NXP Semiconductors MK22FN512CBP12R

Overview

MK22FN512CBP12R from NXP Semiconductors is a 120 MHz ARM® Cortex®-M4 microcontroller with FPU, 512 KB flash, 128 KB RAM, and 52 GPIOs in an 80-pin WLCSP package. It integrates USB LS/FS OTG 2.0 with embedded 3.3 V/120 mA LDO, dual 16-bit SAR ADCs (1.2 MS/s), and low-power operation down to 140 nA in VLLS0 mode with POR detect disabled. It targets space-constrained industrial sensor nodes requiring USB connectivity and deterministic real-time control.

For engineers reviewing the MK22FN512CBP12R datasheet, MK22FN512CBP12R pinout, MK22FN512CBP12R application, or MK22FN512CBP12R equivalent, key selection criteria include its 80-pin WLCSP footprint (4.13 × 3.56 × 0.321 mm, 0.4 mm pitch), USB crystal-less FS device support, 120 MHz M4+FPU performance (1.25 DMIPS/MHz), -40°C to +85°C operating range, and verified low-power modes including 3.8 µA LLS3 with full state retention.

Technical Context

The MK22FN512CBP12R implements a multi-layer bus architecture with AHB and APB interconnects, supporting concurrent execution of CPU, DMA, and peripheral operations. Its clock system combines a PLL (up to 120 MHz), FLL, and three internal oscillators (32 kHz, 4 MHz, 48 MHz) plus dual external crystal inputs (32 kHz RTC and 3–32 MHz main).

Power management includes eight low-power modes (RUN, VLPR, STOP, VLPS, LLS, VLLS) with configurable wake-up sources including GPIO, RTC alarm, and analog comparators. The USB OTG module operates in host/device/OTG roles with on-chip transceiver and integrated LDO, enabling crystal-less full-speed device operation using the internal 48 MHz IRC.

Key Specifications

Pinout & Package

Package: 80-ball WLCSP (Wafer-Level Chip Scale Package), 4.13 mm × 3.56 mm × 0.321 mm, 0.4 mm ball pitch, Pb-free and RoHS compliant. Ball map follows K22F 80-pin signal multiplexing per NXP document 98ASA00820D.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with MK22FN512CAP12R and MK64FN1M0VLL12, the MK22FN512CBP12R uniquely balances ultra-compact WLCSP packaging, verified 140 nA ultra-low-power operation, and crystal-less USB FS functionality - making it the only option among the three for thin-profile, battery-operated USB peripherals.

Availability

MK22FN512CBP12R is available at Aetrix Electronics and suitable for industrial sensor nodes, USB data loggers, smart meter communication modules, and low-power human-machine interfaces requiring stable component supply across extended product lifecycles.

Supply support for MK22FN512CBP12R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.

The Kinetis K22F product line was designed specifically for cost-sensitive, space-constrained industrial and consumer applications demanding low-power operation, USB connectivity, and floating-point performance - directly embodied by the MK22FN512CBP12R.

FAQ

What is the package type and physical size of the MK22FN512CBP12R?

The MK22FN512CBP12R uses an 80-ball Wafer-Level Chip Scale Package (WLCSP) measuring 4.13 mm × 3.56 mm × 0.321 mm with 0.4 mm ball pitch. This ultra-thin profile is defined in NXP package drawing 98ASA00820D and distinguishes it from the taller CAP12R variant (0.564 mm height). The BP suffix explicitly denotes the low-height WLCSP configuration used in the MK22FN512CBP12R.

Does the MK22FN512CBP12R support crystal-less USB full-speed device operation?

Yes, the MK22FN512CBP12R supports crystal-less USB full-speed device operation using its internal 48 MHz IRC clock source, as confirmed in the K22F data sheet (Rev. 7, Section 3.8.1). This eliminates the need for an external 12 MHz crystal in USB peripheral designs, reducing BOM cost and PCB area - a key feature of the MK22FN512CBP12R's USB OTG subsystem.

What is the lowest achievable power consumption mode for the MK22FN512CBP12R?

The MK22FN512CBP12R achieves 140 nA in Very-Low-Leakage Stop Mode 0 (VLLS0) with POR detect circuit disabled, as specified in Table 6 of the K22F data sheet (Rev. 7). This mode retains RAM and register contents while disabling all clocks except optional 32 kHz sources, making it the deepest low-power state supported by the MK22FN512CBP12R for battery-critical applications.

How many analog-to-digital converters does the MK22FN512CBP12R integrate, and what are their key specifications?

The MK22FN512CBP12R integrates two independent 16-bit successive approximation register (SAR) ADCs, each capable of 1.2 million samples per second in 12-bit mode. Both ADCs support hardware averaging, programmable sample time, and flexible trigger sources including PDB and timers - capabilities fully documented for the MK22FN512CBP12R in Section 3.6.1 of the K22F data sheet.

Is the MK22FN512CBP12R pin-compatible with other K22F family members like MK22FN512CAP12R?

Yes, the MK22FN512CBP12R is ball-for-ball compatible with MK22FN512CAP12R - both use identical 80-pin WLCSP footprints and signal assignments per NXP's K22F pinout documentation. However, the BP variant has a reduced package height (0.321 mm vs. 0.564 mm), so mechanical clearance and solder paste stencil design must be validated separately for the MK22FN512CBP12R.