NXP Semiconductors MK22FN256VLL12
- Part No.:
- MK22FN256VLL12
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
MK22FN256VLL12.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,537
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MK22FN256VLL12 from NXP Semiconductors is a 120 MHz ARM® Cortex®-M4 microcontroller with FPU, 256 KB flash, 48 KB RAM, and 66 GPIOs in 100-pin LQFP package. It integrates USB LS/FS OTG 2.0 with embedded 3.3 V/120 mA LDO, dual 16-bit SAR ADCs (1.2 MS/s), and low-power operation down to 120 nA in VLLS0 mode. It targets USB-enabled industrial control and sensor gateway applications requiring floating-point computation and real-time analog acquisition.
For engineers reviewing the MK22FN256VLL12 datasheet, MK22FN256VLL12 pinout, MK22FN256VLL12 application, or MK22FN256VLL12 equivalent, key selection criteria include its 100-pin LQFP footprint, USB crystal-less FS device support, 120 MHz M4+FPU performance, -40°C to 105°C extended temperature rating, and verified low-power modes including 2.6 µA LLS3 with full state retention.
Technical Context
The MK22FN256VLL12 implements a multi-oscillator clock system with two external crystals (32 kHz RTC + 3–32 MHz main) and three internal oscillators (32 kHz, 4 MHz, 48 MHz), managed by a multipurpose clock generator featuring both PLL and FLL for precise frequency synthesis and jitter resilience. Its memory subsystem includes 256 KB of embedded flash with EzPort serial programming interface and preprogrammed flashloader for factory in-system programming.
System-level integration includes a 16-channel DMA controller, independent watchdogs (external and software), hardware CRC module, 128-bit unique chip ID, and hardware random-number generator. Analog subsystem comprises two 16-bit SAR ADCs, one 12-bit DAC, two analog comparators with integrated 6-bit DACs, and accurate internal voltage reference - all operating across the full 1.71–3.6 V supply range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M4 with FPU, 120 MHz max - delivers 1.25 Dhrystone MIPS/MHz for deterministic DSP and control tasks. |
| Memory | 256 KB flash + 48 KB SRAM - sufficient for complex USB device stacks, real-time control algorithms, and firmware updates. |
| USB Interface | USB 2.0 LS/FS OTG with on-chip transceiver and embedded 3.3 V/120 mA LDO - enables self-powered USB devices without external regulators; supports crystal-less FS operation. |
| ADC Performance | Dual 16-bit SAR ADCs, 1.2 MS/s in 12-bit mode - supports simultaneous high-resolution sampling of multiple analog sensors (e.g., temperature, pressure, current). |
| Low-Power Modes | VLLS0 down to 120 nA (POR enabled), LLS3 at 2.6 µA with full state retention and 6 µs wakeup - ideal for battery-backed IoT edge nodes requiring rapid event response. |
| Operating Range | 1.71–3.6 V supply, -40°C to 105°C ambient - validated for industrial automation, automotive body electronics, and harsh-environment monitoring. |
| I/O Count | 66 GPIOs with configurable pull-up/pull-down (20–50 kΩ), high-drive capability on select pins - supports mixed-signal board design with direct LED driving and level-shifting flexibility. |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VSS, VSSA | Power and ground rails | Digital (VDD/VSS) and analog (VDDA/VSSA) supplies with ≤0.1 V differential tolerance - requires separate filtering and star grounding for noise-sensitive ADC/DAC operation. |
| USB0_DP / USB0_DM | USB 2.0 differential data pair | On-chip transceiver with ESD protection; supports full-speed (12 Mbps) and low-speed (1.5 Mbps) signaling without external PHY. |
| XTAL / EXTAL | Main crystal oscillator terminals | Accepts 3–32 MHz external crystal; enables precise timing for USB, UART, and real-time control loops. |
| RTC_XTAL / RTC_EXTAL | 32 kHz RTC crystal terminals | Supports autonomous real-time clock operation during deep sleep (VLLSx), enabling calendar-based wakeups and timestamping. |
| PTA0–PTD7 (multiplexed) | General-purpose I/O bank | 66 total GPIOs with programmable digital functions (UART, SPI, I²C, PWM, ADC input); some pins support high-drive (20 mA) for direct actuator control. |
Key Features
| Feature | Design Value |
|---|---|
