NXP Semiconductors MK20DX256VMC10
- Part No.:
- MK20DX256VMC10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 121-LFBGA
- Datasheet:
-
MK20DX256VMC10.pdf
- Description:
- IC MCU 32B 256KB FLASH 121MAPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MK20DX256VMC10 from NXP (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, operating up to 100 MHz, featuring 256 KB on-chip flash, 64 KB RAM, dual 16-bit SAR ADCs with integrated PGA, USB OTG, two CAN interfaces, and low-power operation from –40°C to 105°C. It targets industrial control, motor drive, and sensor fusion applications requiring deterministic real-time response and mixed-signal integration.
For engineers reviewing the MK20DX256VMC10 datasheet, MK20DX256VMC10 pinout, MK20DX256VMC10 application, or MK20DX256VMC10 equivalent, key selection considerations include its 100 MHz Cortex-M4 core with hardware DSP, FlexBus external memory interface, 121-pin MAPBGA package, VLLS3 stop-mode current of ≤23 µA at 3.0 V, and dual ADC support with programmable gain up to ×64.
Technical Context
The MK20DX256VMC10 implements an ARM Cortex-M4 core with single-cycle MAC and SIMD instructions, paired with a multi-purpose clock generator supporting crystal oscillators (3–32 MHz and 32 kHz), internal reference, and PLL-based frequency synthesis. Its memory subsystem includes 256 KB program flash with error correction, 64 KB SRAM, and EzPort serial programming interface.
Peripherals are organized into low-power domains: two independent 16-bit SAR ADCs each with PGA and 6-bit DAC reference, eight-channel PWM timer with motor control features, two quadrature decoder timers, RTC with battery backup, and communication stacks including USB full/low-speed OTG, dual CAN 2.0B controllers, five UARTs, three SPIs, two I²Cs, SDHC, and I²S - all accessible via configurable pin multiplexing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4 with DSP extensions, 100 MHz max - enables real-time signal processing in motor control and audio applications |
| Flash Memory | 256 KB program flash with ECC - supports robust firmware storage and over-the-air updates with integrity checking |
| RAM | 64 KB SRAM - sufficient for RTOS, protocol stacks, and intermediate data buffers in connected industrial devices |
| ADC | Dual 16-bit SAR ADCs, each with integrated PGA (gain up to ×64) - allows direct high-resolution sensing of low-amplitude analog signals without external amplification |
| Operating Voltage | 1.71–3.6 V - compatible with single Li-ion, 3.3 V, or 2.5 V system rails without level-shifting |
| Temperature Range | –40°C to +105°C - qualified for under-hood automotive, factory automation, and outdoor embedded systems |
| USB Interface | Full-/low-speed USB On-The-Go with on-chip transceiver - enables host/peripheral mode switching without external PHY |
| Low-Power Modes | VLLS1/VLLS2/VLLS3 stop modes with ≤23 µA current (VLLS3 @ 3.0 V) - extends battery life in always-on sensor nodes and portable diagnostics tools |
Pinout & Package
Package: 121-pin MAPBGA (8 mm × 8 mm, 0.8 mm pitch, MC suffix). Pin assignments follow K20 Sub-Family pinout mapping with 100+ configurable GPIOs, multiple peripheral function overlays, and dedicated power/ground ball layout per JEDEC MO-277.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VREFH, VREFL | Analog/digital supply and reference inputs | Separate 1.71–3.6 V supplies for digital core, analog subsystem, and ADC reference - enable noise isolation and precision measurement |
| PTA0–PTA31, PTB0–PTB19, etc. | Multi-function GPIO banks | Up to 100+ pins support programmable slew rate, drive strength, pull-up/down, and digital filtering - critical for EMI control and signal integrity in noisy environments |
| EXTAL/XTAL, EXTAL32/XTAL32 | Primary and 32 kHz crystal oscillator inputs | Supports precise timing for USB, RTC, and synchronous comms; 32 kHz crystal enables sub-µA real-time clock operation during deep sleep |
| USB_DP/USB_DM | Integrated USB transceiver differential pair | On-die full-speed transceiver eliminates need for external PHY - reduces BOM count and PCB area in compact USB device designs |
