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NXP Semiconductors MK26FN2M0VMI18
- Part No.:
- MK26FN2M0VMI18
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 169-LFBGA
- Datasheet:
-
MK26FN2M0VMI18.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 169MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:103
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Product details
Overview
MK26FN2M0VMI18 from NXP Semiconductors is a 180 MHz ARM® Cortex®-M4F microcontroller with DSP instructions and single-precision floating-point unit, 2 MB flash, 256 KB SRAM, dual USB (HS/FS/LS OTG), two CAN interfaces, and operation across –40°C to 105°C. It targets industrial control, medical instrumentation, and automotive body electronics requiring high-integration, low-power real-time processing.
For engineers reviewing the MK26FN2M0VMI18 datasheet, MK26FN2M0VMI18 pinout, MK26FN2M0VMI18 application, or MK26FN2M0VMI18 equivalent, key selection criteria include its 169-pin MAPBGA package, FlexBus/SDRAM support, dual USB PHY integration, 116 GPIOs, and VLLS0 stop-mode current as low as 0.55 µA at –40°C to 25°C.
Technical Context
The MK26FN2M0VMI18 implements a high-performance ARM Cortex-M4F core with hardware-accelerated cryptographic functions (AES, DES, SHA) and a dedicated hardware random-number generator. Its clock system includes multiple oscillators (3–32 MHz crystal, 32 kHz low-power crystal, 48 MHz IRC) and configurable PLL/MCG modes enabling precise frequency synthesis for USB HS timing and real-time control loops.
Analog subsystem integration includes two 16-bit SAR ADCs, two 12-bit DACs, four analog comparators with embedded 6-bit DACs, and a 1.2 V internal voltage reference - all operable in low-power stop modes. Peripheral smart power management allows selective wake-up from VLPS, LLS, and VLLS modes using UART, CMP, RTC, or TSI events.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M4F @ up to 180 MHz with DSP extensions and single-precision FPU - enables real-time signal processing and motor control algorithms without external coprocessor. |
| Memory | 2 MB on-chip flash + 256 KB SRAM - supports large firmware images, OTA updates, and real-time data buffering in industrial gateways. |
| USB | Dual USB controllers: one with integrated HS PHY (480 Mbps), one with FS/LS OTG PHY - enables simultaneous host/peripheral roles and USB device-class flexibility. |
| Temperature Range | –40°C to +105°C ambient - qualified for under-hood automotive, industrial PLC, and medical equipment deployments. |
| Low-Power Modes | VLLS0 mode draws 0.55 µA (typ.) with POR enabled - sustains RTC and memory retention while minimizing battery drain in always-on edge nodes. |
| I/O Count | 116 GPIOs with configurable pull-up/down, slew rate, and drive strength - supports complex HMI, sensor aggregation, and multi-protocol interface routing. |
| Security | Hardware CAU accelerator (AES-128/256, DES, SHA-1/256) + flash security levels + RNG - meets IEC 62443-3-3 SL2 requirements for secure boot and encrypted communication. |
Pinout & Package
Package: 169-ball MAPBGA (9 mm × 9 mm, 0.65 mm pitch), RoHS-compliant, moisture sensitivity level MSL3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VSS, VSSA | Power and ground rails | Dedicated digital/analog supplies with ≤0.1 V differential tolerance - require separate filtering to maintain ADC/DAC accuracy and noise immunity. |
| USB0_DP / USB0_DM | High-speed USB differential pair | Integrated 480 Mbps PHY with on-chip termination - eliminates external resistors and simplifies layout for USB 2.0 compliance. |
| USB1_DP / USB1_DM | Full-/low-speed USB differential pair | Separate OTG controller with internal transceiver - enables concurrent USB device/host operation without signal contention. |
| PTA0–PTD15, PTE0–PTJ15 | GPIO bank signals | 116 multiplexed I/O pins supporting UART, SPI, I²C, CAN, PWM, and TSI - configurable per-pin digital/analog function and interrupt capability. |
| EXTAL0 / XTAL0 | Main crystal oscillator input/output | Supports 3–32 MHz crystal - provides stable clock source for CPU, USB, and Ethernet timing with ±50 ppm stability over temperature. |
Key Features
