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NXP Semiconductors MK24FN1M0VDC12

Part No.:
MK24FN1M0VDC12
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
121-XFBGA
Datasheet:
AetrixMK24FN1M0VDC12.pdf
Description:
IC MCU 32BIT 1MB FLASH 121XFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,262

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Product details

Overview

MK24FN1M0VDC12 from NXP Semiconductors is a 120 MHz ARM® Cortex®-M4 microcontroller with FPU, 1 MB flash, 256 KB SRAM, and USB LS/FS OTG 2.0 with crystal-less operation. It delivers 250 μA/MHz run power consumption, 5.8 μA static current with full state retention, and operates from 1.71–3.6 V across –40 to 105°C. It targets cost-sensitive industrial control and USB-connected sensor hubs requiring low-power real-time processing.

For engineers reviewing the MK24FN1M0VDC12 datasheet, MK24FN1M0VDC12 pinout, MK24FN1M0VDC12 application, or MK24FN1M0VDC12 equivalent, key selection factors include its 83 GPIO count in 100-pin LQFP, integrated hardware encryption (AES/SHA-256), dual 16-bit ADCs, CAN 2.0B interface, and support for multiple low-power modes including VLLS0 at 339 nA.

Technical Context

The MK24FN1M0VDC12 implements an ARM Cortex-M4 core with DSP extensions and single-precision floating-point unit, clocked up to 120 MHz via PLL or FLL. Its memory subsystem includes 1 MB on-chip flash with error correction and 256 KB SRAM with MPU protection across multiple masters.

Peripheral integration includes a USB OTG controller with embedded 3.3 V/120 mA LDO and crystal-less mode, one CAN 2.0B module, six UARTs, three I²C interfaces (up to 1 Mbit/s), three SPI modules, SDHC, I²S, two 12-bit DACs, and three analog comparators - all accessible through configurable pin multiplexing on the 100-pin LQFP package.

Key Specifications

ParameterValue and Actual Design Meaning
CoreARM Cortex-M4 with FPU and DSP instructions, 120 MHz max - enables real-time signal processing and floating-point math without external coprocessor.
Memory1 MB flash + 256 KB SRAM - supports complex firmware, OTA updates, and large data buffers for sensor fusion or protocol stacks.
USB InterfaceUSB 2.0 LS/FS OTG with embedded 3.3 V/120 mA LDO and crystal-less operation - eliminates external oscillator, reduces BOM cost and board space.
Power Efficiency250 μA/MHz run, 5.8 μA static with full state retention, 339 nA VLLS0 - extends battery life in portable or energy-harvested edge nodes.
Analog PeripheralsTwo 16-bit SAR ADCs, two 12-bit DACs, three analog comparators - supports high-resolution sensing, closed-loop control, and analog monitoring without external converters.
Crypto AccelerationHardware AES, SHA-1/SHA-256, DES/3DES, CRC, and RNG - accelerates secure boot, TLS handshake, and firmware authentication in resource-constrained devices.
Operating Range1.71–3.6 V supply, –40 to 105°C ambient - suitable for industrial automation, automotive body electronics, and outdoor IoT gateways.

Pinout & Package

Package: 100-pin LQFP (14 × 14 × 1.7 mm, 0.5 mm pitch). Pinout validated per NXP document 98ASS233081 and K24P144M120SF5RM Rev. 7 Section 5.3.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VSS, VSSADigital/analog power and ground railsSeparate analog/digital supplies enable noise isolation for precision ADC/DAC operation; differential voltage tolerance ±0.1 V ensures robustness.
PTA0–PTA31, PTB0–PTB16, etc.GPIO with multiplexed peripheral functions83 total GPIOs support flexible signal routing; each pin configurable as UART/I²C/SPI/CAN/ADC input or PWM output.
USB0_DP / USB0_DMUSB 2.0 differential data linesIntegrated ESD protection and series termination reduce external component count; compatible with USB IF compliance testing.
CAN0_TX / CAN0_RXCAN 2.0B bus transceiver interfaceDirect connection to external CAN transceiver (e.g., TJA1042); supports bit rates up to 1 Mbps with programmable timing.
ADC0_SE0–ADC0_SE15, ADC1_SE0–ADC1_SE15Analog input channels for dual 16-bit SAR ADCs32 total analog inputs with programmable gain and sampling control; supports simultaneous sampling and hardware trigger synchronization.
RTC_CLKIN / RTC_RSTReal-time clock oscillator and reset inputsSupports external 32.768 kHz crystal or internal LPO; enables precise timekeeping and wake-from-VLLS with <5 μs latency.

