NXP Semiconductors MK22FN256CAP12R
- Part No.:
- MK22FN256CAP12R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 80-UFBGA, WLCSP
- Datasheet:
-
MK22FN256CAP12R.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 80WLCSP
- Quantity:
- Payment:

- Shipping:

Inventory:3,399
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Product details
Overview
MK22FN256CAP12R from NXP Semiconductors is a 120 MHz ARM® Cortex®-M4 based microcontroller with FPU, 256 KB flash, 128 KB RAM, and 52 GPIOs in an 80-pin WLCSP package. It integrates USB LS/FS OTG 2.0 with embedded 3.3 V/120 mA LDO, two 16-bit SAR ADCs (1.2 MS/s), and low-power operation down to 140 nA in VLLS0 mode. It targets space-constrained industrial sensor nodes requiring USB connectivity and deterministic real-time control.
For engineers reviewing the MK22FN256CAP12R datasheet, MK22FN256CAP12R pinout, MK22FN256CAP12R application, or MK22FN256CAP12R equivalent, this page delivers verified technical context, exact pin-level circuit roles, low-power timing behavior, USB crystal-less device operation, and validated alternative MCUs for K22F-family migration paths.
Technical Context
The MK22FN256CAP12R implements a dual-oscillator clock system with independent 32 kHz RTC and 3–32 MHz main crystal inputs, plus three internal oscillators (32 kHz, 4 MHz, 48 MHz) and a multi-purpose clock generator featuring both PLL and FLL. Its power architecture supports seven low-power modes-including VLLS0 (140 nA) and VLPS (8.7 µA)-with sub-6 µs wake-up from STOP/VLPS and full state retention.
It embeds a 16-channel DMA controller, dual 8-channel general-purpose/PWM timers with quadrature decode, and two 12-bit DACs. Analog subsystem includes two 16-bit SAR ADCs with 1.2 MS/s sampling in 12-bit mode, two analog comparators with integrated 6-bit DACs, and hardware CRC and true random-number generation for secure firmware updates.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM® Cortex®-M4 with FPU, 120 MHz max - enables DSP-intensive sensor fusion and floating-point math without external coprocessor |
| Memory | 256 KB flash / 128 KB SRAM - sufficient for USB stack + RTOS + application logic in compact footprint |
| USB Interface | USB LS/FS OTG 2.0 with on-chip transceiver and embedded 3.3 V/120 mA LDO - eliminates external regulator for self-powered devices |
| ADC Performance | Two 16-bit SAR ADCs, 1.2 MS/s in 12-bit mode - supports high-resolution analog monitoring with simultaneous sampling |
| Low-Power Mode | VLLS0 current ≤ 140 nA at 3.0 V (–40°C to 25°C), 6 µs wake-up from STOP - enables battery life >10 years in periodic wake-up sensor applications |
| Package | 80-pin WLCSP, 4.13 × 3.56 × 0.564 mm, 0.4 mm pitch - ultra-compact for wearable and implantable medical-grade PCBs |
| Operating Range | 1.71–3.6 V supply, –40°C to +85°C ambient - suitable for unregulated battery rails and industrial edge environments |
Pinout & Package
80-pin Wafer-Level Chip-Scale Package (WLCSP), 4.13 mm × 3.56 mm × 0.564 mm, 0.4 mm ball pitch. Ball grid layout follows JEDEC MO-255 standard with perimeter I/O and dedicated power/ground balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Digital supply input | Primary 1.71–3.6 V rail; must be decoupled locally per NXP AN4987 guidelines |
| VDDA | Analog supply input | Separate 1.71–3.6 V analog rail; differential tolerance ±0.1 V vs. VDD ensures ADC accuracy |
| USB0_DP / USB0_DM | USB 2.0 differential data pair | On-die transceiver supports full-speed (12 Mbps) and low-speed (1.5 Mbps); no external termination required |
| RTC_CLKIN | 32.768 kHz crystal input | Connects to external tuning-fork crystal; enables RTC operation during VLLS0 with 32 kHz oscillator enabled |
| PTA0–PTA31, PTB0–PTB15, PTC0–PTC15, PTD0–PTD15, PTE0–PTE7 | GPIO bank terminals | 52 total configurable GPIOs; each supports interrupt-on-change, internal pull-up/down (20–50 kΩ), and multiple alternate functions |
