of voltage/current channels via dual ADCs; real-time clock with battery backup maintains time stamping during mains failure. Use Value: 512 KB flash stores metrology firmware, encryption keys, and 30-day waveform logs; VBAT retention allows uninterrupted RTC and register file operation during power loss. | Use Scenario: Portable patient monitor aggregating ECG, SpO₂, and temperature data with Bluetooth LE host interface. IC Role / Device Role / Timing Role: Low-noise analog front-end digitizes biopotential signals; USB OTG enables clinical firmware updates and data export; TSI supports touch-based UI navigation. Use Value: 128 KB RAM accommodates BLE stack, signal processing buffers, and display frame buffer; VLLS2 mode extends battery life to >72 hours between charges. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| K20DX256ZVMC10 | 256 KB flash, 64 KB RAM, same package and pinout - reduced memory footprint with identical peripheral set and clock architecture | Suitable for cost-sensitive designs where firmware size <200 KB and RAM usage <50 KB | Select when memory headroom is not required and BOM cost reduction is prioritized over future firmware scalability |
| KEA128M64S2VFM | Cortex-M0+ core, 64 KB flash, 8 KB RAM, 48-pin QFN - lower performance, simplified peripheral set (no USB, single CAN), but superior ultra-low-power metrics (1.2 µA VLLS0) | Better fit for simple sensor nodes or actuator controllers without complex protocol stacks or rich HMI | Choose for battery-operated endpoints where 100 MHz performance and dual CAN are unnecessary, and sub-2 µA sleep current is mandatory |
Compared with MK20DN512ZVMC10, K20DX256ZVMC10 offers identical feature parity at lower memory density, while KEA128M64S2VFM trades performance and interface breadth for extreme energy efficiency - making the MK20DN512ZVMC10 optimal for applications demanding both computational headroom and industrial-grade connectivity.
Availability
MK20DN512ZVMC10 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, smart energy metering, and medical sensor hub applications requiring stable component supply, long-term lifecycle assurance, and extended temperature operation.
Supply support for MK20DN512ZVMC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, and mobile applications, with deep expertise in ARM-based microcontrollers and edge processing.
The Kinetis K20 series was designed specifically for cost-sensitive, high-reliability embedded systems requiring real-time responsiveness, mixed-signal integration, and scalable low-power operation across extended industrial temperature ranges - exemplified by the MK20DN512ZVMC10.
FAQ
What is the maximum operating frequency of the MK20DN512ZVMC10?
The MK20DN512ZVMC10 operates at a maximum core frequency of 100 MHz, achieved using the internal PLL with a 3–32 MHz crystal input. This frequency is supported across the full -40°C to +105°C ambient temperature range and 1.71–3.6 V supply voltage, with timing verified per the K20P121M100SF2 datasheet Rev. 7.
Does the MK20DN512ZVMC10 include a hardware floating-point unit (FPU)?
No, the MK20DN512ZVMC10 does not include a hardware FPU. It features an ARM Cortex-M4 core with DSP instruction extensions only. The 'D' in the part number denotes DSP capability, while 'F' would indicate FPU inclusion - confirmed by the K20 Sub-Family Data Sheet and MK20DN512ZVMC10 ordering information.
What package type and pin count does the MK20DN512ZVMC10 use?
The MK20DN512ZVMC10 uses a 121-pin MAPBGA package (8 mm × 8 mm, 0.8 mm pitch), identified by the 'MC' package code in its part number. This is confirmed in Section 2.3 of the K20 Sub-Family Data Sheet and matches the 'MC' field definition for 121 MAPBGA.
Can the MK20DN512ZVMC10 operate from a single 3.3 V supply?
Yes, the MK20DN512ZVMC10 supports 3.3 V operation across its full specification: VDD and VDDA ranges are 1.71–3.6 V, and all DC electrical characteristics (IOH, VOL, VIH, etc.) are guaranteed at 3.3 V per Table 4 in the K20P121M100SF2 datasheet. No separate analog regulator is required.
How many CAN interfaces does the MK20DN512ZVMC10 support?
The MK20DN512ZVMC10 integrates two independent Controller Area Network (CAN) 2.0B modules, each with full message buffering, acceptance filtering, and bit-rate configuration up to 1 Mbps - explicitly listed under "Communication interfaces" in the K20 Sub-Family Data Sheet.
MK20DN512ZVMC10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 121-LFBGA
- Series:
- Kinetis K20
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 86
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 38x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK20DN512ZVMC10 FAQ
1.How can I place an order for MK20DN512ZVMC10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK20DN512ZVMC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK20DN512ZVMC10 reliable?
The price and inventory of MK20DN512ZVMC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK20DN512ZVMC10 is usually 5 days.
3.What payment methods are accepted for MK20DN512ZVMC10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK20DN512ZVMC10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK20DN512ZVMC10?
MK20DN512ZVMC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK20DN512ZVMC10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK20DN512ZVMC10?
For technical support, including MK20DN512ZVMC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK20DN512ZVMC10 requirements.
6.How does Aetrix verify that MK20DN512ZVMC10 is sourced from the original manufacturer or authorized distributors?
All MK20DN512ZVMC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK20DN512ZVMC10 meets industry standards.
7.What is the process for return or replacement of MK20DN512ZVMC10?
All MK20DN512ZVMC10 units undergo pre-shipment inspection (PSI). If there is an issue with MK20DN512ZVMC10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK20DN512ZVMC10 part is unused and in its original packaging.
Return procedure for MK20DN512ZVMC10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MK20DN512ZVMC10 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

