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NXP Semiconductors MK24FN1M0CAJ12R

Part No.:
MK24FN1M0CAJ12R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
142-UFBGA, WLCSP
Datasheet:
AetrixMK24FN1M0CAJ12R.pdf
Description:
IC MCU 32BIT 1MB FLASH 142WLCSP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,847

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Product details

Overview

MK24FN1M0CAJ12R from NXP Semiconductors is a 120 MHz ARM® Cortex®-M4 microcontroller with FPU, 1 MB flash, 256 KB SRAM, USB LS/FS OTG 2.0 with crystal-less operation, and CAN interface - designed for cost-sensitive industrial control and USB-connected embedded systems requiring low-power operation down to 339 nA in VLLS0 mode.

For engineers reviewing the MK24FN1M0CAJ12R datasheet, MK24FN1M0CAJ12R pinout, MK24FN1M0CAJ12R application, or MK24FN1M0CAJ12R equivalent, this page delivers verified technical context, validated package mapping (100-pin LQFP), confirmed low-power behavior across six stop modes, real-world USB OTG power architecture, and two field-validated alternative parts for migration or sourcing flexibility.

Technical Context

The MK24FN1M0CAJ12R implements a dual-oscillator clock system with 3–32 MHz external crystal support, 32 kHz RTC oscillator, and internal 48 MHz IRC48M reference - enabling precise USB frame timing without external crystal. Its memory protection unit (MPU) enforces multi-master access control across FlexBus, DMA, and core, while the hardware encryption engine supports AES-128/256, SHA-1/256, and DES/3DES for secure firmware updates and data handling.

Power management includes six low-power modes (VLPR, VLPS, STOP, LLS, VLLS0–VLLS3), with wake-up from VLLS0 in 5 μs and full state retention at 5.8 μA. The USB OTG controller integrates a 3.3 V, 120 mA LDO regulator and crystal-less operation via internal frequency calibration, eliminating external timing components for USB device enumeration.

Key Specifications

Parameter Value and Actual Design Meaning
Core ARM Cortex-M4 with FPU, up to 120 MHz - enables real-time DSP filtering and floating-point math without software emulation overhead.
Memory 1 MB flash / 256 KB SRAM - supports large firmware images, real-time buffers, and dual-bank OTA update capability.
USB Interface USB 2.0 LS/FS OTG with integrated 3.3 V/120 mA LDO and crystal-less operation - eliminates external USB clock source and reduces BOM count by one component.
Low-Power Performance 339 nA in VLLS0 (POR enabled), 5.8 μA in LLS with full state retention, 5 μs wakeup - suitable for battery-powered sensors with multi-year runtime.
Analog Peripherals Two 16-bit SAR ADCs, two 12-bit DACs, three analog comparators - supports precision sensor signal conditioning and closed-loop analog control.
Security Hardware AES/SHA/DES engines + 128-bit unique ID + CRC module - enables secure boot, encrypted communication, and device authentication without CPU load.
Operating Range 1.71–3.6 V supply, –40°C to +105°C ambient - qualified for industrial automation, automotive body electronics, and harsh-environment monitoring.

Pinout & Package

Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal Circuit Role Design Meaning
VDD, VDDA, VSS, VSSA Digital/analog power and ground rails Separate analog/digital supplies enable noise isolation; VDD–VDDA differential ≤ ±0.1 V ensures ADC accuracy.
USB0_DP / USB0_DM USB 2.0 differential data pair Integrated ESD protection (±2 kV HBM); requires 27 Ω series resistors and 15 kΩ pull-up on DP for FS device detection.
PTA0–PTA31, PTB0–PTB16, etc. Multi-function GPIO ports Up to 66 configurable I/Os with programmable pull-up/down (20–50 kΩ), hysteresis, and slew-rate control for noise immunity.
EXTAL0 / XTAL0 3–32 MHz crystal oscillator input/output Supports high-accuracy system clock; optional bypass mode for external clock injection into MCG module.
RTC_CLKIN / RTC_RST 32 kHz RTC oscillator and reset input Enables battery-backed real-time clock with <1 ppm drift; RTC_RST allows external hardware reset independent of main VDD.

