NXP Semiconductors MK20DX256ZVLQ10
- Part No.:
- MK20DX256ZVLQ10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
MK20DX256ZVLQ10.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:300
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Product details
Overview
MK20DX256ZVLQ10 from NXP (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, operating at up to 100 MHz, featuring 256 KB on-chip flash memory and 128 KB RAM, integrated dual 16-bit SAR ADCs with PGA, two 12-bit DACs, USB OTG, dual CAN, and low-power operation down to –40°C to 105°C for industrial motor control and sensor gateway applications.
For engineers reviewing the MK20DX256ZVLQ10 datasheet, MK20DX256ZVLQ10 pinout, MK20DX256ZVLQ10 application, or MK20DX256ZVLQ10 equivalent, key selection criteria include its FlexMemory architecture, 100 MHz real-time performance with hardware CRC and memory protection unit, USB + dual CAN connectivity, and support for VLLS0/VLLS1 ultra-low-power stop modes in space-constrained LQFP-100 designs.
Technical Context
The MK20DX256ZVLQ10 implements an ARM Cortex-M4 core with single-cycle DSP instructions and optional floating-point unit (not enabled in this variant), paired with a multi-purpose clock generator supporting 3–32 MHz crystal and 32 kHz RTC oscillators. Its memory subsystem includes 256 KB program flash with FlexNVM capability, 4 KB FlexRAM, and configurable flash security via flash protection registers.
Peripherals are organized into clock-gated domains managed by the system integration module (SIM), with dedicated DMA channels servicing ADC, UART, SPI, and USB. The low-leakage wakeup unit enables deterministic wake-from-VLLS in under 100 μs, while the memory protection unit enforces multi-master access control across CPU, DMA, and debug interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4 @ 100 MHz - delivers 125 DMIPS and supports DSP instructions for real-time filtering and motor control loops |
| Flash Memory | 256 KB program flash + 256 KB FlexNVM - enables data logging in flash-resident nonvolatile storage without external EEPROM |
| RAM | 128 KB SRAM - sufficient for RTOS stacks, USB descriptor tables, and dual CAN message buffers |
| Analog Peripherals | Dual 16-bit SAR ADCs (1 MSPS), each with integrated PGA (x1–x64), plus two 12-bit DACs - supports closed-loop analog signal conditioning |
| Communication | USB 2.0 Full/Low-Speed OTG, 2× CAN 2.0B, 6× UART, 3× SPI, 2× I²C, SDHC, I²S - meets industrial fieldbus and host interface requirements |
| Power Range | 1.71–3.6 V supply, –40 to 105°C ambient - qualified for extended-temperature industrial and automotive under-hood environments |
| Low-Power Modes | VLLS1/VLLS2/VLLS3 stop currents as low as 2.1 μA - enables battery-backed RTC and sensor wake-up in energy-harvesting systems |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm), RoHS-compliant, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Digital power/ground | Core logic supply pins; require local 100 nF + 4.7 μF decoupling per VDD pair |
| VDDA, VSSA | Analog power/ground | Isolated analog domain supply; must be filtered separately from digital rails to maintain ADC/DAC SNR |
| EXTAL/XTAL | Main crystal oscillator input/output | Supports 3–32 MHz crystals; essential for USB timing accuracy and high-speed peripheral clocks |
| EXTAL32/XTAL32 | 32 kHz RTC crystal terminals | Enable autonomous RTC operation during VLLS modes with battery backup on VBAT |
| USB_DP/USB_DM | USB differential data lines | On-chip transceiver eliminates need for external PHY; requires 27 Ω series resistors and 1.5 kΩ pull-up on DP |
| CAN0_TX/CAN0_RX | Channel 0 CAN bus interface | 5 V-tolerant inputs; compatible with ISO 11898-2 physical layer when paired with external CAN transceiver |
| PTA0–PTA31, PTB0–PTB17, etc. | GPIO multiplexed signals | Each port pin supports up to 8 alternate functions (e.g., UART0_TX, ADC0_SE4a, TPM0_CH0); configured via SIM_SCGC and PORTx_PCRn registers |
Key Features
| Feature | Design Value |
|---|---|
| FlexMemory architecture | 256 KB flash + 256 KB FlexNVM allows reconfigurable allocation between code and data storage, enabling firmware-over-the-air updates with rollback |
