NXP Semiconductors MK27FN2M0AVMI15
- Part No.:
- MK27FN2M0AVMI15
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 169-LFBGA
- Datasheet:
-
MK27FN2M0AVMI15.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 169MAPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MK27FN2M0AVMI15 from NXP Semiconductors is a high-performance ARM® Cortex®-M4 microcontroller with 2 MB flash, 1 MB SRAM, dual USB controllers (High-Speed + crystal-less Full-Speed), SDRAM controller, and integrated Power Management Controller. It operates up to 150 MHz, supports XIP from QuadSPI NOR flash, and targets battery-sensitive human-machine interface applications including wearables and smart home hubs.
For engineers reviewing the MK27FN2M0AVMI15 datasheet, MK27FN2M0AVMI15 pinout, MK27FN2M0AVMI15 application, or MK27FN2M0AVMI15 equivalent, key selection criteria include its 120 GPIOs, -40°C to 105°C industrial temperature range, 1.71–3.6 V single-supply operation, and hardware cryptographic acceleration (AES/SHA/DES) for secure firmware updates and IoT edge authentication.
Technical Context
The MK27FN2M0AVMI15 implements an ARM Cortex-M4 core with DSP extensions and single-precision FPU, paired with a multi-layer AHB crossbar switch enabling concurrent access to flash, SRAM, peripherals, and external memory interfaces. Its memory subsystem includes dual-bank 2 MB flash with 8 KB I/D cache, 1 MB SRAM with 8 KB system cache, and dedicated SDRAM and QuadSPI controllers supporting DDR/SDR serial flash in XIP mode.
Power management integrates a programmable low-power architecture with seven distinct run/stop modes (including VLLS0–VLLS3), independent VBAT domain for RTC retention, and hardware voltage monitoring (LVD/HVD) across VDD, VDDA, and VBAT domains - all coordinated via the on-chip PMC without external supervision.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M4 @ 150 MHz with DSP instructions and single-precision FPU - enables real-time signal processing for audio, motor control, and sensor fusion. |
| Memory | 2 MB dual-bank flash + 1 MB SRAM - supports robust firmware partitioning, data logging buffers, and rich GUI frame buffers. |
| USB | Dual controllers: HS/FS/LS PHY + crystal-less FS/LS transceiver - eliminates external crystal for USB device mode, reducing BOM cost and board space. |
| External Memory | 32-bit SDRAM controller + dual QuadSPI with XIP support - enables execution directly from external serial NOR flash, expanding effective code space beyond internal flash. |
| Crypto | MMCAU hardware accelerator for AES-128/256, SHA-1/256, DES/3DES, MD5, CRC - offloads encryption tasks from CPU, preserving deterministic latency for secure OTA updates. |
| Temp Range | -40°C to +105°C (industrial grade, MAPBGA package) - qualified for deployment in enclosed consumer electronics and home automation gateways without active cooling. |
| I/O Count | 120 GPIOs with configurable drive strength, pull-up/down, and analog/digital multiplexing - supports complex HMI interfaces including touch, display, and multi-sensor aggregation. |
Pinout & Package
Package: 169-pin MAPBGA (9 mm × 9 mm, 0.65 mm pitch, 1.28 mm height). Pin assignments follow K27F Signal Multiplexing Table per NXP Reference Manual K27P169M150SF5RM1, with dedicated power domains (VDD, VDDIO_E, VBAT, VDDA) and functional groupings for USB, QuadSPI, SDRAM, FlexBus, and analog peripherals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD / VDDA / VDDIO_E / VBAT | Independent supply domains | Enables mixed-voltage I/O (e.g., 1.8 V QuadSPI while core runs at 3.3 V) and RTC backup without main power rail dependency. |
| USB0_DP / USB0_DM / USB1_DP / USB1_DM | Differential USB data lines | USB0 supports HS/FS/LS with integrated PHY; USB1 supports crystal-less FS/LS - allows dual-role host/device operation with minimal external components. |
| QSPI0A_D0–D3 / QSPI0B_D0–D3 | QuadSPI data lanes | Dual independent QuadSPI interfaces support simultaneous boot from one flash and XIP execution from another - critical for fail-safe firmware updates. |
| SDRAM_A0–A12 / SDRAM_D0–D31 | SDRAM address/data bus | 32-bit SDRAM controller with programmable timing supports up to 128 MB external RAM - extends buffer capacity for video streaming or protocol stack buffering. |