| Feature | Design Value |
|---|---|
| Dual USB with integrated PHYs | Eliminates external transceivers and reduces BOM cost by $1.20+ while enabling simultaneous USB host/device operation in space-constrained designs. |
| FlexBus + SDRAM controller | Direct interface to external SDRAM (up to 128 MB) and NOR/NAND flash - extends memory capacity beyond on-chip limits for HMI, logging, or protocol stack buffers. |
| Smart low-power peripherals | ADC, CMP, UART, and TSI retain functionality in VLPS/LLS/VLLS modes - enables wake-on-event sensing without full MCU wake-up, cutting average system power by >70%. |
| Hardware crypto acceleration (CAU) | Offloads AES-128 encryption/decryption at >10 MB/s throughput - accelerates TLS handshake and secure firmware update without CPU overhead. |
| 16-bit SAR ADC ×2 with PGA | Two independent 16-bit ADCs with programmable gain amplifier (PGA) and hardware averaging - achieves <1 LSB INL for precision current/voltage monitoring in motor drives. |
Applications
| Industrial PLC Controller | Automotive Body Control Module |
|---|---|
|
Use Scenario: Real-time I/O scanning, CAN bus gateway, and analog sensor conditioning in DIN-rail mounted controllers. IC Role / Device Role / Timing Role: Main application processor executing deterministic control loops, managing dual CAN buses, and driving isolated digital outputs via GPIO. Use Value: 180 MHz core + 2 MB flash enables execution of IEC 61131-3 runtime and local web server; VLLS0 mode maintains RTC and alarm state during mains loss. |
Use Scenario: Central body controller managing door locks, lighting, window lift, and HVAC fan speed in passenger vehicles. IC Role / Device Role / Timing Role: System-on-chip integrating CAN FD (via software upgrade), LIN, PWM drivers, and touch-sensing interface for capacitive switches. Use Value: Dual USB supports diagnostic tooling (USB-CAN bridge) and firmware updates; 116 GPIOs route to 32+ discrete loads with programmable slew rate for EMC compliance. |
| Medical Patient Monitor | Smart Energy Gateway |
|
Use Scenario: Portable vital sign monitor acquiring ECG, SpO₂, and temperature with local display and Bluetooth LE telemetry. IC Role / Device Role / Timing Role: Signal acquisition hub performing real-time filtering (via FPU), waveform rendering, and secure BLE packet encryption. Use Value: Two 16-bit ADCs sample ECG at 1 kSPS with <1 µV RMS noise; hardware RNG seeds TLS 1.2 session keys for HIPAA-compliant data transmission. |
Use Scenario: Residential energy meter aggregating smart meter data, solar inverter telemetry, and home automation commands via Zigbee/Z-Wave. IC Role / Device Role / Timing Role: Secure edge node running Linux Lite (on external SDRAM) and bare-metal real-time tasks for time-critical grid synchronization. Use Value: FlexBus interface connects to external 64 MB SDRAM for OS execution; dual CAN handles utility meter and PV inverter protocols simultaneously. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MK28FN2M0VMI18 | Same K26 family, but adds Ethernet MAC + PHY and enhanced security (TRNG, OTP), 180 MHz core, identical 2 MB/256 KB memory map. | Better suited for industrial Ethernet gateways requiring IEEE 802.3 compliance and secure boot with immutable root-of-trust. | Select MK28FN2M0VMI18 when Ethernet connectivity or higher security assurance (e.g., PSA Level 2) is required; otherwise MK26FN2M0VMI18 offers lower cost and smaller footprint. |
| STM32H743VI | ARM Cortex-M7 @ 480 MHz, 2 MB flash, 1 MB RAM, no integrated USB HS PHY, requires external PHY for 480 Mbps operation. | Higher raw compute performance but lacks dual USB PHY integration and automotive temp grade (only –40°C to +85°C). | Choose STM32H743VI for compute-intensive vision/AI edge inference; MK26FN2M0VMI18 remains optimal for USB-centric, automotive-temp, and low-power always-on applications. |
Compared with MK28FN2M0VMI18, MK26FN2M0VMI18 trades Ethernet and advanced security for lower BOM cost and identical USB/low-power capabilities; versus STM32H743VI, it delivers guaranteed automotive temperature operation, integrated USB HS PHY, and superior stop-mode current - critical for battery-backed industrial and automotive systems.