| Floating-point unit (FPU) | Hardware-accelerated single-precision IEEE 754 arithmetic - eliminates software emulation overhead for motor control, sensor fusion, and filter computations. |
| Crystal-less USB FS mode | Internal 48 MHz IRC calibrated to ±0.25% - removes external 48 MHz crystal requirement for USB device applications, reducing BOM cost and PCB area. |
| Hardware CRC module | Configurable 16/32-bit CRC engine with polynomial preset - accelerates firmware integrity checks, OTA update validation, and communication frame error detection. |
| Programmable delay block (PDB) | High-resolution timing peripheral synchronized to ADC conversions - enables precise trigger sequencing for multi-channel synchronized sampling or PWM dead-time insertion. |
| Flash access control | Region-based read/write/execute protection - prevents unauthorized firmware extraction or modification in secure boot and IP-protected applications. |
Applications
| Industrial Sensor Gateway | USB Human Interface Device (HID) |
|---|---|
|
Use Scenario: Edge node aggregating data from multiple analog and digital sensors (temperature, humidity, vibration) and forwarding via USB to host PC or PLC. IC Role / Device Role / Timing Role: Central MCU managing concurrent ADC sampling, USB HID report generation, real-time clock timestamping, and low-power sleep scheduling. Use Value: Dual 16-bit ADCs enable simultaneous high-fidelity sensor acquisition; USB crystal-less FS mode reduces component count; 105°C rating ensures reliability in enclosed control cabinets. |
Use Scenario: Programmable keyboard, barcode scanner, or medical input device requiring plug-and-play USB connectivity and responsive button/encoder handling. IC Role / Device Role / Timing Role: USB device controller with HID-class descriptor support, debounced GPIO scanning, and low-latency interrupt-driven report transmission. Use Value: Integrated USB transceiver and LDO eliminate external components; 66 GPIOs accommodate matrix scanning and status LEDs; VLLS0 mode enables <120 nA standby for battery longevity. |
| Smart Building Controller | Portable Test Instrument |
|
Use Scenario: HVAC or lighting controller interfacing with RS-485, I²C sensors, and local display, powered from 3.3 V rail with backup battery. IC Role / Device Role / Timing Role: Real-time system orchestrator running scheduler, PID loops, communication stacks (UART/I²C), and RTC-backed logging. Use Value: 48 KB RAM supports multitasking RTOS; hardware RNG enables secure key generation; 120 MHz M4+FPU handles complex control algorithms within tight cycle budgets. |
Use Scenario: Handheld multimeter or signal analyzer requiring precision analog front-end, LCD driver, and USB data export. IC Role / Device Role / Timing Role: Mixed-signal SoC integrating 16-bit ADC, 12-bit DAC, comparator, voltage reference, and USB interface in single chip. Use Value: On-chip 12-bit DAC and dual ADCs reduce external DAC/ADC ICs; accurate internal voltage reference improves measurement repeatability; 100-pin LQFP allows clean analog/digital partitioning on PCB. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MK22FN512VLH12 | 512 KB flash, 40 GPIOs, 64-pin LQFP - same core/peripherals but higher density flash and smaller package. | Better suited for applications needing larger firmware (e.g., dual-bank OTA, complex protocol stacks) with space-constrained layouts. | Select when flash headroom >256 KB is required and GPIO count ≤40 suffices; verify pin compatibility for existing 64-LQFP footprints. |
| STM32F405RGT6 | 168 MHz Cortex-M4F, 1 MB flash, 192 KB RAM, no integrated USB LDO - requires external regulator for self-powered USB. | Higher performance and memory for advanced graphics or audio processing; lacks crystal-less USB FS, increasing BOM complexity. | Choose for compute-intensive applications where USB power delivery is handled externally; assess layout impact of added LDO and decoupling. |
Compared with MK22FN256VLL12, MK22FN512VLH12 trades GPIO count for flash capacity in a smaller package, while STM32F405RGT6 offers higher clock speed and memory but demands external USB regulation - making MK22FN256VLL12 optimal for cost-sensitive, USB-integrated industrial edge nodes with moderate code size.