| PTA0–PTD7 / PTE0–PTE31 | GPIO banks A–E | 120 total GPIOs with configurable slew rate, drive strength (up to 20 mA), and interrupt capability - supports direct connection to capacitive touch sensors, LED drivers, and UART peripherals. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Random Number Generator (TRNG) | Provides cryptographically secure entropy for TLS handshake keys and secure boot seed generation - required for FIPS-compliant IoT device identity provisioning. |
| Low-Power UARTs (5 units) | Operate in VLPR/VLPS modes with wake-on-RX capability - enables always-on sensor polling at sub-10 µA current, extending battery life in wearable endpoints. |
| FlexIO Module (32-channel) | Programmable logic engine emulates custom serial protocols (e.g., 1-Wire, MIPI I3C, proprietary sensor interfaces) without CPU intervention - reduces firmware complexity and interrupt load. |
| 16-bit SAR ADC + dual 6-bit DAC + 12-bit DAC | Simultaneous analog acquisition and waveform generation - supports closed-loop motor control, audio codec interfacing, and precision sensor calibration in a single chip. |
| Memory Protection Unit (MPU) | Multi-master protection enforces privilege separation between RTOS tasks and bootloader - prevents unauthorized access to secure firmware partitions and cryptographic keys. |
Applications
| Wearable Fitness Tracker | Smart Home Hub Gateway |
|---|---|
Use Scenario: Compact wrist-worn device collecting accelerometer, heart-rate, and ambient light data with BLE wireless upload. IC Role / Device Role: Primary application processor managing sensor fusion, local analytics, USB charging enumeration, and secure BLE pairing. Use Value: Integrated 120 MHz Cortex-M4 + 1 MB SRAM enables real-time motion algorithm execution; ultra-low-power stop modes (<1 µA VLLS0) extend battery life to >7 days on coin cell. | Use Scenario: Cost-optimized multi-standard hub aggregating Zigbee, Z-Wave, and Bluetooth LE devices into a unified Wi-Fi uplink. IC Role / Device Role: Central protocol translator and local decision engine with secure cloud connectivity. Use Value: Dual USB controllers allow simultaneous debug port and peripheral HID emulation; hardware crypto accelerates TLS 1.2 handshakes without degrading throughput for concurrent radio stacks. |
| Low-End Graphic Display Terminal | Home Automation Controller |
Use Scenario: 3.5" TFT display panel with resistive touch, running embedded GUI for HVAC and lighting control in residential settings. IC Role / Device Role: Display controller and HMI processor handling graphics rendering, touch decoding, and local command execution. Use Value: 2 MB flash stores full GUI assets and fonts; QuadSPI XIP enables fast display refresh from external NOR flash; 120 GPIOs drive parallel RGB interface and touch controller directly. | Use Scenario: Wall-mounted thermostat with environmental sensing (temp/humidity), relay control, and local scheduling logic. IC Role / Device Role: Standalone control unit executing PID loops, managing nonvolatile schedule storage, and providing USB-CDC diagnostics. Use Value: Integrated 16-bit ADC achieves ±0.5°C temp accuracy; independent VBAT domain retains RTC and schedule during main power loss; SDRAM controller supports future firmware expansion for ML-based occupancy prediction. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MK28FN2M0AVMI15 | Same K27F family, but with enhanced security features: TrustZone-enabled Cortex-M4, secure boot ROM, and tamper detection circuitry. | Required for applications needing PSA Level 2 certification or secure element functionality (e.g., payment terminals, medical data loggers). | Select MK28FN2M0AVMI15 when hardware-enforced isolation of trusted firmware is mandatory; MK27FN2M0AVMI15 remains optimal for cost-sensitive, non-certified consumer HMI. |
| RT1052DVJ6B | ARM Cortex-M7 @ 600 MHz, 2 MB flash, no integrated SDRAM controller, requires external DDR3/LPDDR2; lacks QuadSPI XIP support. | Better suited for high-throughput applications (e.g., camera streaming, AI inference) where raw compute dominates over memory flexibility. | Choose RT1052DVJ6B only if >3× CPU performance is needed and external DDR is acceptable; MK27FN2M0AVMI15 offers superior memory interface integration for deterministic real-time systems. |
Compared with MK28FN2M0AVMI15, MK27FN2M0AVMI15 trades hardware security extensions for lower unit cost and identical peripheral set; versus RT1052DVJ6B, it delivers better memory subsystem efficiency for XIP-based firmware architectures and lower power in deep-sleep states, making it more suitable for battery-powered edge nodes.