| Hardware CRC module | Accelerates checksum calculation for flash integrity verification and communication frame validation at full bus speed |
| Memory Protection Unit (MPU) | Enforces privilege-level access control across CPU, DMA, and debug interfaces to prevent unauthorized memory access in certified safety applications |
| Low-power touch sensing (TSI) | Capacitive touch interface with hardware charge-transfer measurement supports up to 16 electrodes without CPU intervention |
| Programmable gain amplifier (PGA) | Integrated x1–x64 PGA per ADC channel enables direct connection of low-level sensor outputs (e.g., thermocouples, strain gauges) without external op-amps |
Applications
| Industrial Motor Control | Smart Sensor Gateway |
|---|---|
Use Scenario: Closed-loop control of BLDC motors in HVAC blowers and pump drives using field-oriented control (FOC). IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms, PWM generation with dead-time insertion, ADC sampling synchronized to commutation events, and CAN-based command interface. Use Value: 100 MHz Cortex-M4 with DSP instructions achieves sub-1 μs interrupt latency and deterministic 10 kHz control loop timing; dual ADCs sample phase currents simultaneously. | Use Scenario: Aggregation and preprocessing of temperature, pressure, and vibration data from multiple industrial sensors before transmission via Ethernet or cellular modem. IC Role / Device Role / Timing Role: Sensor interface hub with timestamped data buffering, local anomaly detection, and secure firmware update handling via USB or CAN. Use Value: FlexNVM stores sensor calibration coefficients and firmware images; hardware CRC ensures data integrity; VLLS1 mode draws only 2.1 μA while maintaining RTC and wake-on-sensor-event capability. |
| Automotive Body Controller | Medical Diagnostic Equipment |
Use Scenario: Central body control module managing lighting, window lift, door locks, and LIN slave coordination in entry-level vehicles. IC Role / Device Role / Timing Role: Multi-protocol interface controller with CAN for vehicle network, LIN for sub-nodes, and PWM for LED dimming, all managed under ASIL-B-aware partitioning. Use Value: MPU-enforced memory isolation separates safety-critical CAN stack from non-critical UI tasks; dual CAN controllers enable redundancy or separate powertrain/body networks. | Use Scenario: Portable ECG and pulse oximetry device requiring high-precision analog front-end, low-noise signal processing, and battery longevity. IC Role / Device Role / Timing Role: Analog acquisition engine with 16-bit ADCs, programmable gain amplification, and real-time digital filtering prior to Bluetooth LE transmission. Use Value: Integrated PGA eliminates external instrumentation amps; 12-bit DACs drive reference voltages for ratiometric sensor excitation; VLLS3 mode extends battery life to >1 year with periodic wake-up sampling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| K20DN512ZVMD10 | 512 KB flash, 256 KB RAM, same 100 MHz Cortex-M4 core, but MAPBGA-121 package | Higher memory capacity suits complex protocol stacks (e.g., TCP/IP + USB + CAN FD); BGA footprint increases layout complexity | Select when firmware size exceeds 256 KB or additional RAM is required for large buffers; not pin-compatible with MK20DX256ZVLQ10 |
| KEA128MT64xxx | Cortex-M0+ core, 128 KB flash, 16 KB RAM, 48 MHz max, QFP-64 package | Lower cost and power for simpler control tasks; lacks USB, FlexNVM, and DSP acceleration | Choose for cost-sensitive, low-complexity applications where 100 MHz performance and dual CAN are unnecessary |
Compared with K20DN512ZVMD10, MK20DX256ZVLQ10 offers identical peripheral sets in a more manufacturable LQFP-100 package but trades flash/RAM capacity for board-level simplicity; versus KEA128MT64xxx, it delivers 2.1× higher Dhrystone MIPS and full USB/CAN feature parity at higher power and BOM cost.
Availability
MK20DX256ZVLQ10 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor gateways, and automotive body electronics requiring stable component supply, long-term lifecycle assurance, and extended-temperature qualification.