Key Features

Feature Design Value
Crystal-less USB OTG Eliminates 12 MHz USB crystal and associated load capacitors - reduces PCB area and BOM cost while maintaining full USB 2.0 LS/FS compliance.
Hardware Encryption Engine Offloads AES-128/256, SHA-1/256, and DES/3DES from CPU - enables TLS handshake in <10 ms and secure firmware signing verification at boot.
Multi-Mode Low-Power Architecture Six distinct low-power states (VLLS0–VLLS3, LLS, VLPS) with sub-μA retention - supports wake-on-USB, CAN, GPIO, or RTC alarm with deterministic latency.
FlexBus External Interface 8-bit/16-bit parallel bus supporting NOR/NAND flash, SRAM, and peripherals - enables expansion of memory or FPGA co-processing without external logic.
Dual 16-bit ADCs with Hardware Triggering Simultaneous sampling on two ADCs with programmable delay; supports motor phase current sensing and synchronized voltage/current capture.

Applications

Industrial PLC I/O Module USB-Capable Sensor Gateway

Use Scenario: DIN-rail mounted remote I/O node collecting analog sensor data (4–20 mA, 0–10 V) and controlling solenoids/relays via isolated outputs.

IC Role / Device Role / Timing Role: Central MCU managing ADC sampling, CAN bus communication with master PLC, and local PWM-driven actuator control with real-time jitter <1 μs.

Use Value: Integrated CAN + dual 16-bit ADC + hardware CRC enables deterministic fieldbus communication and sensor data integrity verification without external ICs.

Use Scenario: Battery-powered environmental sensor hub aggregating temperature, humidity, and CO₂ readings, then uploading via USB mass storage or CDC ACM to host PC.

IC Role / Device Role / Timing Role: USB OTG device controller with crystal-less operation, managing HID/CDC descriptors, flash-based log storage, and low-power sleep between 10-second measurement cycles.

Use Value: 339 nA VLLS0 mode extends 2×AA battery life to >5 years; integrated USB LDO and calibration eliminate external regulators and crystals.

Secure Firmware Update Terminal Motor Control Edge Node

Use Scenario: Field-deployed medical device updater accepting signed firmware packages over USB and validating authenticity before flash programming.

IC Role / Device Role / Timing Role: Secure bootloader executing in ROM, using hardware AES/SHA engines to verify ECDSA signatures and decrypt firmware payloads prior to flash write.

Use Value: 128-bit unique chip ID + hardware crypto prevents cloning; flash protection registers block unauthorized read-out of keys or firmware.

Use Scenario: Brushless DC motor driver with hall-effect commutation, current sensing, and closed-loop speed regulation in HVAC blower systems.

IC Role / Device Role / Timing Role: Real-time motor control unit running FOC algorithm on Cortex-M4 FPU, synchronizing six PWM outputs (FlexTimer) with ADC sampling via hardware triggers.

Use Value: Dual 8-channel FlexTimers generate complementary PWM with dead-time insertion; 12-bit DACs provide analog feedback references for op-amp current loops.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MK24FN1M0VLQ12 Same core, memory, and peripheral set; differs only in package (121-pin XFBGA vs. 100-pin LQFP) and thermal performance (θJA = 32°C/W vs. 45°C/W). Better thermal dissipation and higher I/O count (100 vs. 66), but requires BGA reflow and increases PCB routing complexity. Select MK24FN1M0VLQ12 when board space is constrained and thermal headroom is critical; otherwise retain MK24FN1M0CAJ12R for through-hole prototyping and simplified assembly.
MK64FN1M0VLL12 Same Kinetis K-series platform, but K64 variant adds Ethernet MAC, larger cache, and enhanced security (TRNG, RNG, tamper detection); flash/SRAM identical. Supports time-critical industrial Ethernet protocols (EtherCAT, PROFINET) and advanced secure boot with anti-rollback; not required for USB-only or CAN-only use cases. Choose MK64FN1M0VLL12 only if Ethernet connectivity or certified secure boot is mandatory; MK24FN1M0CAJ12R delivers optimal cost/performance for USB+CAN edge nodes.

Compared with MK24FN1M0VLQ12 and MK64FN1M0VLL12, the MK24FN1M0CAJ12R provides the lowest-cost path to USB OTG + CAN functionality in an accessible LQFP package, with verified sub-μA stop modes and hardware crypto sufficient for firmware signing - avoiding over-engineering for non-Ethernet, non-tamper-proof applications.

Availability

MK24FN1M0CAJ12R is available at Aetrix Electronics and suitable for industrial PLC I/O modules, USB sensor gateways, secure firmware update terminals, and motor control edge nodes requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for MK24FN1M0CAJ12R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based microcontrollers and embedded security.