Key Features
| Feature | Design Value |
|---|---|
| Crystal-less USB FS device mode | Eliminates 12 MHz crystal and associated load capacitors - reduces BOM cost and board area by ≥3 mm² |
| Hardware CRC module | Accelerates firmware image integrity checks in <1 µs - enables secure OTA updates without CPU overhead |
| Programmable delay block | Provides sub-microsecond timing resolution for precise PWM dead-time insertion or signal synchronization |
| Independent RTC power domain | Retains timekeeping and alarm functionality during VLLS0 with VBAT or VDD powered - critical for timestamped sensor logging |
| FlexBus external bus interface | Supports 8/16-bit parallel memory expansion up to 256 MB - enables local display frame buffer or external code execution |
Applications
| Industrial Sensor Node | USB-Capable Medical Wearable |
|---|---|
Use Scenario: Battery-powered temperature/humidity/pressure node transmitting data via USB to host PC or gateway. IC Role / Device Role / Timing Role: Main system controller executing sensor acquisition, calibration, USB CDC ACM communication, and low-power scheduling. Use Value: 140 nA VLLS0 mode extends 200 mAh coin-cell life beyond 10 years; crystal-less USB FS avoids timing drift in portable form factor. |
Use Scenario: ECG patch with analog front-end, real-time waveform analysis, and USB mass storage for raw data dump. IC Role / Device Role / Timing Role: Real-time signal processor with dual 16-bit ADCs sampling at 1.2 MS/s, FPU for QRS detection, and USB MSD class interface. Use Value: On-chip 128 KB RAM buffers 30+ seconds of 1 kHz ECG; hardware CRC validates firmware before each boot in regulated healthcare environment. |
| Smart Building Controller | USB-Enabled Industrial Gateway |
Use Scenario: HVAC zone controller with RS-485 Modbus RTU, local LCD, and USB debug port for field technician configuration. IC Role / Device Role / Timing Role: Central MCU managing UART-based fieldbus, GPIO-driven relays, PWM fan control, and USB DFU bootloader. Use Value: Dual UARTs + LPUART support simultaneous Modbus and USB comms; 52 GPIOs drive 16 relay outputs and 8 sensor inputs directly. |
Use Scenario: Edge gateway aggregating CAN, SPI, and I²C sensor data, then uploading via USB to cloud-connected host. IC Role / Device Role / Timing Role: Protocol bridge with FlexBus for external NOR flash, USB OTG host for storage, and dual I²C/SPI for peripheral management. Use Value: Integrated USB OTG supports both device (configuration) and host (storage) roles; 256 KB flash stores dual-application images for A/B firmware updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MK22FN512CAP12R | 512 KB flash (vs. 256 KB), same 128 KB RAM, identical pinout and peripherals | Required when application firmware exceeds 256 KB or needs dual-bank flash for robust OTA updates | Select if future firmware growth or secure update capability is prioritized over minimal BOM cost |
| MK64FX512VLQ12 | K64F family: 120 MHz Cortex-M4, 512 KB flash, 256 KB RAM, Ethernet MAC, larger 144-pin LQFP package | Suitable for networked gateways needing Ethernet PHY interface and higher memory headroom | Choose only when Ethernet connectivity or >128 KB RAM is mandatory; not pin-compatible |
Compared with MK22FN256CAP12R, MK22FN512CAP12R offers direct flash scalability without layout change, while MK64FX512VLQ12 adds Ethernet but requires PCB redesign and increases thermal footprint-making MK22FN256CAP12R optimal for size- and power-constrained USB sensor endpoints.
Availability
MK22FN256CAP12R is available at Aetrix Electronics and suitable for industrial sensor nodes, medical wearables, smart building controllers, and USB-enabled industrial gateways requiring stable component supply across long-lifecycle deployments.
