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NXP Semiconductors MK20DX256VLK10R

Part No.:
MK20DX256VLK10R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
80-LQFP
Datasheet:
AetrixMK20DX256VLK10R.pdf
Description:
IC MCU 32BIT 256KB FLASH 80FQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,000

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Product details

Overview

MK20DX256VLK10R from NXP Semiconductors is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, operating up to 100 MHz, featuring 256 KB on-chip flash memory (FlexMemory enabled), 128 KB RAM, and integrated USB OTG, dual CAN, and dual 16-bit SAR ADCs. It targets industrial control, motor drive, and smart sensor applications requiring deterministic real-time performance and mixed-signal integration.

For engineers reviewing the MK20DX256VLK10R datasheet, MK20DX256VLK10R pinout, MK20DX256VLK10R application, or MK20DX256VLK10R equivalent, key selection criteria include its -40°C to +105°C extended temperature rating, 80-pin LQFP package with 5V-tolerant digital I/O, FlexBus external interface, and hardware CRC module for firmware integrity verification.

Technical Context

The MK20DX256VLK10R implements an ARM Cortex-M4 core with single-cycle DSP instructions and a Memory Protection Unit (MPU) supporting multi-master protection. Its clock system integrates a 3–32 MHz crystal oscillator, 32 kHz RTC oscillator, and Multi-Purpose Clock Generator (MCG) with internal reference and FLL/PLL options.

Peripherals include two independent 16-bit SAR ADCs each with integrated PGA (up to ×64 gain), 12-bit DAC, three analog comparators with embedded 6-bit DACs, eight-channel PWM timer, two quadrature decoder timers, and four UARTs - all operating within the same 1.71–3.6 V supply range and sharing a unified low-power mode architecture including VLLS1–VLLS3 stop modes.

Key Specifications

Parameter Value and Actual Design Meaning
Core ARM Cortex-M4 with DSP extension, 100 MHz max - delivers 125 DMIPS and supports floating-point math via software libraries
Flash / RAM 256 KB FlexMemory flash + 128 KB SRAM - enables in-field reprogramming and data logging without external storage
ADC Dual 16-bit SAR ADCs, each with PGA (×1–×64) - supports high-resolution current sensing and precision analog front-end design
Communication USB Full/Low-Speed OTG, 2× CAN 2.0B, 4× UART, 2× SPI, 2× I²C, SDHC - suitable for industrial fieldbus gateways and automotive diagnostics interfaces
Operating Range -40°C to +105°C ambient, 1.71–3.6 V supply - qualified for under-hood automotive and factory-floor embedded control
Package 80-pin LQFP (12 mm × 12 mm) - provides 59 GPIOs with 5V-tolerant inputs and configurable slew rate/drive strength
Low-Power Modes VLLS1–VLLS3 stop currents as low as 2.1 µA @ 3.0 V - enables battery-backed operation with RTC and wake-on-comparator events

Pinout & Package

Package: 80-pin LQFP (12 mm × 12 mm), RoHS-compliant, moisture sensitivity level 3 (MSL3).

Pin/Terminal Circuit Role Design Meaning
VDD, VDDA, VSS, VSSA Power and ground rails Separate digital/analog supplies enable noise isolation; VDD–VDDA differential ≤ ±0.1 V ensures ADC accuracy
PTA0–PTA31, PTB0–PTB17, PTC0–PTC17, PTD0–PTD7, PTE0–PTE29 General-purpose I/O 59 total GPIOs; most support interrupt, DMA request, and multiple alternate functions (UART, SPI, I²C, etc.)
EXTAL/XTAL, EXTAL32/XTAL32 Clock inputs Supports primary 3–32 MHz crystal and 32.768 kHz RTC crystal - required for precise timing and USB synchronization
USB_DP/USB_DM USB transceiver differential pair On-chip full-speed transceiver eliminates external PHY; requires 1.5 kΩ pull-up on DP for device enumeration
CAN0_TX/CAN0_RX, CAN1_TX/CAN1_RX CAN bus interface signals Dual independent CAN modules compliant with ISO 11898-1; support bit rates up to 1 Mbps with programmable timing

Key Features

Feature Design Value
FlexMemory architecture 256 KB flash partitioned into program and EEPROM-emulated data storage - enables wear-leveling and robust firmware updates
Hardware CRC module Configurable 16-/32-bit CRC engine with polynomial preset - accelerates firmware signature validation and communication packet integrity checks
Low-leakage wakeup unit Enables wake-from-VLLS3 on analog comparator output or TSI touch event - supports ultra-low-power human interface systems
Programmable gain amplifier (PGA) Integrated ×1/×2/×4/×8/×16/×32/×64 gain per ADC channel - eliminates external op-amp stages for sensor signal conditioning
Memory Protection Unit (MPU) 8-region MPU with multi-master access control - enforces privilege separation between RTOS tasks and peripheral drivers

Applications

Industrial Motor Control Automotive Body Control Module

Use Scenario: Closed-loop BLDC motor control with current feedback, position sensing, and CAN-based command interface.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm, synchronized ADC sampling, PWM generation, and CAN message handling.

Use Value: 100 MHz Cortex-M4 core with DSP instructions executes motor control loops in <1 µs; dual ADCs sample phase currents simultaneously.

Use Scenario: Centralized lighting, window lift, and door lock control with LIN/CAN gateway functionality.

IC Role / Device Role / Timing Role: System controller managing power sequencing, fault monitoring, and multi-protocol communication stack.

Use Value: Dual CAN modules handle chassis and infotainment networks; 128 KB RAM supports AUTOSAR OS and diagnostic services (UDS).

Smart Sensor Node Medical Infusion Pump

Use Scenario: Battery-powered environmental sensor node with temperature/humidity/pressure sensing and BLE gateway interface.

