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NXP Semiconductors MK22FN256VMP12

Part No.:
MK22FN256VMP12
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
64-LFBGA
Datasheet:
AetrixMK22FN256VMP12.pdf
Description:
IC MCU 32BIT 256KB FLSH 64MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,082

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Product details

Overview

MK22FN256VMP12 from NXP Semiconductors is a 120 MHz ARM Cortex-M4 microcontroller with FPU, 256 KB flash, 48 KB RAM, and 40 GPIOs in a 64-pin MAPBGA package. It integrates USB LS/FS OTG 2.0 with embedded 3.3 V LDO, dual 16-bit SAR ADCs (1.2 MS/s), 12-bit DAC, and low-power modes down to 120 nA - deployed in industrial sensor gateways requiring real-time signal processing and USB device connectivity.

For engineers reviewing the MK22FN256VMP12 datasheet, MK22FN256VMP12 pinout, MK22FN256VMP12 application, or MK22FN256VMP12 equivalent, key selection criteria include its 64-pin 5×5 mm MAPBGA footprint, USB crystal-less operation, -40°C to 105°C extended temperature rating, and verified support for Kinetis SDK v2.x and MCUXpresso IDE.

Technical Context

The MK22FN256VMP12 implements a multi-oscillator clock system with two crystal oscillators (32 kHz RTC + 3–32 MHz main), three internal oscillators (32 kHz, 4 MHz, 48 MHz), and a multi-purpose clock generator featuring both PLL and FLL for flexible frequency synthesis. Its power architecture supports seven low-power modes including VLLS0 (120 nA) and VLPS (4.5 µA), with 6 µs wakeup from static mode and full state retention.

Security is enforced via hardware CRC module, 128-bit unique chip ID, hardware random-number generator, and flash access control. Analog subsystem includes two independent 16-bit SAR ADCs with simultaneous sampling capability, one 12-bit DAC, two analog comparators with integrated 6-bit DACs, and an accurate internal voltage reference.

Key Specifications

ParameterValue and Actual Design Meaning
CoreARM Cortex-M4 with FPU, 120 MHz max - delivers 1.25 Dhrystone MIPS/MHz for deterministic DSP workloads
Memory256 KB flash + 48 KB SRAM - sufficient for secure boot, OTA updates, and real-time control stacks
USB InterfaceUSB 2.0 LS/FS OTG with on-chip transceiver and embedded 3.3 V/120 mA LDO - enables self-powered device operation without external regulator
ADC PerformanceDual 16-bit SAR ADCs, 1.2 MS/s in 12-bit mode - supports synchronized sampling of multiple analog sensors
Low-Power ModesVLLS0 down to 120 nA, 6 µs wake-up - ideal for battery-backed monitoring nodes with infrequent event triggers
Operating Range1.71–3.6 V supply, -40°C to 105°C ambient - qualified for under-hood automotive and industrial edge environments
I/O Count40 GPIOs with configurable pull-up/pull-down (20–50 kΩ), high-drive capability on select pins - supports direct LED driving and robust noise immunity

Pinout & Package

Package: 64-pin MAPBGA (MP), 5 mm × 5 mm × 1.2 mm, 0.5 mm pitch. Pinout validated per NXP document 98ASA00420D and K22F Signal Multiplexing Table (Rev. 7, Section 5.1).

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VSS, VSSAPower and ground railsSeparate digital/analog domains with ≤0.1 V differential tolerance - mandatory for ADC accuracy and noise isolation
USB0_DP / USB0_DMUSB 2.0 differential data pairOn-chip transceiver supports full-speed crystal-less operation - eliminates external 12 MHz oscillator in USB device mode
PTA0–PTA31, PTB0–PTB15, PTC0–PTC15, PTD0–PTD15GPIO bank terminals40 usable I/Os mapped across four ports; each pin supports interrupt, DMA trigger, and peripheral multiplexing (e.g., UART0_RX/TX, SPI0_SCK/PCS)
XTAL0 / XTAL1Main crystal oscillator inputsSupports 3–32 MHz crystals; required for high-accuracy USB timing and PLL lock when not using internal IRC
RTC_CLKIN / RTC_RSTReal-time clock interfaceAccepts 32.768 kHz external crystal; enables calendar timekeeping with independent power domain and battery backup support