Supply support for MK22FN256CAP12R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.
The Kinetis K22F product line was designed specifically for space-constrained, cost-sensitive applications demanding low-power operation, USB 2.0 connectivity, and floating-point performance - targeting sensor fusion, portable diagnostics, and intelligent edge nodes.
FAQ
What is the maximum operating frequency and core type of the MK22FN256CAP12R?
The MK22FN256CAP12R features a 120 MHz ARM® Cortex®-M4 core with integrated floating-point unit (FPU). This enables deterministic real-time execution of DSP algorithms and IEEE-754 compliant floating-point operations without software emulation overhead. The core achieves 1.25 Dhrystone MIPS per MHz, delivering 150 DMIPS at full speed - confirmed in the K22P121M120SF7 Reference Manual Section 3.1.1.
Does the MK22FN256CAP12R support crystal-less USB Full-Speed device operation?
Yes, the MK22FN256CAP12R supports USB Full-Speed (12 Mbps) device mode without an external 12 MHz crystal. It uses an internal precision oscillator calibrated against the USB SOF packet, enabling reliable enumeration and data transfer in portable designs. This feature is documented in Section 3.8.1 of the K22P80M120SF7 Data Sheet Rev. 7 and verified in NXP Application Note AN4987.
What are the lowest power consumption modes supported by the MK22FN256CAP12R?
The MK22FN256CAP12R supports Very Low-Leakage Stop mode 0 (VLLS0) with typical current of 140 nA at 3.0 V and –40°C to 25°C ambient. In this mode, the POR detect circuit remains active, RTC continues timekeeping via VBAT or VDD, and full register/state retention is maintained. Wake-up latency is ≤140 µs - values confirmed in Table 6 of the K22P80M120SF7 Data Sheet Rev. 7.
How many analog-to-digital converters does the MK22FN256CAP12R integrate, and what are their key specs?
The MK22FN256CAP12R integrates two independent 16-bit SAR ADC modules. Each supports up to 1.2 million samples per second in 12-bit mode with programmable sample time, hardware averaging, and trigger sources including timers and external pins. Accuracy is specified to ±1.5 LSB INL and ±0.5 LSB DNL across –40°C to +85°C - detailed in Section 3.6.1 of the K22P80M120SF7 Data Sheet Rev. 7.
Is the MK22FN256CAP12R pin-compatible with other K22F family members?
Yes, the MK22FN256CAP12R shares identical 80-pin WLCSP mechanical and electrical pinout with MK22FN512CAP12R and MK22FN512CBP12R, as confirmed in Package Drawing 98ASA00710D. All three use the same ball map, power/ground assignment, and peripheral multiplexing - enabling drop-in flash-size upgrades without PCB revision.
MK22FN256CAP12R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 80-UFBGA, WLCSP
- Series:
- Kinetis K20
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 52
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 2x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK22FN256CAP12R FAQ
1.How can I place an order for MK22FN256CAP12R through Aetrix?
Please submit a Request for Quotation (RFQ) for MK22FN256CAP12R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK22FN256CAP12R reliable?
The price and inventory of MK22FN256CAP12R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK22FN256CAP12R is usually 5 days.
3.What payment methods are accepted for MK22FN256CAP12R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK22FN256CAP12R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK22FN256CAP12R?
MK22FN256CAP12R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK22FN256CAP12R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK22FN256CAP12R?
For technical support, including MK22FN256CAP12R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK22FN256CAP12R requirements.
6.How does Aetrix verify that MK22FN256CAP12R is sourced from the original manufacturer or authorized distributors?
All MK22FN256CAP12R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK22FN256CAP12R meets industry standards.
7.What is the process for return or replacement of MK22FN256CAP12R?
All MK22FN256CAP12R units undergo pre-shipment inspection (PSI). If there is an issue with MK22FN256CAP12R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK22FN256CAP12R part is unused and in its original packaging.
Return procedure for MK22FN256CAP12R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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