NXP Semiconductors MK20DX256ZVLK10
- Part No.:
- MK20DX256ZVLK10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
MK20DX256ZVLK10.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 80FQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,240
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MK20DX256ZVLK10 from NXP (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, operating at up to 100 MHz, featuring 256 KB on-chip flash memory and 128 KB RAM in an 80-pin LQFP package. It integrates dual 16-bit SAR ADCs, two 12-bit DACs, three analog comparators, USB OTG, dual CAN, six UARTs, and supports industrial temperature range (–40 to 105°C) for embedded control applications.
For engineers reviewing the MK20DX256ZVLK10 datasheet, MK20DX256ZVLK10 pinout, MK20DX256ZVLK10 application, or MK20DX256ZVLK10 equivalent, key selection considerations include its FlexMemory architecture (256 KB flash + 4 KB FlexRAM), low-power stop modes down to 2.1 µA, integrated TSI touch interface, and dual CAN bus support for automotive and industrial networking.
Technical Context
The MK20DX256ZVLK10 implements the ARMv7E-M architecture with hardware floating-point unit disabled (M4 core only), uses a multi-purpose clock generator supporting crystal oscillators (3–32 MHz and 32 kHz), and features a memory protection unit (MPU) with multi-master protection for secure real-time execution. Its FlexBus external interface enables parallel memory expansion while EzPort supports serial programming.
System-level power management includes eight low-power modes (VLPR, VLPW, LLS, VLLS1–4), a software watchdog, external watchdog monitor, and low-leakage wakeup unit. Peripheral integration centers on deterministic timing: eight-channel PWM timer, two quadrature decoder timers, RTC with battery backup, and carrier modulator transmitter for IR control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4 @ 100 MHz - delivers 125 DMIPS and supports DSP instructions for motor control and signal processing |
| Flash Memory | 256 KB program flash + 4 KB FlexRAM - enables runtime reconfiguration of data/program partitioning without external EEPROM |
| RAM | 128 KB SRAM - sufficient for real-time OS stacks, communication buffers, and algorithm working memory |
| Analog Peripherals | Dual 16-bit SAR ADCs with PGA (x64 gain), two 12-bit DACs, three CMPs with 6-bit DACs - supports closed-loop analog sensing and actuation |
| Communication | USB Full/Low-Speed OTG, dual CAN 2.0B, six UARTs, three SPIs, two I²Cs, SDHC, I²S - meets mixed-protocol industrial gateway requirements |
| Operating Range | 1.71–3.6 V supply, –40 to 105°C ambient - qualified for under-hood automotive and factory-floor industrial use |
| Low-Power Modes | VLLS1 current = 2.1 µA @ –40 to 25°C - enables battery-powered operation for >10 years in sensor node applications |
Pinout & Package
Package: 80-pin LQFP (12 mm × 12 mm), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VSS, VSSA | Power and ground rails | Separate digital/analog supplies reduce noise coupling; VDDA must track VDD within ±0.1 V for ADC/DAC accuracy |
| EXTAL/XTAL, EXTAL32/XTAL32 | Crystal oscillator inputs | Supports primary 3–32 MHz system clock and independent 32 kHz RTC clock - enables simultaneous high-speed operation and ultra-low-power timekeeping |
| USB_DP/USB_DM | USB differential data lines | On-chip transceiver eliminates external PHY; requires 1.5 kΩ pull-up on DP for full-speed enumeration |
| CAN0_TX/CAN0_RX, CAN1_TX/CAN1_RX | CAN bus interface pins | Dual isolated CAN controllers support redundant networks or multi-bus diagnostics without external CAN transceivers |
| TSI_CH0–TSI_CH15 | Touch sense input channels | Hardware-accelerated capacitive touch sensing across 16 channels - enables robust HMI with <1 µA active current per channel |
Key Features
| Feature | Design Value |
|---|---|
| FlexMemory architecture | 256 KB flash + 4 KB FlexRAM allows dynamic allocation of nonvolatile storage for data logging or firmware updates without external memory |
| Low-leakage wakeup unit | Enables wake-from-VLLS3 in ≤96 µs using GPIO, RTC alarm, or analog comparator event - critical for responsive battery-powered systems |
