NXP Semiconductors MK26FN2M0CAC18R

Overview

MK26FN2M0CAC18R from NXP Semiconductors is a 180 MHz ARM® Cortex®-M4F microcontroller with DSP instructions and single-precision floating-point unit, 2 MB flash, 256 KB SRAM, dual USB (HS/FS/LS OTG), two CAN interfaces, and operation across –40°C to 105°C. It targets high-integration industrial control, automotive body electronics, and secure IoT edge nodes requiring robust low-power operation and cryptographic acceleration.

For engineers reviewing the MK26FN2M0CAC18R datasheet, MK26FN2M0CAC18R pinout, MK26FN2M0CAC18R application, or MK26FN2M0CAC18R equivalent, this page delivers verified technical context, package-specific pin mapping, real-world use cases, and validated alternative parts - all grounded in NXP's K26P169M180SF5 Rev. 4 documentation and official ordering data.

Technical Context

The MK26FN2M0CAC18R implements a full-featured ARM Cortex-M4F core with hardware FPU and DSP extensions, supporting deterministic real-time execution for motor control and signal processing. Its memory subsystem includes 2 MB on-chip flash with error correction, 256 KB SRAM, and optional FlexMemory architecture (not enabled in this variant).

Peripheral integration centers on dual USB controllers - one with integrated high-speed PHY and OTG support, the other full-/low-speed OTG - alongside two CAN 2.0B controllers, four I²C modules, three SPIs, five UARTs plus LPUART0, two 16-bit SAR ADCs, two 12-bit DACs, and hardware accelerators for AES, SHA, and DES. Power management includes seven low-power modes with sub-μA stop currents.

Key Specifications

Pinout & Package

MK26FN2M0CAC18R uses a 169-ball WLCSP package (5.6 mm × 5.5 mm, 0.4 mm pitch), optimized for space-constrained portable and automotive applications. Ball count and layout align with NXP's MAPBGA-169 footprint but in wafer-level chip-scale form factor.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with MK26FN2M0VMI18, the MK26FN2M0CAC18R offers identical functionality in a smaller, lower-inductance WLCSP package ideal for space-constrained designs - whereas MK28FN2M0ACDC18 provides architectural upgrades including faster core, enhanced security, and Ethernet, making it suitable for next-generation edge nodes where legacy compatibility is not required.

Availability

MK26FN2M0CAC18R is available at Aetrix Electronics and suitable for industrial automation, automotive body electronics, and secure IoT edge devices requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for MK26FN2M0CAC18R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and embedded security.

The MK26FN2M0CAC18R belongs to the Kinetis K26 sub-family - designed specifically for high-performance, low-power, and security-critical embedded applications demanding dual USB, CAN, cryptographic acceleration, and extended temperature operation.

FAQ

What is the maximum operating frequency of the MK26FN2M0CAC18R?

The MK26FN2M0CAC18R features an ARM Cortex-M4F core rated for up to 180 MHz operation. This frequency is achievable with the internal PLL locked to a 32 MHz crystal and MCG configured in PEE mode. Flash wait states are automatically managed to sustain zero-wait-state execution at full speed, as confirmed in Section 2.3.1 of the K26P169M180SF5 datasheet Rev. 4.

Does the MK26FN2M0CAC18R support hardware encryption acceleration?

Yes, the MK26FN2M0CAC18R integrates the Cryptographic Acceleration Unit (CAU) supporting AES-128/256, SHA-1/256, and DES/3DES algorithms in hardware. This offloads CPU-intensive operations, reducing encryption latency by over 10× compared to software-only implementations - a capability explicitly documented in the Security section of the K26 Sub-Family datasheet.

What package type and dimensions does the MK26FN2M0CAC18R use?

The MK26FN2M0CAC18R uses a 169-ball Wafer-Level Chip-Scale Package (WLCSP) measuring 5.6 mm × 5.5 mm with 0.4 mm ball pitch. This is distinct from the MAPBGA-169 variant (MK26FN2M0VMI18) and is specified in NXP's package drawing 98ASA00222D1. The WLCSP enables minimal PCB footprint and superior high-frequency signal integrity.

How many I/O pins does the MK26FN2M0CAC18R provide?

The MK26FN2M0CAC18R provides 116 general-purpose I/O pins, as confirmed in the Ordering Information table of the K26 Sub-Family datasheet Rev. 4. These pins are distributed across ports A–D and support configurable drive strength, slew rate, pull-up/down, and multiple alternate functions including USB, CAN, SPI, I²C, and ADC inputs.

What is the operating temperature range for the MK26FN2M0CAC18R?

The MK26FN2M0CAC18R is rated for operation from –40°C to +105°C ambient temperature, qualifying it for automotive under-hood and industrial control applications. This extended temperature grade is explicitly stated in the Operating Characteristics section and supported by thermal characterization data in Table 1 and Figure 4 of the K26P169M180SF5 datasheet.