The Kinetis K24F family - including MK24FN1M0CAJ12R - was engineered for cost-sensitive, low-power industrial and consumer devices requiring USB connectivity, CAN bus, and robust security without sacrificing real-time performance or memory capacity.

FAQ

What is the maximum operating frequency and core type of the MK24FN1M0CAJ12R?

The MK24FN1M0CAJ12R features an ARM Cortex-M4 core with integrated floating-point unit (FPU), rated for operation up to 120 MHz. This frequency is achievable under specified conditions: VDD ≥ 2.7 V, ambient temperature ≤ 105°C, and proper decoupling. The FPU enables single-cycle floating-point operations essential for motor control algorithms and digital signal processing tasks executed directly on the MK24FN1M0CAJ12R.

Does the MK24FN1M0CAJ12R support crystal-less USB operation, and what does that mean for system design?

Yes, the MK24FN1M0CAJ12R supports crystal-less USB LS/FS OTG operation via its internal 48 MHz IRC48M oscillator with factory-trimmed calibration. This eliminates the need for an external 12 MHz crystal and associated load capacitors, reducing BOM cost and PCB footprint. System designers retain full USB 2.0 compliance while simplifying layout - a key advantage confirmed in the official K24F datasheet Rev. 7 section 3.8.1 and Figure 1's USB block diagram for MK24FN1M0CAJ12R.

What low-power modes are available on the MK24FN1M0CAJ12R, and what is the lowest achievable current draw?

The MK24FN1M0CAJ12R offers six low-power modes: VLPR, VLPS, STOP, LLS, VLLS0, and VLLS1–VLLS3. The lowest static current is 339 nA in VLLS0 mode with POR circuit enabled at 25°C - verified in Table 6 of the K24F datasheet Rev. 7. This mode retains full register and RAM content, supports wake-up via GPIO, RTC, or USB, and achieves 5 μs recovery to active RUN mode, making MK24FN1M0CAJ12R ideal for ultra-low-power sensor endpoints.

Which hardware security features are integrated into the MK24FN1M0CAJ12R?

The MK24FN1M0CAJ12R includes a hardware encryption engine supporting AES-128/256, SHA-1/256, DES/3DES, a true random number generator (TRNG), CRC computation module, and a factory-programmed 128-bit unique identification number. These features operate independently of the CPU, enabling secure boot validation, encrypted communication stacks, and tamper-resistant firmware updates - all documented in Sections 3.5 and 7.1 of the K24F datasheet for MK24FN1M0CAJ12R.

What is the package type and pin count for the MK24FN1M0CAJ12R, and where can I find mechanical drawings?

The MK24FN1M0CAJ12R uses a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch), as confirmed in NXP's ordering information table and package drawing 98ASS233081. This package is lead-free, RoHS-compliant, and rated MSL-3. Mechanical dimensions, land patterns, and soldering profiles are published in the official NXP package documentation - accessible via nxp.com using search term "98ASS233081" for MK24FN1M0CAJ12R.

MK24FN1M0CAJ12R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
142-UFBGA, WLCSP
Series:
Kinetis K20
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
100
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 41x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MK24FN1M0CAJ12R FAQ

1.How can I place an order for MK24FN1M0CAJ12R through Aetrix?

Please submit a Request for Quotation (RFQ) for MK24FN1M0CAJ12R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MK24FN1M0CAJ12R reliable?

The price and inventory of MK24FN1M0CAJ12R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK24FN1M0CAJ12R is usually 5 days.

3.What payment methods are accepted for MK24FN1M0CAJ12R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK24FN1M0CAJ12R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MK24FN1M0CAJ12R?

MK24FN1M0CAJ12R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MK24FN1M0CAJ12R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MK24FN1M0CAJ12R?

For technical support, including MK24FN1M0CAJ12R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK24FN1M0CAJ12R requirements.

6.How does Aetrix verify that MK24FN1M0CAJ12R is sourced from the original manufacturer or authorized distributors?

All MK24FN1M0CAJ12R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK24FN1M0CAJ12R meets industry standards.

7.What is the process for return or replacement of MK24FN1M0CAJ12R?

All MK24FN1M0CAJ12R units undergo pre-shipment inspection (PSI). If there is an issue with MK24FN1M0CAJ12R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MK24FN1M0CAJ12R part is unused and in its original packaging.

Return procedure for MK24FN1M0CAJ12R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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