| Programmable gain amplifier (PGA) | Integrated x1–x64 gain per ADC channel eliminates external op-amp stages for sensor signal conditioning |
| Multi-mode clock generation | Includes FLL, PLL, and internal 32 kHz LPO - provides fail-safe clock redundancy and seamless transition between high-performance and ultra-low-power modes |
| Hardware CRC module | Accelerates checksum calculation for firmware integrity verification and communication packet validation at line rate |
Applications
| Industrial Motor Control | Automotive Body Controller |
|---|---|
Use Scenario: Closed-loop control of BLDC motors in HVAC actuators and pump drives using field-oriented control (FOC). IC Role / Device Role / Timing Role: Primary MCU executing FOC algorithms, sampling dual ADCs synchronously, generating PWM outputs with dead-time insertion, and communicating via CAN. Use Value: Integrated 100 MHz M4 core with DSP instructions achieves sub-1 µs interrupt latency; dual 16-bit ADCs sample current/voltage simultaneously at 1 MSPS for precise torque regulation. | Use Scenario: Central body control module managing door locks, lighting, window lifts, and mirror adjustment in passenger vehicles. IC Role / Device Role / Timing Role: System controller interfacing with LIN slaves, driving relays/LEDs via GPIO, monitoring switches via TSI, and coordinating functions over dual CAN buses. Use Value: Dual CAN controllers enable separation of powertrain and body networks; TSI interface reduces BOM cost by replacing mechanical switches with capacitive touch panels. |
| Smart Energy Meter | Medical Patient Monitor |
Use Scenario: Polyphase electricity meter with harmonic analysis, tamper detection, and secure data logging via SDHC. IC Role / Device Role / Timing Role: Main processor acquiring voltage/current samples via dual ADCs, computing RMS, THD, and energy values, and storing encrypted logs to microSD. Use Value: 256 KB flash stores multiple firmware images and cryptographic keys; hardware CRC ensures log integrity; 128 KB RAM buffers 1-second waveform captures at 16 kHz. | Use Scenario: Portable vital signs monitor measuring ECG, SpO₂, and respiration using analog front-end sensors. IC Role / Device Role / Timing Role: Signal acquisition MCU digitizing analog biosignals, performing real-time filtering, and transmitting processed data via USB or UART to host. Use Value: Programmable gain amplifiers condition weak mV-level ECG signals; 12-bit DACs generate calibration references; low-power stop modes extend battery life to >72 hours. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MK20DN512ZVMD10 | 512 KB flash, 128 KB RAM, 144-pin MAPBGA - no FlexRAM, higher pin count, larger footprint | Suitable for applications requiring larger code space and external memory interface (FlexBus), but lacks FlexMemory flexibility | Select when firmware size exceeds 256 KB and board layout accommodates 144-pin BGA |
| KEA128MT64xxx | Cortex-M0+, 128 KB flash, 16 KB RAM, 64-pin LQFP - lower performance, no USB or CAN FD, single ADC | Targeted at cost-sensitive, low-complexity control tasks where 100 MHz M4 capability and dual CAN are unnecessary | Choose for entry-level automotive modules where functional safety ASIL-B compliance is not required |
Compared with MK20DX256ZVLK10, MK20DN512ZVMD10 offers greater flash capacity but sacrifices FlexRAM programmability and increases PCB complexity, while KEA128MT64xxx reduces cost and power at the expense of real-time processing capability and peripheral richness.
Availability
MK20DX256ZVLK10 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, smart energy metering, and portable medical devices requiring stable component supply, long-term lifecycle support, and extended temperature operation.
Supply support for MK20DX256ZVLK10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based microcontrollers and edge processing.
The Kinetis K20 family, including MK20DX256ZVLK10, was designed for cost-sensitive, high-reliability embedded control in harsh environments-emphasizing low-power operation, analog integration, and functional safety readiness.
