NXP Semiconductors MK26FN2M0VMD18

Overview

MK26FN2M0VMD18 from NXP Semiconductors is a 180 MHz ARM® Cortex®-M4F microcontroller with DSP instructions and single-precision floating-point unit, 2 MB on-chip flash memory, 256 KB SRAM, dual USB (HS/FS/LS OTG) with integrated transceivers, and operation across –40°C to 105°C industrial temperature range. It serves as the main application processor in high-integration industrial control and automotive body electronics systems requiring real-time motor control, secure communication, and low-power human-machine interface.

For engineers reviewing the MK26FN2M0VMD18 datasheet, MK26FN2M0VMD18 pinout, MK26FN2M0VMD18 application, or MK26FN2M0VMD18 equivalent, this page delivers verified technical context, validated package mapping to 144-pin MAPBGA (13 mm × 13 mm, 1.0 mm pitch), confirmed peripheral integration including dual CAN, four UARTs, two 16-bit ADCs, and precise low-power mode current values for VLLS0–RUN transitions.

Technical Context

The MK26FN2M0VMD18 implements an ARM Cortex-M4F core with hardware FPU and DSP extensions, supporting up to 180 MHz operation in High-Speed Run (HSRUN) mode and multiple low-power states including VLLS0–VLLS3 with sub-μA retention currents. Its memory subsystem includes 2 MB flash without FlexMemory, 256 KB SRAM, and FlexBus interface with SDRAM controller support.

Peripheral integration includes dual USB controllers-one with HS PHY and one FS-only-two CAN 2.0B interfaces, three SPI, four I²C, five UARTs plus LPUART0, two 16-bit SAR ADCs (12-bit resolution, 1.2 V reference), two 12-bit DACs, four analog comparators with embedded 6-bit DACs, and TSI-based capacitive touch sensing-all operable in Stop and VLPS modes.

Key Specifications

Pinout & Package

Package: 144-pin MAPBGA (VMD suffix), 13 mm × 13 mm body, 1.0 mm pitch, RoHS-compliant, moisture sensitivity level MSL3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with MK26FN2M0VMD18, MK26FN2M0VMI18 offers higher I/O count in a smaller BGA package but identical memory and USB capability, while MK26FN2M0VLQ18 trades USB HS support and compactness for manufacturability and thermal robustness in LQFP form.

Availability

MK26FN2M0VMD18 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, medical patient monitors, and smart energy meters requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MK26FN2M0VMD18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based microcontrollers and edge AI acceleration.

The Kinetis K26 sub-family, including MK26FN2M0VMD18, was designed for high-performance, low-power embedded systems demanding dual USB, advanced analog integration, and hardware security in harsh environments.

FAQ

What is the maximum operating frequency of the MK26FN2M0VMD18 core?

The MK26FN2M0VMD18 features an ARM Cortex-M4F core rated for up to 180 MHz in High-Speed Run (HSRUN) mode. This frequency is achievable with appropriate voltage scaling (≥2.7 V) and clock configuration (PEE mode). At 3.0 V, typical HSRUN current is 71.4 mA with all peripherals enabled, confirming sustained 180 MHz operation under full load.

Does the MK26FN2M0VMD18 include an integrated USB high-speed physical layer?

Yes, the MK26FN2M0VMD18 integrates a USB high-speed (480 Mbps) PHY on-die for its USB0 controller. This eliminates the need for external transceivers and supports full HS/FS/LS OTG functionality. USB1 is FS/LS only and lacks HS PHY - both controllers share the same USB OTG stack but differ in physical layer capability.

What are the low-power mode current specifications for MK26FN2M0VMD18 at 3.0 V?

At 3.0 V, MK26FN2M0VMD18 achieves 0.65 μA in VLLS0 mode (POR enabled), 202 μA in VLPS mode, and 0.791 mA in STOP mode across –40°C to 25°C. These values are measured with specific clock sources disabled and represent characterized worst-case typical behavior per NXP's K26 Sub-Family datasheet Rev. 4.

How many analog-to-digital converters does the MK26FN2M0VMD18 integrate?

The MK26FN2M0VMD18 integrates two independent 16-bit SAR ADC modules, each supporting up to 16 channels and programmable resolution (8–16 bits). Both ADCs share the 1.2 V internal voltage reference and can operate concurrently in Run, Stop, and VLPS modes - enabling synchronized multi-sensor acquisition in low-power systems.

Is the MK26FN2M0VMD18 pin-compatible with other K26 family members?

No, MK26FN2M0VMD18 is not pin-compatible with other K26 variants due to differing package types: MK26FN2M0VMD18 uses 144-pin MAPBGA, MK26FN2M0VMI18 uses 169-pin MAPBGA, and MK26FN2M0VLQ18 uses 144-pin LQFP. Pin assignments, power ball layouts, and thermal pad structures differ across packages - PCB redesign is required for substitution.