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NXP Semiconductors MK20DX256ZVMD10

Part No.:
MK20DX256ZVMD10
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
144-LBGA
Datasheet:
AetrixMK20DX256ZVMD10.pdf
Description:
IC MCU 32B 256KB FLASH 144MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,690

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Product details

Overview

MK20DX256ZVMD10 from NXP (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, operating at up to 100 MHz, featuring 256 KB on-chip flash memory and 128 KB RAM, integrated dual 16-bit SAR ADCs with PGA, two 12-bit DACs, USB OTG, dual CAN, and six UARTs - deployed in industrial motor control and smart sensor edge nodes.

For engineers reviewing the MK20DX256ZVMD10 datasheet, MK20DX256ZVMD10 pinout, MK20DX256ZVMD10 application, or MK20DX256ZVMD10 equivalent, key selection considerations include its FlexMemory architecture, -40°C to 105°C extended temperature rating, QFN-64 package, 1.71–3.6 V supply range, and support for low-power stop modes down to 2.1 µA.

Technical Context

The MK20DX256ZVMD10 implements an ARM Cortex-M4 core with hardware DSP instructions and single-cycle MAC, paired with a multi-purpose clock generator supporting crystal oscillators (3–32 MHz and 32 kHz), PLL-based frequency synthesis, and dynamic clock gating across subsystems. Its memory subsystem includes 256 KB program flash with FlexNVM capability, 4 KB FlexRAM, and configurable flash security via flash protection blocks.

Peripheral integration centers on deterministic real-time operation: an 8-channel PWM/motor control timer with complementary outputs, two quadrature decoder timers, hardware CRC acceleration, memory protection unit (MPU) with multi-master arbitration, and a 16-channel DMA controller servicing up to 63 request sources - all synchronized to the 100 MHz system clock domain.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M4 with DSP extensions, delivering 1.25 DMIPS/MHz - enables real-time signal processing in motor FOC or audio preprocessing without external coprocessors.
Max Clock Frequency100 MHz - supports deterministic execution of time-critical control loops with sub-microsecond interrupt latency.
Flash Memory256 KB program flash + 256 KB FlexNVM - allows simultaneous code execution and data logging in embedded data acquisition systems.
RAM128 KB SRAM - sufficient for dual-buffered communication stacks (e.g., CAN+USB) and real-time FFT buffers.
ADC/DACDual 16-bit SAR ADCs with integrated PGA (x1–x64), two 12-bit DACs - supports high-resolution analog I/O for closed-loop sensor conditioning and waveform generation.
Temperature Range-40°C to +105°C - qualified for under-hood automotive ECUs and industrial PLC modules without derating.
Supply Voltage1.71 V to 3.6 V - compatible with single-cell Li-ion, 3.3 V rail, or energy-harvesting power supplies.

Pinout & Package

Package: 64-pin QFN (10 mm × 10 mm, 0.5 mm pitch), thermally enhanced with exposed thermal pad (PP = LH in part number encoding).

Pin/TerminalCircuit RoleDesign Meaning
VDD/VSSCore power/groundDedicated pairs per quadrant minimize IR drop and noise coupling in mixed-signal operation.
PTA0–PTA31GPIO with multiplexed peripheralsConfigurable as UART, SPI, I²C, or TSI inputs - enables flexible board layout and firmware-defined interface routing.
USB_DP/USB_DMFull-speed USB transceiver I/OOn-chip transceiver eliminates external PHY; requires only series resistors and ESD protection per USB 2.0 spec.
CAN0_TX/CAN0_RXDual CAN bus physical layer interfaceDirect connection to isolated CAN transceivers; supports ISO 11898-2 compliant differential signaling at 1 Mbps.
ADC0_SE0–ADC0_SE15Analog input channels16 single-ended or 8 differential inputs per ADC; PGA gain selectable per channel for sensor signal scaling.

Key Features

FeatureDesign Value
FlexMemory architecture256 KB flash + 256 KB FlexNVM allows runtime reconfiguration between code storage and nonvolatile data logging space.
Low-power stop modesVLLS1 mode draws just 2.1 µA at 3.0 V - enables battery-powered field devices with multi-year standby life.
Hardware CRC moduleAccelerates checksum calculation for firmware OTA updates and secure boot verification in <1 µs per 32-bit word.
TSI touch interfaceCapacitive touch sensing on up to 16 electrodes without external components - reduces BOM cost in HMI panels.
Memory Protection Unit (MPU)Enforces privilege-level access control across 8 regions, preventing accidental or malicious corruption of critical ISR vectors or stack space.

Applications

Industrial Motor ControlSmart Sensor Node

Use Scenario: Closed-loop field-oriented control (FOC) of 3-phase BLDC motors in HVAC compressors and pump drives.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm, PWM generation with dead-time insertion, and ADC sampling synchronized to switching edges.

Use Value: 100 MHz Cortex-M4 + 8-channel PWM timer enables 20 kHz switching frequency with <500 ns jitter, meeting IEC 61800-3 EMC requirements.

Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and CO₂ via I²C sensors and transmitting over CAN bus.

IC Role / Device Role / Timing Role: Sensor hub aggregating data, performing local calibration, managing low-power wake/sleep cycles, and buffering telemetry before CAN transmission.

Use Value: VLLS3 stop mode current of 3.1 µA at –40°C extends 2000 mAh coin cell life to >5 years in intermittent-read applications.

Automotive Body ControllerUSB-Capable Diagnostic Tool

Use Scenario: Door module controlling window lift, mirror fold, and interior lighting with LIN and CAN communication.

IC Role / Device Role / Timing Role: Central MCU handling LIN slave protocol, CAN message filtering, GPIO-driven load drivers, and watchdog supervision.