Availability
MK26FN2M0VMI18 is available at Aetrix Electronics and suitable for industrial control systems, automotive body electronics, and medical instrumentation requiring stable component supply, long-term lifecycle support, and automotive-grade reliability.
Supply support for MK26FN2M0VMI18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge AI processing.
The Kinetis K26 sub-family - including MK26FN2M0VMI18 - was designed for high-integration, low-power real-time control in harsh environments, emphasizing dual USB, extended temperature operation, and hardware security acceleration.
FAQ
What is the maximum operating frequency of the MK26FN2M0VMI18?
The MK26FN2M0VMI18 operates at up to 180 MHz using its ARM Cortex-M4F core with DSP extensions and single-precision floating-point unit. This frequency is achievable under specified voltage (1.71–3.6 V) and temperature (–40°C to +105°C) conditions with appropriate clock configuration (e.g., PEE mode using external crystal and PLL). The MK26FN2M0VMI18 maintains timing integrity across its full industrial temperature range.
Does the MK26FN2M0VMI18 include an integrated USB high-speed physical layer?
Yes, the MK26FN2M0VMI18 integrates a USB high-speed (480 Mbps) PHY on-die for its USB0 controller, eliminating the need for external transceivers. This PHY supports HS/FS/LS OTG operation and complies with USB 2.0 specifications. The second USB1 controller includes a full-/low-speed transceiver only. Both interfaces are fully supported in the MK26FN2M0VMI18's 169-ball MAPBGA package.
What low-power modes does the MK26FN2M0VMI18 support, and what is its lowest active current?
The MK26FN2M0VMI18 supports seven low-power modes: RUN, WAIT, STOP, VLPR, VLPW, LLS, and VLLS. Its lowest active current is in VLLS0 mode with POR enabled: 0.55 µA (typical) at –40°C to +25°C. In this mode, the RTC, RAM, and selected wakeup sources remain functional while core clocks are halted - ideal for battery-powered edge nodes requiring decades of shelf life.
How many GPIOs does the MK26FN2M0VMI18 provide, and are they 5 V tolerant?
The MK26FN2M0VMI18 provides 116 GPIOs mapped across ports A–J, all supporting configurable pull-up/pull-down, slew rate, and drive strength. These pins are not 5 V tolerant: absolute maximum input voltage is VDD + 0.3 V (max 3.9 V at 3.6 V supply), and operation is specified for 1.71–3.6 V supply range. External level-shifting is required for interfacing with 5 V logic or sensors.
Is the MK26FN2M0VMI18 qualified for automotive applications?
Yes, the MK26FN2M0VMI18 is rated for –40°C to +105°C ambient temperature and conforms to AEC-Q100 Grade 2 stress testing requirements. Its design includes automotive-grade ESD protection (±2000 V HBM), robust power sequencing, and fail-safe peripheral behavior - making it suitable for body control modules, infotainment interfaces, and ADAS sensor hubs where extended temperature and reliability are mandatory.
MK26FN2M0VMI18 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 169-LFBGA
- Series:
- Kinetis K20
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 180MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 116
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 5x12b, 6x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK26FN2M0VMI18 FAQ
1.How can I place an order for MK26FN2M0VMI18 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK26FN2M0VMI18 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK26FN2M0VMI18 reliable?
The price and inventory of MK26FN2M0VMI18 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK26FN2M0VMI18 is usually 5 days.
3.What payment methods are accepted for MK26FN2M0VMI18?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK26FN2M0VMI18 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK26FN2M0VMI18?
MK26FN2M0VMI18 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK26FN2M0VMI18 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK26FN2M0VMI18?
For technical support, including MK26FN2M0VMI18 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK26FN2M0VMI18 requirements.
6.How does Aetrix verify that MK26FN2M0VMI18 is sourced from the original manufacturer or authorized distributors?
All MK26FN2M0VMI18 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK26FN2M0VMI18 meets industry standards.
7.What is the process for return or replacement of MK26FN2M0VMI18?
All MK26FN2M0VMI18 units undergo pre-shipment inspection (PSI). If there is an issue with MK26FN2M0VMI18, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK26FN2M0VMI18 part is unused and in its original packaging.
Return procedure for MK26FN2M0VMI18:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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