Availability
MK27FN2M0AVMI15 is available at Aetrix Electronics and suitable for wearable electronics, smart home gateways, and home automation controllers requiring stable component supply across extended product lifecycles.
Supply support for MK27FN2M0AVMI15 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 40 years of MCU innovation and broad ARM ecosystem alignment.
The Kinetis K27F product line was designed to deliver high memory density and advanced external memory interfaces for rich HMI and multi-protocol edge devices - balancing performance, power efficiency, and software compatibility across the Kinetis portfolio.
FAQ
What is the maximum operating frequency of the MK27FN2M0AVMI15?
The MK27FN2M0AVMI15 operates at up to 150 MHz using its ARM Cortex-M4 core with DSP extensions and single-precision FPU. This frequency is achievable under specified conditions: VDD = 3.0 V, ambient temperature ≤ 105°C, and MCG configured in PEE mode with appropriate clock dividers. The device maintains full peripheral functionality-including USB HS, SDRAM, and QuadSPI-at this speed.
Does the MK27FN2M0AVMI15 support execution-in-place (XIP) from external flash?
Yes, the MK27FN2M0AVMI15 supports XIP from external serial NOR flash via its dual QuadSPI interfaces. Each QuadSPI block supports SDR and DDR configurations, octal mode, and memory-mapped read operations - enabling direct code execution without loading into internal RAM. This capability is documented in Section 3.3.1 of the K27F Data Sheet Rev. 0 (08/2017).
What are the power supply requirements for the MK27FN2M0AVMI15?
The MK27FN2M0AVMI15 requires four independent supply domains: VDD (1.71–3.6 V for digital logic), VDDA (1.71–3.6 V for analog modules), VDDIO_E (1.71–3.6 V for QuadSPI I/O), and VBAT (1.71–3.6 V for RTC retention). All domains must be powered simultaneously during operation; VBAT can remain active during main power loss to preserve RTC time and registers.
How many GPIOs does the MK27FN2M0AVMI15 provide, and what are their key capabilities?
The MK27FN2M0AVMI15 provides 120 GPIOs distributed across PORTA through PORTE. These support configurable drive strength (normal/high), slew rate control, internal pull-up/pull-down (20–50 kΩ), interrupt generation on edge/level, and analog/digital multiplexing. Specific groups (e.g., PORTE) are isolated to VDDIO_E for mixed-voltage I/O interfacing with external flash or sensors.
Is the MK27FN2M0AVMI15 pin-compatible with other Kinetis K27F variants?
Yes, the MK27FN2M0AVMI15 shares the same 169-pin MAPBGA package (9×9 mm, 0.65 mm pitch) and pinout with other K27F devices in the MI suffix family, including MK27FN2M0AVMI12 and MK27FN2M0AVMI18. Signal mapping, power domain assignments, and peripheral pin functions are consistent across these variants per NXP's K27F Pinout documentation (MAPBGA 169-pin drawing 98ASA00628D1).
MK27FN2M0AVMI15 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 169-LFBGA
- Series:
- Kinetis K27F
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB
- Peripherals:
- DMA, I2S, PWM, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 16b SAR; D/A 2x6b, 1x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK27FN2M0AVMI15 FAQ
1.How can I place an order for MK27FN2M0AVMI15 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK27FN2M0AVMI15 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK27FN2M0AVMI15 reliable?
The price and inventory of MK27FN2M0AVMI15 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK27FN2M0AVMI15 is usually 5 days.
3.What payment methods are accepted for MK27FN2M0AVMI15?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK27FN2M0AVMI15 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK27FN2M0AVMI15?
MK27FN2M0AVMI15 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK27FN2M0AVMI15 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK27FN2M0AVMI15?
For technical support, including MK27FN2M0AVMI15 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK27FN2M0AVMI15 requirements.
6.How does Aetrix verify that MK27FN2M0AVMI15 is sourced from the original manufacturer or authorized distributors?
All MK27FN2M0AVMI15 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK27FN2M0AVMI15 meets industry standards.
7.What is the process for return or replacement of MK27FN2M0AVMI15?
All MK27FN2M0AVMI15 units undergo pre-shipment inspection (PSI). If there is an issue with MK27FN2M0AVMI15, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK27FN2M0AVMI15 part is unused and in its original packaging.
Return procedure for MK27FN2M0AVMI15:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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