Availability
MK22FN256VLL12 is available at Aetrix Electronics and suitable for industrial sensor gateways, USB HID peripherals, and smart building controllers requiring stable component supply, long-term lifecycle assurance, and extended temperature support.
Supply support for MK22FN256VLL12 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.
The Kinetis K22 family, including MK22FN256VLL12, was designed for cost-sensitive, low-power applications demanding USB connectivity, rich analog integration, and floating-point performance - targeting industrial control, sensor hubs, and portable instrumentation.
FAQ
What is the maximum operating frequency of the MK22FN256VLL12?
The MK22FN256VLL12 features an ARM Cortex-M4 core with FPU rated for up to 120 MHz operation. This frequency is achievable using the PLL with a 3–32 MHz external crystal or the internal 48 MHz IRC, subject to voltage (1.71–3.6 V) and temperature (-40°C to 105°C) compliance per the datasheet's AC electrical characteristics section.
Does the MK22FN256VLL12 support crystal-less USB full-speed operation?
Yes, the MK22FN256VLL12 supports USB full-speed (12 Mbps) device mode without an external 48 MHz crystal. It uses its factory-trimmed 48 MHz internal reference clock (IRC) with ±0.25% accuracy, enabling simplified USB device designs and reduced BOM cost - confirmed in the "Communication Interfaces" and "USB electrical specifications" sections of the datasheet.
How many analog-to-digital converters does the MK22FN256VLL12 integrate?
The MK22FN256VLL12 integrates two independent 16-bit successive approximation register (SAR) ADC modules. Each supports up to 1.2 million samples per second in 12-bit mode, with configurable resolution (8–16 bit), hardware averaging, and programmable delay blocks for synchronized sampling - detailed in Section 3.6.1 of the datasheet.
What low-power modes are available on the MK22FN256VLL12, and what is the lowest current draw?
The MK22FN256VLL12 offers seven low-power modes, including VLLS0 (Very Low-Leakage Stop 0). With POR detect circuit disabled, VLLS0 draws as low as 120 nA at 3.0 V and 25°C - verified in Table 6 of the datasheet. Full state retention and 6 µs wakeup time are maintained, making it suitable for battery-powered wake-on-event applications.
Is the MK22FN256VLL12 pin-compatible with other K22F variants like MK22FN256VDC12?
No, the MK22FN256VLL12 (100-pin LQFP) is not pin-compatible with MK22FN256VDC12 (121-pin XFBGA) or MK22FN256VMP12 (64-pin MAPBGA). Pin assignments, package dimensions, and thermal characteristics differ significantly across these variants - refer to package drawings 98ASA00595D (VLL12), 98ASA00420D (VDC12), and 98ASA00420D (VMP12) for mechanical validation.
MK22FN256VLL12 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LQFP
- Series:
- Kinetis K20
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 66
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 48K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 33x16b; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK22FN256VLL12 FAQ
1.How can I place an order for MK22FN256VLL12 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK22FN256VLL12 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK22FN256VLL12 reliable?
The price and inventory of MK22FN256VLL12 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK22FN256VLL12 is usually 5 days.
3.What payment methods are accepted for MK22FN256VLL12?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK22FN256VLL12 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK22FN256VLL12?
MK22FN256VLL12 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK22FN256VLL12 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK22FN256VLL12?
For technical support, including MK22FN256VLL12 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK22FN256VLL12 requirements.
6.How does Aetrix verify that MK22FN256VLL12 is sourced from the original manufacturer or authorized distributors?
All MK22FN256VLL12 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK22FN256VLL12 meets industry standards.
7.What is the process for return or replacement of MK22FN256VLL12?
All MK22FN256VLL12 units undergo pre-shipment inspection (PSI). If there is an issue with MK22FN256VLL12, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK22FN256VLL12 part is unused and in its original packaging.
Return procedure for MK22FN256VLL12:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MK22FN256VLL12 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