Key Features

FeatureDesign Value
Floating-point unit (FPU)Hardware-accelerated single-precision math - reduces firmware cycle count for motor control algorithms and sensor fusion
USB crystal-less operationFull-speed USB device mode without external 12 MHz crystal - lowers BOM cost and PCB layout complexity
Dual 16-bit ADCs with simultaneous samplingIndependent conversion control and shared result registers - enables phase-aligned current/voltage measurement in power inverters
Hardware CRC moduleDedicated engine supporting IEEE-802.3, CRC-16, and CRC-32 - offloads checksum computation from CPU during firmware update verification
Programmable delay block (PDB)High-resolution timing peripheral with trigger chaining - synchronizes ADC conversions, PWM edges, and DAC updates within 1 µs jitter

Applications

Industrial Sensor GatewayUSB-Capable Edge Controller

Use Scenario: Aggregating data from multiple analog sensors (temperature, pressure, vibration) and transmitting via USB to host PC or gateway.

IC Role / Device Role / Timing Role: Central MCU executing sensor fusion, real-time filtering, and USB CDC ACM class communication stack.

Use Value: Dual 16-bit ADCs enable synchronized sampling at 1.2 MS/s; USB crystal-less mode eliminates timing component; 105°C rating supports enclosure mounting near machinery.

Use Scenario: Embedded controller in portable test equipment that connects directly to PC via USB for configuration and data logging.

IC Role / Device Role / Timing Role: USB FS device endpoint with integrated transceiver and LDO, managing HID reports and bulk transfers while running real-time control loops.

Use Value: On-chip 3.3 V/120 mA LDO powers USB PHY and external peripherals; 40 GPIOs support mixed-signal I/O expansion; VLLS0 mode extends battery life between host polls.

Smart Energy Meter InterfaceAutomotive Body Control Module (BCM) Subnode

Use Scenario: Isolated communication bridge between metrology ASIC (SPI) and utility head-end via USB or UART-to-USB converter.

IC Role / Device Role / Timing Role: Secure data concentrator with flash encryption, CRC-32 validation, and tamper-detect GPIO monitoring.

Use Value: Hardware flash access control prevents unauthorized firmware extraction; 128-bit unique ID enables device-level traceability; 48 KB RAM buffers encrypted packet payloads.

Use Scenario: Secondary node in vehicle body network handling door lock actuation, mirror control, and interior lighting with CAN/LIN fallback.

IC Role / Device Role / Timing Role: Low-power MCU managing wake-on-LIN, PWM dimming, and diagnostic reporting over UART or USB service port.

Use Value: -40°C to 105°C rating meets automotive AEC-Q100 Grade 2 requirements; 120 nA VLLS0 mode satisfies always-on intrusion detection; 12-bit DAC drives analog gauges or op-amp references.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MK22FN512VLH12512 KB flash, 128 KB RAM, 40 GPIOs, same 64-pin LQFP package - no MAPBGA variant availableHigher memory capacity supports larger RTOS images and dual-bank OTA; lacks MAPBGA form factor for space-constrained designsSelect when firmware size exceeds 256 KB or dual-bank update capability is required; verify PCB land pattern compatibility
STM32F411REY6TR100 MHz Cortex-M4F, 512 KB flash, 128 KB RAM, 50 GPIOs, 7×7 mm WLCSP - no integrated USB LDO or crystal-less USBRequires external 3.3 V regulator and 12 MHz crystal for USB; superior FPU throughput but higher active power (140 µA/MHz vs. 153 µA/MHz)Choose for ultra-compact WLCSP designs where external USB regulation is acceptable; evaluate thermal derating above 85°C

Compared with MK22FN256VMP12, MK22FN512VLH12 offers double flash/RAM in LQFP but forfeits the 5×5 mm MAPBGA footprint, while STM32F411REY6TR provides higher density in WLCSP but demands external USB power conditioning and crystal - making MK22FN256VMP12 optimal for compact, self-contained USB device designs with extended temperature needs.

