NXP Semiconductors MK20DX256ZVMC10
- Part No.:
- MK20DX256ZVMC10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 121-LFBGA
- Datasheet:
-
MK20DX256ZVMC10.pdf
- Description:
- IC MCU 32B 256KB FLASH 121MAPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MK20DX256ZVMC10 from NXP (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, designed for embedded control applications requiring real-time signal processing and mixed-signal integration. It operates at up to 100 MHz, integrates 256 KB on-chip flash memory and 128 KB RAM, supports -40°C to +105°C ambient operation, and features dual 16-bit SAR ADCs with integrated PGA, two 12-bit DACs, and USB On-The-Go capability.
For engineers reviewing the MK20DX256ZVMC10 datasheet, MK20DX256ZVMC10 pinout, MK20DX256ZVMC10 application, or MK20DX256ZVMC10 equivalent, key selection considerations include its FlexMemory architecture (256 KB flash + 4 KB FlexRAM), dual CAN interfaces, six UARTs, and support for low-power stop modes down to 2.1 µA in VLLS1 - critical for battery-powered industrial and automotive subsystems.
Technical Context
The MK20DX256ZVMC10 implements an ARM Cortex-M4 core with hardware DSP instructions and a Memory Protection Unit (MPU), enabling deterministic real-time execution in safety-aware systems. Its clock system includes a 3–32 MHz crystal oscillator, 32 kHz RTC oscillator, and multi-purpose clock generator supporting dynamic frequency scaling across power modes.
Peripheral integration centers on mixed-signal control: two independent 16-bit ADCs each with programmable gain amplifier (up to ×64), three analog comparators with internal 6-bit DACs, eight-channel PWM timer, and quadrature decoder timers - all synchronized via a 16-channel DMA controller supporting up to 63 request sources without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M4 with DSP, 100 MHz max - delivers 125 DMIPS for real-time motor control and sensor fusion algorithms |
| Flash / RAM | 256 KB program flash + 4 KB FlexRAM + 128 KB SRAM - enables firmware updates in field without external memory |
| ADC | Dual 16-bit SAR ADCs, each with PGA (×1 to ×64) - supports high-resolution current sensing and precision analog front-end design |
| DAC | Two 12-bit DACs - provides calibrated analog output for closed-loop actuator control or calibration signals |
| Timers | Eight-channel PWM timer + two 2-channel quadrature decoders + RTC - supports multi-axis motor commutation and position tracking |
| Communication | 2× CAN, 6× UART, 3× SPI, 2× I²C, USB OTG, SDHC, I²S - enables robust connectivity in vehicle networks and industrial gateways |
| Supply & Temp | 1.71–3.6 V operation, -40°C to +105°C ambient - qualified for under-hood automotive and industrial edge nodes |
Pinout & Package
Package: 121-pin MAPBGA (8 mm × 8 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VSS, VSSA | Power supply and ground rails | Separate digital/analog domains with ≤0.1 V differential tolerance - mandatory for ADC/DAC accuracy and noise immunity |
| PTA0–PTA31, PTB0–PTB19, etc. | General-purpose I/O with multiplexing | Up to 104 GPIOs with configurable slew rate, drive strength, pull-up/down, and digital filtering - supports fast edge detection and ESD-hardened interface design |
| EXTAL/XTAL, EXTAL32/XTAL32 | Primary and RTC crystal oscillator inputs | Supports 3–32 MHz main clock and 32.768 kHz RTC crystal - enables precise timekeeping and jitter-free system timing |
| USB_DP/USB_DM | USB 2.0 full/low-speed differential pair | Integrated transceiver with on-chip termination - eliminates external PHY and reduces BOM cost for device-class USB interfaces |
| CAN0_TX/CAN0_RX, CAN1_TX/CAN1_RX | CAN bus interface pins | Dedicated differential signaling paths compliant with ISO 11898-1 - supports fault-tolerant communication in automotive and industrial networks |
Key Features
| Feature | Design Value |
|---|---|
| FlexMemory architecture | 256 KB flash + 4 KB FlexRAM allows runtime reconfiguration of data storage vs. code space - simplifies over-the-air update handling |
| Low-power modes | VLLS1 mode draws just 2.1 µA at 3.0 V - extends battery life in always-on sensor nodes while retaining RAM and RTC state |
| Hardware CRC module | Accelerates checksum computation for firmware integrity verification and secure boot - reduces CPU load during boot and OTA validation |
| TSI touch interface | Capacitive touch sensing on up to 16 channels with low-power wakeup - enables intuitive HMI without external controllers |
| Memory Protection Unit (MPU) | Enforces privilege-level access control across up to 8 memory regions - supports ASIL-B software partitioning in functional safety designs |
Applications
| Motor Control System | Automotive Body Controller |
|---|---|
|
Use Scenario: Closed-loop control of BLDC motors in HVAC actuators and power seats. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms using DSP instructions, synchronized PWM generation, and current sensing via dual ADCs with PGA. Use Value: 100 MHz core + 8-channel PWM + quadrature decoder enables precise commutation timing and position feedback without external logic. |
Use Scenario: Centralized control of door locks, lighting, window lifts, and mirror adjustment in modern vehicles. IC Role / Device Role / Timing Role: CAN message routing hub with dual CAN controllers, managing distributed ECUs and local I/O expansion via GPIO and TSI. Use Value: Dual CAN interfaces with hardware filtering and 128 KB RAM allow concurrent handling of multiple CAN IDs and diagnostic protocols (UDS, KWP2000). |
| Industrial Data Logger | Medical Sensor Hub |
|
Use Scenario: Battery-powered environmental monitoring node collecting temperature, humidity, and vibration data. IC Role / Device Role / Timing Role: Low-power acquisition engine with RTC-triggered wakeups, ADC sampling, and SDHC-based logging to microSD card. Use Value: VLLS3 mode (3.1 µA) preserves RTC and RAM state for months on coin cell; SDHC interface enables high-throughput local storage. |
Use Scenario: Portable patient monitor aggregating ECG, SpO₂, and temperature signals for wireless transmission. IC Role / Device Role / Timing Role: Mixed-signal front-end with dual 16-bit ADCs (PGA-enabled), two 12-bit DACs for calibration, and USB OTG for host connection. Use Value: Integrated PGA and 16-bit resolution support sub-mV biomedical signal conditioning; USB OTG enables direct PC configuration and data export. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MK20DN512ZVMC10 | 512 KB flash, no FlexRAM; same 100 MHz Cortex-M4 core, identical package and pinout | Better suited for complex protocol stacks (e.g., TCP/IP + USB + CAN) requiring larger code footprint | Select when firmware size exceeds 256 KB and FlexRAM is not required for runtime data reconfiguration |
| MK64FX512VLQ12 | 120 MHz Cortex-M4F with FPU, 512 KB flash, 128 KB RAM, Ethernet MAC, and larger LQFP-144 package | Targets connected edge devices needing floating-point math (e.g., predictive maintenance analytics) and wired networking | Choose when IEEE 802.3 compliance, hardware FPU, or deterministic Ethernet timing is required - not pin-compatible |
Compared with MK20DX256ZVMC10, MK20DN512ZVMC10 offers double flash capacity without FlexRAM trade-offs, while MK64FX512VLQ12 adds FPU and Ethernet at the cost of higher power and different packaging - making MK20DX256ZVMC10 optimal for compact, low-power mixed-signal control where FlexRAM flexibility is essential.