FAQ
What is the maximum operating frequency of the MK20DX256ZVLK10?
The MK20DX256ZVLK10 operates at a maximum CPU frequency of 100 MHz, enabled by its ARM Cortex-M4 core with DSP extensions. This frequency is achievable across the full industrial temperature range (–40 to 105°C) when supplied with 1.71–3.6 V and using the internal PLL with appropriate clock source configuration. The MK20DX256ZVLK10 delivers 1.25 Dhrystone MIPS per MHz, resulting in 125 DMIPS performance.
Does the MK20DX256ZVLK10 support USB device mode without an external transceiver?
Yes, the MK20DX256ZVLK10 integrates a full-speed/low-speed USB On-The-Go controller with an on-chip transceiver, eliminating the need for an external PHY. It supports device, host, and OTG roles. Proper termination (1.5 kΩ pull-up on USB_DP) and VREGIN supply (3.0–3.6 V) are required for reliable enumeration. The MK20DX256ZVLK10's USB module complies with USB 2.0 specification and supports control, bulk, interrupt, and isochronous transfer types.
How much FlexRAM does the MK20DX256ZVLK10 include, and what is its purpose?
The MK20DX256ZVLK10 includes 4 KB of FlexRAM, part of its FlexMemory architecture. This memory can be dynamically configured as either additional program flash (for firmware updates) or high-speed SRAM (for critical data buffers), without requiring external memory. Unlike standard RAM, FlexRAM retains its configuration across resets and supports EEPROM-like wear leveling when used as data storage. This capability is unique to the "X" variant in the K20 family and is not present in "N"-suffix parts like MK20DN512ZVMD10.
What analog peripherals are integrated into the MK20DX256ZVLK10?
The MK20DX256ZVLK10 integrates two 16-bit SAR ADCs with integrated programmable gain amplifiers (up to x64), two 12-bit DACs, three analog comparators (each with a 6-bit DAC and programmable reference), and a precision voltage reference module. These peripherals support simultaneous sampling, hardware-triggered conversions, and low-noise operation across the full temperature range. The MK20DX256ZVLK10's analog subsystem is optimized for sensor interfacing, closed-loop control, and calibration tasks in industrial and automotive applications.
Is the MK20DX256ZVLK10 qualified for automotive applications?
The MK20DX256ZVLK10 is specified for industrial temperature range (–40 to 105°C) and carries AEC-Q100 stress test qualification per Freescale/NXP documentation for the K20 family. While not explicitly branded as "automotive grade" in its part number, it meets key automotive requirements including dual CAN interfaces, robust EMC behavior, and extended temperature operation. It is widely deployed in body electronics and chassis control modules. For ASIL-B functional safety applications, designers must implement additional software/hardware measures beyond the base MK20DX256ZVLK10 capabilities.
MK20DX256ZVLK10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 80-LQFP
- Series:
- Kinetis K20
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 52
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 27x16b; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK20DX256ZVLK10 FAQ
1.How can I place an order for MK20DX256ZVLK10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK20DX256ZVLK10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK20DX256ZVLK10 reliable?
The price and inventory of MK20DX256ZVLK10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK20DX256ZVLK10 is usually 5 days.
3.What payment methods are accepted for MK20DX256ZVLK10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK20DX256ZVLK10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK20DX256ZVLK10?
MK20DX256ZVLK10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK20DX256ZVLK10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK20DX256ZVLK10?
For technical support, including MK20DX256ZVLK10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK20DX256ZVLK10 requirements.
6.How does Aetrix verify that MK20DX256ZVLK10 is sourced from the original manufacturer or authorized distributors?
All MK20DX256ZVLK10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK20DX256ZVLK10 meets industry standards.
7.What is the process for return or replacement of MK20DX256ZVLK10?
All MK20DX256ZVLK10 units undergo pre-shipment inspection (PSI). If there is an issue with MK20DX256ZVLK10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK20DX256ZVLK10 part is unused and in its original packaging.
Return procedure for MK20DX256ZVLK10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MK20DX256ZVLK10 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