Key Features

FeatureDesign Value
Floating-point unit (FPU)Single-precision IEEE 754 compliance enables deterministic motor control algorithms and sensor fusion without software emulation overhead.
FlexTimer modulesFour independent FlexTimer units (two 8-channel, two 2-channel) support PWM generation, quadrature decoding, and input capture with dead-time insertion for BLDC drives.
Memory Protection Unit (MPU)Multi-master protection enforces privilege levels and memory region access rules - critical for certified safety applications (IEC 61508 SIL-2).
Secure Digital Host Controller (SDHC)Full-speed SD/MMC interface with DMA support allows local data logging to removable media without CPU intervention.
Low-leakage wakeup unitConfigurable digital and analog wakeup sources (GPIO, comparator, RTC alarm) enable selective peripheral activation while maintaining sub-μA sleep currents.

Applications

Industrial PLC I/O ModuleUSB-Capable Medical Sensor Hub

Use Scenario: Compact DIN-rail-mounted remote I/O node collecting analog sensor data and controlling solenoids/relays in factory automation.

IC Role / Device Role / Timing Role: Central MCU executing real-time control loop, managing CAN fieldbus communication, and driving isolated digital outputs via GPIO expansion.

Use Value: Dual 16-bit ADCs provide 0.0015% FS resolution for pressure/temperature measurement; 83 GPIOs eliminate need for I/O expanders; CAN + USB dual-interface enables both fieldbus and PC configuration.

Use Scenario: Portable patient monitor aggregating ECG, SpO₂, and temperature signals, then streaming encrypted data to host PC via USB.

IC Role / Device Role / Timing Role: Primary controller handling analog front-end digitization, cryptographic signing of sensor data, and USB CDC/DFU class enumeration.

Use Value: Hardware AES/SHA-256 accelerates HIPAA-compliant data signing; crystal-less USB reduces bill-of-materials; 256 KB SRAM buffers multi-channel waveform data before transmission.

Automotive Body Control ModuleSmart Building Environmental Gateway

Use Scenario: Low-power gateway managing door locks, lighting, and HVAC actuators in 12 V vehicle electrical systems with load-dump protection.

IC Role / Device Role / Timing Role: Main processor executing LIN/CAN protocol stacks, PWM dimming control, and watchdog-managed fault recovery.

Use Value: Wide 1.71–3.6 V operating range tolerates cold-crank (6.5 V transient suppressed externally); 105°C rating supports under-hood placement; hardware CRC validates firmware integrity during OTA updates.

Use Scenario: Wall-mounted gateway collecting CO₂, humidity, and occupancy data from wireless sensors and forwarding to cloud via Ethernet/Wi-Fi bridge.

IC Role / Device Role / Timing Role: Edge intelligence node performing local analytics, time-synchronized data aggregation, and secure TLS offload before upstream transmission.

Use Value: 120 MHz Cortex-M4 executes lightweight ML inference (e.g., occupancy classification); hardware RNG seeds TLS handshakes; USB OTG enables field technician firmware recovery without JTAG.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MK26FN2M0VLQ182 MB flash, 512 KB RAM, 180 MHz core, added Ethernet MAC and LCD controller; larger 144-pin LQFP package.Suitable for HMI-rich applications requiring display output or network connectivity - not drop-in due to pin count and peripheral mismatch.Select when needing >1 MB code space, Ethernet, or graphical UI; requires PCB redesign and firmware adaptation.
STM32H743VIT6480 MHz Cortex-M7, 2 MB flash, 1 MB RAM, no integrated USB PHY LDO; requires external USB transceiver and regulator.Better suited for high-throughput compute tasks (e.g., audio DSP), but lacks crystal-less USB and has higher static power (25 μA vs 5.8 μA).Choose for peak performance where power budget allows; avoid if crystal-less USB or ultra-low sleep current is mandatory.

Compared with MK24FN1M0VDC12, MK26FN2M0VLQ18 offers higher memory and speed at the cost of footprint and compatibility, while STM32H743VIT6 trades integrated USB convenience and sub-μA sleep for raw compute throughput - making MK24FN1M0VDC12 optimal for balanced USB-connected industrial edge nodes.

Availability

MK24FN1M0VDC12 is available at Aetrix Electronics and suitable for industrial PLC I/O modules, USB medical sensor hubs, and automotive body control units requiring stable component supply, long-term lifecycle assurance, and qualified automotive-grade traceability.