| CAN0_TX/CAN0_RX, CAN1_TX/CAN1_RX | Dual CAN 2.0B controller I/O | Independent CAN interfaces with message buffers and FIFOs - suitable for distributed control networks in industrial machinery and vehicle subsystems |
Key Features
| Feature | Design Value |
|---|---|
| Hardware CRC module | Accelerates checksum computation for firmware validation and communication frame integrity - reduces CPU load by >95% vs. software CRC |
| Memory Protection Unit (MPU) | Enforces privilege levels and memory region access rules - essential for safe execution of certified safety firmware (IEC 61508 SIL2) |
| Programmable Delay Block (PDB) | Provides precise, jitter-free triggering of ADC conversions and PWM events - enables synchronized sampling in motor phase current monitoring |
| Low-Leakage Wakeup Unit (LLWU) | Allows selective wake-from-VLLS on external pins, RTC alarm, or analog comparator output - minimizes wake latency while preserving ultra-low standby current |
| FlexBus external bus interface | 8/16-bit parallel interface supporting SRAM, NOR flash, and peripherals - enables expansion of code/data space beyond on-chip limits in HMI and gateway applications |
Applications
| Industrial Motor Control | Automotive Body Electronics |
|---|---|
Use Scenario: Closed-loop control of BLDC motors in HVAC blowers and pump drives using field-oriented control (FOC). IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm, synchronized ADC sampling of phase currents, and generation of six-step PWM outputs with dead-time insertion. Use Value: Dual 16-bit ADCs with PGA allow direct shunt-based current sensing; 100 MHz Cortex-M4 delivers <1 µs interrupt latency for torque ripple suppression. | Use Scenario: Central body controller managing door locks, lighting, window lifts, and mirror adjustment in entry-level vehicles. IC Role / Device Role / Timing Role: CAN node interfacing with LIN sub-nodes and sensor clusters; executes diagnostic services (UDS) and secure boot verification. Use Value: Dual CAN controllers support redundancy and gateway functions; 105°C rating ensures reliability in cabin-temperature zones near HVAC ducts. |
| Portable Medical Instrumentation | Smart Grid Sensor Node |
Use Scenario: Battery-powered handheld ECG monitor acquiring analog biopotentials and performing real-time QRS detection. IC Role / Device Role / Timing Role: Analog front-end controller with simultaneous dual-channel ADC sampling, digital filtering, and Bluetooth LE data streaming. Use Value: Integrated PGA eliminates external op-amps; VLLS3 mode draws ≤23 µA - enabling >1-year battery life on coin cell with periodic acquisition. | Use Scenario: DIN-rail mounted transformer monitoring unit measuring voltage, current, and temperature for predictive maintenance alerts. IC Role / Device Role / Timing Role: Data concentrator aggregating Modbus RTU over RS-485, performing RMS calculations, and reporting via cellular modem. Use Value: FlexBus interface connects to external 1 MB NOR flash for firmware and log storage; SDHC supports removable microSD for field calibration data export. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| K20DN512VLL10 | 512 KB flash, 128 KB RAM, 100-pin LQFP package - larger memory but no FlexBus, different pinout and thermal profile | Better suited for complex protocol stacks (e.g., Ethernet + USB + CAN) where external memory not required | Select when higher code/data footprint is needed and LQFP assembly is preferred over BGA |
| KEA128MT64xxx | Cortex-M0+, 48 MHz, 128 KB flash, 16 KB RAM, 64-pin LQFP - lower performance, no USB OTG or FlexBus, simplified peripheral set | Targeted at cost-sensitive, low-complexity control tasks (e.g., basic lighting control, simple sensors) | Choose for legacy replacement or volume-sensitive designs where 100 MHz DSP capability is unnecessary |
Compared with MK20DX256VMC10, K20DN512VLL10 offers more on-chip memory but lacks FlexBus and uses a larger LQFP package, while KEA128MT64xxx trades performance and feature depth for cost and simplicity - making MK20DX256VMC10 optimal for balanced mixed-signal, connectivity-rich, and low-power industrial edge nodes.