IC Role / Device Role / Timing Role: Analog signal acquisition, sensor fusion, low-power scheduling, and USB/UART host interface.

Use Value: VLLS3 stop mode draws only 2.1 µA; integrated PGA and 16-bit ADC resolve sub-millivolt sensor outputs without external amplification.

Use Scenario: Precision fluid delivery system requiring motor control, pressure monitoring, safety interlocks, and HMI.

IC Role / Device Role / Timing Role: Safety-critical controller executing FDA-compliant pump logic with watchdog supervision and redundant ADC sampling.

Use Value: Hardware CRC validates firmware integrity; MPU isolates safety monitor task; dual 16-bit ADCs cross-check pressure transducer readings.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MK20DN512VLK10 512 KB flash, no FlexMemory; identical pinout, peripherals, and clock architecture Better suited for complex protocol stacks (e.g., TCP/IP + USB + CAN) requiring larger code space Select when >256 KB flash is needed and EEPROM emulation is not required
MK22FN512VLH12 ARM Cortex-M4F (FPU), 120 MHz, 512 KB flash, 128 KB RAM, 100-pin LQFP Higher performance and floating-point capability; larger package limits board density Choose for computationally intensive tasks (e.g., real-time FFT, sensor fusion) where FPU acceleration justifies footprint increase

Compared with MK20DX256VLK10R, MK20DN512VLK10 offers double flash capacity without FlexMemory, while MK22FN512VLH12 adds FPU and higher clock speed at the cost of larger package and different pin count - making MK20DX256VLK10R optimal for cost-sensitive, mixed-signal applications needing EEPROM-like data retention in constrained layouts.

Availability

MK20DX256VLK10R is available at Aetrix Electronics and suitable for industrial motor drives, automotive body electronics, and medical infusion pumps requiring stable component supply across extended temperature and long product lifecycles.

Supply support for MK20DX256VLK10R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.

The MK20DX256VLK10R belongs to the Kinetis K20 family, designed specifically for cost-optimized, real-time embedded applications demanding integrated analog peripherals, robust communication interfaces, and scalable low-power operation.

FAQ

What is the maximum operating frequency and core type of the MK20DX256VLK10R?

The MK20DX256VLK10R features an ARM Cortex-M4 core with DSP extensions, rated for operation up to 100 MHz. This delivers 1.25 Dhrystone MIPS per MHz and supports single-cycle multiply-accumulate (MAC) operations essential for motor control and digital filtering. The MK20DX256VLK10R achieves this frequency using its internal MCG clock generator with external crystal or internal reference sources.

Does the MK20DX256VLK10R support USB device functionality without external components?

Yes, the MK20DX256VLK10R integrates a full-speed USB 2.0 On-The-Go controller with an on-chip transceiver. It requires only a 1.5 kΩ pull-up resistor on the USB_DP line for device enumeration and standard USB termination; no external PHY or level-shifting circuitry is needed. The MK20DX256VLK10R supports CDC, HID, and MSC class drivers out of the box via NXP's KSDK middleware.

What analog peripherals are integrated into the MK20DX256VLK10R?

The MK20DX256VLK10R integrates two independent 16-bit SAR ADCs, each with a programmable gain amplifier (PGA) offering gains from ×1 to ×64, a 12-bit DAC, three analog comparators (each with a built-in 6-bit DAC and programmable reference), two transimpedance amplifiers, and a precision voltage reference. These enable high-fidelity sensor interfacing - such as current shunt measurement or capacitive touch - directly within the MK20DX256VLK10R without external signal conditioning.

Is the MK20DX256VLK10R qualified for automotive or industrial temperature ranges?

Yes, the MK20DX256VLK10R is specified for operation from -40°C to +105°C ambient temperature and is qualified to industrial and automotive AEC-Q100 stress test standards. Its thermal resistance (RθJC) is 9°C/W in the 80-pin LQFP package, and it supports robust power management across all operating modes - making the MK20DX256VLK10R suitable for under-hood automotive ECUs and factory automation controllers.

How does the FlexMemory feature work in the MK20DX256VLK10R?

The MK20DX256VLK10R implements FlexMemory, allowing dynamic partitioning of its 256 KB flash into program code and EEPROM-emulated data storage. Users configure sectors for data retention with wear-leveling via NXP's FlexNVM driver library. Unlike traditional EEPROM, FlexMemory retains data across power cycles without external components - enabling reliable parameter storage and firmware update staging within the MK20DX256VLK10R itself.

MK20DX256VLK10R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
80-LQFP
Series:
Kinetis K20
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
52
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 27x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MK20DX256VLK10R FAQ

1.How can I place an order for MK20DX256VLK10R through Aetrix?

Please submit a Request for Quotation (RFQ) for MK20DX256VLK10R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MK20DX256VLK10R reliable?

The price and inventory of MK20DX256VLK10R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK20DX256VLK10R is usually 5 days.

3.What payment methods are accepted for MK20DX256VLK10R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK20DX256VLK10R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MK20DX256VLK10R?

MK20DX256VLK10R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MK20DX256VLK10R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MK20DX256VLK10R?

For technical support, including MK20DX256VLK10R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK20DX256VLK10R requirements.

6.How does Aetrix verify that MK20DX256VLK10R is sourced from the original manufacturer or authorized distributors?

All MK20DX256VLK10R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK20DX256VLK10R meets industry standards.

7.What is the process for return or replacement of MK20DX256VLK10R?

All MK20DX256VLK10R units undergo pre-shipment inspection (PSI). If there is an issue with MK20DX256VLK10R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MK20DX256VLK10R part is unused and in its original packaging.

Return procedure for MK20DX256VLK10R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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