Supply support for MK24FN1M0VDC12 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge AI acceleration.

The Kinetis K24F product line was designed for cost-sensitive, low-power applications demanding USB connectivity, real-time control, and hardware security - targeting industrial automation, building controls, and portable medical devices.

FAQ

What is the maximum operating frequency of the MK24FN1M0VDC12 core?

The MK24FN1M0VDC12 features an ARM Cortex-M4 core with floating-point unit rated for up to 120 MHz operation. This frequency is achieved using the on-chip PLL with external 4–32 MHz crystal or internal reference clocks. The device maintains full peripheral functionality and timing compliance at this speed across its specified voltage (1.71–3.6 V) and temperature (–40 to 105°C) ranges, as verified in NXP's K24P144M120SF5 datasheet Rev. 7.

Does the MK24FN1M0VDC12 support crystal-less USB operation?

Yes, the MK24FN1M0VDC12 supports crystal-less USB full-speed and low-speed operation via its integrated USB OTG 2.0 controller. This capability eliminates the need for an external 48 MHz crystal or oscillator, reducing BOM cost and PCB area. The internal 48 MHz IRC (IRC48M) provides the required clock source, and the USB PHY includes built-in trimming to maintain ±0.25% accuracy over voltage and temperature - confirmed in Section 3.8.1 of the K24F datasheet.

How many GPIO pins does the MK24FN1M0VDC12 provide in its 100-pin LQFP package?

The MK24FN1M0VDC12 in the 100-pin LQFP package provides 83 general-purpose I/O pins, as specified in NXP's Ordering Information table (Rev. 7, p. 2). These GPIOs support multiple peripheral functions via pin multiplexing, including UART, I²C, SPI, CAN, ADC inputs, and PWM outputs. All 83 pins are individually configurable for pull-up/pull-down, drive strength, and interrupt triggering - enabling flexible hardware design without external logic.

What hardware security features are integrated into the MK24FN1M0VDC12?

The MK24FN1M0VDC12 integrates dedicated hardware security modules including AES-128/256, DES/3DES, SHA-1/SHA-256 cryptographic accelerators, a true random number generator (TRNG), and CRC-32 computation engine. It also includes a 128-bit unique identification number per chip and memory protection unit (MPU) with multi-master enforcement. These features are documented in Sections 3.5 and 7.1 of the K24F datasheet and enable secure boot, encrypted firmware updates, and TLS offload without software-only overhead.

What is the lowest achievable power consumption mode for the MK24FN1M0VDC12?

The MK24FN1M0VDC12 achieves its lowest power consumption in Very-Low-Leakage Stop Mode 0 (VLLS0) with POR detect circuit disabled, drawing just 339 nA at –40 to 25°C and 3.0 V supply (Table 6, K24F datasheet Rev. 7). In this mode, the core, peripherals, and most clocks are halted while retaining full register and RAM contents, and wakeup can occur within 5 μs via RTC alarm or GPIO event - making it ideal for battery-powered applications requiring years of operation on a single coin cell.

MK24FN1M0VDC12 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
121-XFBGA
Series:
Kinetis K20
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 37x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MK24FN1M0VDC12 FAQ

1.How can I place an order for MK24FN1M0VDC12 through Aetrix?

Please submit a Request for Quotation (RFQ) for MK24FN1M0VDC12 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MK24FN1M0VDC12 reliable?

The price and inventory of MK24FN1M0VDC12 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK24FN1M0VDC12 is usually 5 days.

3.What payment methods are accepted for MK24FN1M0VDC12?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK24FN1M0VDC12 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MK24FN1M0VDC12?

MK24FN1M0VDC12 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MK24FN1M0VDC12 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MK24FN1M0VDC12?

For technical support, including MK24FN1M0VDC12 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK24FN1M0VDC12 requirements.

6.How does Aetrix verify that MK24FN1M0VDC12 is sourced from the original manufacturer or authorized distributors?

All MK24FN1M0VDC12 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK24FN1M0VDC12 meets industry standards.

7.What is the process for return or replacement of MK24FN1M0VDC12?

All MK24FN1M0VDC12 units undergo pre-shipment inspection (PSI). If there is an issue with MK24FN1M0VDC12, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MK24FN1M0VDC12 part is unused and in its original packaging.

Return procedure for MK24FN1M0VDC12:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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