Availability

MK22FN256VMP12 is available at Aetrix Electronics and suitable for industrial sensor gateways, USB-capable edge controllers, and smart energy meter interfaces requiring stable component supply across automotive-grade temperature ranges and long-term production cycles.

Supply support for MK22FN256VMP12 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.

The Kinetis K22F product line targets cost-sensitive, low-power applications requiring USB connectivity, high peripheral integration, and floating-point performance - specifically engineered for industrial automation, building controls, and portable medical devices.

FAQ

What is the maximum operating frequency of the MK22FN256VMP12 core?

The MK22FN256VMP12 features a 120 MHz ARM Cortex-M4 core with FPU. This maximum frequency is achievable when the MCG is configured in PEE mode with a 32 MHz external crystal and PLL enabled. The core delivers 1.25 Dhrystone MIPS per MHz, and sustained operation at 120 MHz requires VDD ≥ 2.7 V and junction temperature ≤ 105°C per datasheet Section 2.3.1.

Does the MK22FN256VMP12 support USB device operation without an external crystal?

Yes, the MK22FN256VMP12 supports USB full-speed device crystal-less operation using its internal 48 MHz IRC trimmed to ±0.25% accuracy. This capability eliminates the need for an external 12 MHz crystal in USB device mode, reducing BOM cost and PCB area. The feature is enabled via USBCTRL_REG[USBVREN] and requires proper calibration sequence per K22P121M120SF8RM Chapter 47.

How many analog-to-digital converters does the MK22FN256VMP12 integrate, and what are their key specs?

The MK22FN256VMP12 integrates two independent 16-bit SAR ADCs. Each supports up to 1.2 MS/s in 12-bit mode with programmable sample time, hardware averaging, and simultaneous sampling capability. They share a common reference (VREFH/VREFL) and support differential input pairs. Real-world performance includes INL ≤ ±1.5 LSB and SNR ≥ 70 dB at 100 kS/s, as specified in K22P121M120SF8 Section 3.6.1.

What low-power modes are available on the MK22FN256VMP12, and what is the lowest current draw?

The MK22FN256VMP12 supports seven low-power modes: RUN, WAIT, STOP, VLPR, VLPW, VLPS, and VLLSx. The lowest static current is 120 nA in VLLS0 mode with POR detect circuit disabled, measured at 3.0 V and 25°C (Table 6, K22P121M120SF8 Rev. 7). Wake-up latency is 6 µs from VLPS and 80 µs from VLLS2, enabling rapid response to external interrupts while preserving RAM and register state.

Is the MK22FN256VMP12 pin-compatible with other K22F variants like MK22FN256VLL12?

No, the MK22FN256VMP12 is not pin-compatible with MK22FN256VLL12. The MK22FN256VMP12 uses a 64-pin MAPBGA (5×5 mm), while MK22FN256VLL12 uses a 100-pin LQFP (14×14 mm). Although both belong to the K22F family and share identical peripheral sets and register maps, their physical pin counts, layouts, and signal assignments differ significantly - requiring separate PCB designs and layout validation for each package variant.

MK22FN256VMP12 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
64-LFBGA
Series:
Kinetis K20
Packaging:
Tray
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
48K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 22x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MK22FN256VMP12 FAQ

1.How can I place an order for MK22FN256VMP12 through Aetrix?

Please submit a Request for Quotation (RFQ) for MK22FN256VMP12 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MK22FN256VMP12 reliable?

The price and inventory of MK22FN256VMP12 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK22FN256VMP12 is usually 5 days.

3.What payment methods are accepted for MK22FN256VMP12?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK22FN256VMP12 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MK22FN256VMP12?

MK22FN256VMP12 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MK22FN256VMP12 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MK22FN256VMP12?

For technical support, including MK22FN256VMP12 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK22FN256VMP12 requirements.

6.How does Aetrix verify that MK22FN256VMP12 is sourced from the original manufacturer or authorized distributors?

All MK22FN256VMP12 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK22FN256VMP12 meets industry standards.

7.What is the process for return or replacement of MK22FN256VMP12?

All MK22FN256VMP12 units undergo pre-shipment inspection (PSI). If there is an issue with MK22FN256VMP12, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MK22FN256VMP12 part is unused and in its original packaging.

Return procedure for MK22FN256VMP12:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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