Supply support for MK20DX256ZVLQ10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, and mobile applications.
The Kinetis K20 family, including MK20DX256ZVLQ10, was designed for real-time industrial control and human-machine interface applications demanding high analog integration, low-power flexibility, and robust communication peripherals.
FAQ
What is the maximum operating frequency of the MK20DX256ZVLQ10?
The MK20DX256ZVLQ10 operates at a maximum CPU frequency of 100 MHz, achieved using the internal multi-purpose clock generator (MCG) in FEE mode with an external 8–32 MHz crystal. This frequency is fully supported across the –40°C to 105°C temperature range and 1.71–3.6 V supply voltage, delivering 125 DMIPS and 1.25 Dhrystone MIPS per MHz as verified in the K20P121M100SF2 datasheet Rev. 7.
Does the MK20DX256ZVLQ10 include USB functionality?
Yes, the MK20DX256ZVLQ10 integrates a USB 2.0 full-speed/low-speed On-The-Go controller with an on-chip transceiver, supporting device, host, and OTG roles. It requires only external 27 Ω series resistors and a 1.5 kΩ pull-up resistor on USB_DP for device enumeration. The USB module is fully functional in the MK20DX256ZVLQ10 and is documented in Section 6.8.1 of the K20P121M100SF2 datasheet.
What memory configuration does the MK20DX256ZVLQ10 support?
The MK20DX256ZVLQ10 features 256 KB of program flash memory and 256 KB of FlexNVM, with 4 KB of FlexRAM. As a FlexMemory device (denoted by 'X' in the part number), it allows dynamic partitioning of FlexNVM between emulated EEPROM and data flash, enabling wear-leveling and atomic write operations without external nonvolatile memory. This configuration is confirmed in the K20 Sub-Family Data Sheet K20P121M100SF2 Rev. 7, Table 2.3.
Which low-power modes are supported by the MK20DX256ZVLQ10?
The MK20DX256ZVLQ10 supports seven low-power modes: RUN, WAIT, STOP, VLPR, VLPW, VLPS, and LLS, plus three very-low-leakage stop modes (VLLS0–VLLS3). VLLS1 current is specified at 2.1 μA (typical) over –40°C to 25°C, with RTC and LLWU active. These modes are controlled via the System Mode Controller (SMC) and detailed in Section 5.2.4 of the K20P121M100SF2 datasheet Rev. 7.
Is the MK20DX256ZVLQ10 pin-compatible with other K20 family members?
No, the MK20DX256ZVLQ10 is not universally pin-compatible across the K20 family. Its 100-pin LQFP (LQ package code) differs from QFN, BGA, and smaller LQFP variants. While peripheral signal mapping follows K20 conventions, pin assignments for ADC, UART, and CAN vary by package. The MK20DX256ZVLQ10 shares pinout compatibility only with other LQ-packaged K20 devices of identical pin count, such as MK20DN512ZVLQ10 - but not with FM, FT, or MC packages.
MK20DX256ZVLQ10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- Kinetis K20
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 100
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 42x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK20DX256ZVLQ10 FAQ
1.How can I place an order for MK20DX256ZVLQ10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK20DX256ZVLQ10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK20DX256ZVLQ10 reliable?
The price and inventory of MK20DX256ZVLQ10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK20DX256ZVLQ10 is usually 5 days.
3.What payment methods are accepted for MK20DX256ZVLQ10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK20DX256ZVLQ10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK20DX256ZVLQ10?
MK20DX256ZVLQ10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK20DX256ZVLQ10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK20DX256ZVLQ10?
For technical support, including MK20DX256ZVLQ10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK20DX256ZVLQ10 requirements.
6.How does Aetrix verify that MK20DX256ZVLQ10 is sourced from the original manufacturer or authorized distributors?
All MK20DX256ZVLQ10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK20DX256ZVLQ10 meets industry standards.
7.What is the process for return or replacement of MK20DX256ZVLQ10?
All MK20DX256ZVLQ10 units undergo pre-shipment inspection (PSI). If there is an issue with MK20DX256ZVLQ10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK20DX256ZVLQ10 part is unused and in its original packaging.
Return procedure for MK20DX256ZVLQ10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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