Availability
MK20DX256ZVMC10 is available at Aetrix Electronics and suitable for industrial automation, automotive body electronics, and portable medical devices requiring stable component supply, long-term lifecycle assurance, and extended temperature grade (-40°C to +105°C) performance.
Supply support for MK20DX256ZVMC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based microcontrollers and edge processing.
The MK20DX256ZVMC10 belongs to the Kinetis K20 family - engineered for cost-sensitive, high-integration embedded control applications demanding real-time responsiveness, analog precision, and low-power operation in harsh environments.
FAQ
What is the maximum operating frequency of the MK20DX256ZVMC10?
The MK20DX256ZVMC10 operates at a maximum CPU frequency of 100 MHz, enabled by its ARM Cortex-M4 core with DSP extensions. This speed is supported across the full voltage range (1.71–3.6 V) and temperature range (-40°C to +105°C), delivering 125 DMIPS and 1.25 Dhrystone MIPS per MHz for deterministic real-time execution in MK20DX256ZVMC10-based systems.
Does the MK20DX256ZVMC10 include hardware cryptographic acceleration?
No, the MK20DX256ZVMC10 does not integrate dedicated cryptographic accelerators such as AES or SHA engines. It includes a hardware CRC module for fast cyclic redundancy checks and a 128-bit unique chip ID, but encryption/decryption operations must be implemented in software. For secure boot or TLS offload, external secure elements or newer Kinetis families (e.g., KE1x) are recommended alternatives to MK20DX256ZVMC10.
What package type and pin count does the MK20DX256ZVMC10 use?
The MK20DX256ZVMC10 uses a 121-pin MAPBGA package (8 mm × 8 mm, 0.5 mm pitch), designated by the 'MC' suffix in its part number. This fine-pitch ball grid array supports high I/O density and thermal performance in compact industrial and automotive PCB layouts, and is compatible with standard reflow profiles for lead-free assembly.
Can the MK20DX256ZVMC10 operate from a single 3.3 V supply?
Yes, the MK20DX256ZVMC10 operates reliably from a single 3.3 V supply within its specified 1.71–3.6 V range. Both VDD and VDDA rails may be tied to 3.3 V (with ≤0.1 V differential), and all I/Os are 5 V tolerant - allowing direct interfacing with legacy 5 V peripherals without level shifters. This simplifies power design in MK20DX256ZVMC10-based applications.
How much FlexRAM does the MK20DX256ZVMC10 provide, and what is its purpose?
The MK20DX256ZVMC10 includes 4 KB of FlexRAM - a user-configurable memory block that can be allocated as additional RAM or emulated EEPROM. Unlike standard RAM, FlexRAM retains data across power cycles when backed by VBAT, enabling nonvolatile parameter storage without external serial EEPROM. This capability is integral to the FlexMemory architecture of MK20DX256ZVMC10 and supports field firmware updates and calibration persistence.
MK20DX256ZVMC10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 121-LFBGA
- Series:
- Kinetis K20
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 86
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 38x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK20DX256ZVMC10 FAQ
1.How can I place an order for MK20DX256ZVMC10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK20DX256ZVMC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK20DX256ZVMC10 reliable?
The price and inventory of MK20DX256ZVMC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK20DX256ZVMC10 is usually 5 days.
3.What payment methods are accepted for MK20DX256ZVMC10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK20DX256ZVMC10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK20DX256ZVMC10?
MK20DX256ZVMC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK20DX256ZVMC10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK20DX256ZVMC10?
For technical support, including MK20DX256ZVMC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK20DX256ZVMC10 requirements.
6.How does Aetrix verify that MK20DX256ZVMC10 is sourced from the original manufacturer or authorized distributors?
All MK20DX256ZVMC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK20DX256ZVMC10 meets industry standards.
7.What is the process for return or replacement of MK20DX256ZVMC10?
All MK20DX256ZVMC10 units undergo pre-shipment inspection (PSI). If there is an issue with MK20DX256ZVMC10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK20DX256ZVMC10 part is unused and in its original packaging.
Return procedure for MK20DX256ZVMC10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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