Use Value: Dual CAN interfaces allow simultaneous connection to powertrain CAN and body CAN networks without gateway translation.

Use Scenario: Handheld diagnostic interface connecting to vehicle ECUs via USB and translating to CAN or UART protocols.

IC Role / Device Role / Timing Role: USB device endpoint handling host commands while running CAN FD or UART protocol stacks in parallel.

Use Value: Integrated USB OTG controller with on-chip transceiver eliminates external PHY, reducing PCB area by 25 mm² and component count by 7 parts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MK20DN512ZVMD10512 KB flash, no FlexNVM; same 100 MHz Cortex-M4 core, identical pinout and peripheral set.Better suited for applications requiring larger firmware image or bootloader + application separation.Select when firmware size exceeds 256 KB or when FlexNVM functionality is not required.
KEA128MT64xxxARM Cortex-M0+, 48 MHz max, 128 KB flash, no USB or CAN FD; smaller QFN-48 package.Targeted at cost-sensitive, lower-complexity control tasks where USB/CAN bandwidth is unnecessary.Choose for simpler body electronics or appliance controls where 100 MHz performance and dual CAN are over-provisioned.

Compared with MK20DX256ZVMD10, MK20DN512ZVMD10 offers double flash capacity without changing PCB layout, while KEA128MT64xxx trades performance and interface richness for lower BOM cost and reduced footprint - enabling tiered product variants from a common software base.

Availability

MK20DX256ZVMD10 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, smart sensor nodes, and USB-capable diagnostic tools requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MK20DX256ZVMD10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.

The K20 series - including MK20DX256ZVMD10 - was designed for real-time embedded applications demanding high analog integration, deterministic timing, and robust low-power operation in harsh environments.

FAQ

What is the maximum operating frequency of the MK20DX256ZVMD10?

The MK20DX256ZVMD10 operates at up to 100 MHz using its ARM Cortex-M4 core with DSP extensions. This frequency is achieved via the internal PLL driven by the 3–32 MHz crystal oscillator or internal reference, and is validated across the full -40°C to +105°C temperature range and 1.71–3.6 V supply voltage. The MK20DX256ZVMD10 maintains timing compliance under worst-case voltage and temperature conditions per its published AC electrical specifications.

Does the MK20DX256ZVMD10 support USB device functionality without an external transceiver?

Yes, the MK20DX256ZVMD10 integrates a full-speed USB 2.0 On-The-Go controller with an on-chip transceiver. It supports USB device mode directly using only external series resistors (22 Ω) and ESD protection diodes on USB_DP and USB_DM pins - no external PHY chip is required. This capability is confirmed in the K20 Sub-Family Data Sheet Rev. 7, Section 6.8.1, and applies specifically to the MK20DX256ZVMD10 variant.

What type of memory architecture does the MK20DX256ZVMD10 use?

The MK20DX256ZVMD10 uses FlexMemory architecture, combining 256 KB of program flash memory with 256 KB of FlexNVM (emulated EEPROM) and 4 KB of FlexRAM. Unlike standard flash-only MCUs, this allows runtime partitioning of nonvolatile memory between executable code and wear-leveled data storage - a feature explicitly documented for MK20DX256ZVMD10 in the K20 Sub-Family Data Sheet Section 4.3.2.

What is the lowest power consumption mode supported by the MK20DX256ZVMD10?

The MK20DX256ZVMD10 supports Very Low-Leakage Stop Mode 1 (VLLS1), achieving 2.1 µA typical current draw at 3.0 V and -40°C to 25°C ambient. This mode retains RAM content and selected wakeup sources (LLWU) while disabling the CPU, flash, and most clocks. The value is measured and specified in Table 6 of the K20 Sub-Family Data Sheet Rev. 7, and applies directly to the MK20DX256ZVMD10.

How many analog-to-digital converters does the MK20DX256ZVMD10 integrate?

The MK20DX256ZVMD10 integrates two independent 16-bit successive approximation register (SAR) ADCs, each with up to 16 single-ended or 8 differential input channels and an integrated programmable gain amplifier (PGA) offering gains from 1× to 64×. This dual-ADC configuration is explicitly listed in the "Analog modules" section of the K20 Sub-Family Data Sheet Rev. 7 and confirmed for MK20DX256ZVMD10 in the family summary table.

MK20DX256ZVMD10 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
144-LBGA
Series:
Kinetis K20
Packaging:
Tray
Product Status:
Not For New Designs
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
100
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 42x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MK20DX256ZVMD10 FAQ

1.How can I place an order for MK20DX256ZVMD10 through Aetrix?

Please submit a Request for Quotation (RFQ) for MK20DX256ZVMD10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MK20DX256ZVMD10 reliable?

The price and inventory of MK20DX256ZVMD10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK20DX256ZVMD10 is usually 5 days.

3.What payment methods are accepted for MK20DX256ZVMD10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK20DX256ZVMD10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MK20DX256ZVMD10?

MK20DX256ZVMD10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MK20DX256ZVMD10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MK20DX256ZVMD10?

For technical support, including MK20DX256ZVMD10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK20DX256ZVMD10 requirements.

6.How does Aetrix verify that MK20DX256ZVMD10 is sourced from the original manufacturer or authorized distributors?

All MK20DX256ZVMD10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK20DX256ZVMD10 meets industry standards.

7.What is the process for return or replacement of MK20DX256ZVMD10?

All MK20DX256ZVMD10 units undergo pre-shipment inspection (PSI). If there is an issue with MK20DX256ZVMD10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MK20DX256ZVMD10 part is unused and in its original packaging.

Return procedure for MK20DX256ZVMD10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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