Availability
MK20DX256VMC10 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, and portable medical instrumentation requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MK20DX256VMC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, and mobile applications, with roots in Freescale's Kinetis portfolio.
The MK20DX256VMC10 belongs to the Kinetis K20 family - designed specifically for cost-effective, energy-efficient, mixed-signal microcontroller applications demanding real-time performance, rich analog integration, and broad connectivity in harsh environments.
FAQ
What is the maximum operating frequency of the MK20DX256VMC10?
The MK20DX256VMC10 operates at a maximum CPU frequency of 100 MHz, achieved via its ARM Cortex-M4 core with integrated PLL. This frequency is supported across the full –40°C to +105°C ambient temperature range and 1.71–3.6 V supply voltage, with flash execution optimized using prefetch and cache features. The MK20DX256VMC10 maintains deterministic timing at this speed for real-time control loops and signal processing workloads.
Does the MK20DX256VMC10 support USB device and host functionality?
Yes, the MK20DX256VMC10 integrates a full-/low-speed USB On-The-Go (OTG) controller with an on-chip transceiver, enabling both device and host roles without external PHY components. It supports standard USB classes including CDC, HID, and MSC, and includes dedicated DMA channels and buffer descriptors to offload USB protocol handling from the Cortex-M4 core - a capability confirmed in the K20 Sub-Family Data Sheet Rev. 3 (2013) section 6.8.1.
What analog peripherals are integrated into the MK20DX256VMC10?
The MK20DX256VMC10 integrates two independent 16-bit SAR ADCs, each with a programmable gain amplifier (PGA) offering gains up to ×64, a 12-bit DAC, three analog comparators (each with a 6-bit DAC and programmable reference), two transimpedance amplifiers, and a precision voltage reference. These are documented in the K20 Sub-Family Data Sheet sections 6.6.1–6.6.4 and enable high-fidelity sensor interfacing, closed-loop analog control, and self-calibration routines within the MK20DX256VMC10.
What low-power modes does the MK20DX256VMC10 support, and what is its lowest active current?
The MK20DX256VMC10 supports seven low-power modes, including RUN, WAIT, VLPR, STOP, VLPS, LLS, and VLLS variants. Its lowest active current is 1.12 mA in Very-Low-Power Run (VLPR) mode at 3.0 V with all peripheral clocks disabled. In deepest sleep, VLLS3 mode draws ≤23 µA at 3.0 V (–40°C to 25°C), retaining RAM and selected registers - values verified in Table 6 of the K20 Sub-Family Data Sheet Rev. 3.
Is the MK20DX256VMC10 pin-compatible with other K20 family members?
No, the MK20DX256VMC10 is not pin-compatible with other K20 variants due to its 121-pin MAPBGA (MC) package - distinct from LQFP (LF/LH/LK/LL) and smaller BGA (MP) packages used by MK20DN512VLL10, MK20DX128VLH7, or MK20DX64VLH4. Pin assignments, power ball layout, and thermal pad configuration are unique to the MC package; migration requires PCB redesign. This is confirmed by package identifier "MC" in the part number and Figure 8-2 of the K20 Sub-Family Data Sheet.
MK20DX256VMC10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 121-LFBGA
- Series:
- Kinetis K20
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 70
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 38x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK20DX256VMC10 FAQ
1.How can I place an order for MK20DX256VMC10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK20DX256VMC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK20DX256VMC10 reliable?
The price and inventory of MK20DX256VMC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK20DX256VMC10 is usually 5 days.
3.What payment methods are accepted for MK20DX256VMC10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK20DX256VMC10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK20DX256VMC10?
MK20DX256VMC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK20DX256VMC10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK20DX256VMC10?
For technical support, including MK20DX256VMC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK20DX256VMC10 requirements.
6.How does Aetrix verify that MK20DX256VMC10 is sourced from the original manufacturer or authorized distributors?
All MK20DX256VMC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK20DX256VMC10 meets industry standards.
7.What is the process for return or replacement of MK20DX256VMC10?
All MK20DX256VMC10 units undergo pre-shipment inspection (PSI). If there is an issue with MK20DX256VMC10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK20DX256VMC10 part is unused and in its original packaging.
Return procedure for MK20DX256VMC10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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