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NXP Semiconductors MK27FN2M0VMI15

Part No.:
MK27FN2M0VMI15
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
169-LFBGA
Datasheet:
AetrixMK27FN2M0VMI15.pdf
Description:
IC MCU 32BIT 2MB FLASH 169MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,991

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Product details

Overview

MK27FN2M0VMI15 from NXP Semiconductors is a high-performance ARM® Cortex®-M4 microcontroller with 2 MB flash, 1 MB SRAM, dual USB controllers (High-Speed + crystal-less Full-Speed), SDRAM controller, QuadSPI interface, and integrated Power Management Controller - deployed in wearable devices, low-end graphic display systems, and smart home hubs requiring rich HMI and external memory expansion.

For engineers reviewing the MK27FN2M0VMI15 datasheet, MK27FN2M0VMI15 pinout, MK27FN2M0VMI15 application, or MK27FN2M0VMI15 equivalent, key selection criteria include 150 MHz core speed, 120 GPIOs in 169 MAPBGA, -40°C to 105°C industrial temperature rating, and hardware crypto acceleration (AES/SHA/DES) for secure firmware updates and sensor data integrity.

Technical Context

The MK27FN2M0VMI15 implements an ARM Cortex-M4 core with DSP extensions and single-precision FPU, operating up to 150 MHz in HSRUN mode. It integrates dual QuadSPI interfaces supporting XIP from serial NOR flash (SDR/DDR/octal), a 32-bit SDRAM controller, and FlexBus for parallel memory expansion.

Its power architecture includes independent VDDIO_E (1.71–3.6 V) for QuadSPI I/O, VBAT domain for RTC retention, and seven low-power modes (VLLS0–RUN) with sub-μA stop currents. Security features comprise TRNG, MMCAU crypto accelerator (AES-128/256, SHA-1/256, DES/3DES), and CRC engine.

Key Specifications

ParameterValue and Actual Design Meaning
CoreARM Cortex-M4 with DSP instructions and single-precision FPU, max 150 MHz - enables real-time signal processing and floating-point math for motor control or audio algorithms.
Memory2 MB dual-bank flash + 1 MB SRAM + 32 KB boot ROM - supports robust firmware updates, data logging buffers, and XIP execution from external flash via QuadSPI.
USB InterfacesDual controllers: USB HS/FS/LS with integrated PHY + crystal-less FS/LS with integrated transceiver - reduces BOM count by eliminating external crystals and PHY ICs.
External Memory32-bit SDRAM controller + dual QuadSPI (XIP-capable) + FlexBus - enables high-bandwidth graphics frame buffers, external code storage, and legacy parallel peripheral interfacing.
Analog PeripheralsOne 16-bit SAR ADC, one 12-bit DAC, two 6-bit DACs + comparators, 1.2 V reference - supports precision sensor acquisition and analog feedback in closed-loop systems.
SecurityHardware TRNG + MMCAU crypto accelerator (AES-128/256, SHA-1/256, DES/3DES, MD5) + CRC - accelerates secure boot, OTA encryption, and message authentication without CPU overhead.
Temperature Range-40°C to +105°C (ambient, MAPBGA package) - qualified for industrial and automotive cabin-adjacent applications without derating.
Supply VoltageMain VDD: 1.71–3.6 V; VDDIO_E (QuadSPI): 1.71–3.6 V; VBAT (RTC): 1.71–3.6 V - supports single-supply system design with flexible I/O voltage domains.

Pinout & Package

Package: 169-pin MAPBGA (9 mm × 9 mm × 1.28 mm, pitch 0.65 mm), RoHS-compliant, moisture sensitivity level (MSL) 3.

Pin/TerminalCircuit RoleDesign Meaning
VDD / VSSPower supply / ground railsDedicated digital power and ground pins per bank - ensures stable core and I/O operation across all 120 GPIOs and high-speed peripherals.
VDDA / VSSAAnalog supply / analog groundIsolated analog domain for ADC/DAC/CMP - prevents digital noise coupling into precision analog measurements.
VBATRTC backup supplyIndependent 1.71–3.6 V input - maintains real-time clock and register retention during main power loss.
VDDIO_EQuadSPI I/O supplySeparate 1.71–3.6 V rail for PORTE - allows interfacing with 1.8 V or 3.3 V serial flash while main VDD operates at different voltage.
EXTAL32 / XTAL3232 kHz crystal oscillator inputsConnects to external 32.768 kHz tuning-fork crystal - provides accurate timebase for RTC and low-power timer wakeups.
USB0_DP / USB0_DMUSB High-Speed differential pairIntegrated HS PHY - enables full-speed and high-speed device/host operation without external transceiver.
USB1_DP / USB1_DMUSB crystal-less Full-Speed differential pairIntegrated FS/LS transceiver with internal oscillator - eliminates need for 48 MHz crystal and external PHY in cost-sensitive designs.
QSPI0A_D0–D3 / QSPI0B_D0–D3QuadSPI data lanesDual independent QuadSPI interfaces - supports simultaneous XIP from one flash and data streaming from another, or octal-mode operation for >40 MB/s throughput.

Key Features

FeatureDesign Value
Crystal-less USB Full-SpeedEliminates 48 MHz crystal and associated load capacitors - reduces BOM cost and PCB area in portable and battery-powered applications.
Hardware Crypto Accelerator (MMCAU)Offloads AES-128/256, SHA-1/256, DES/3DES, and MD5 operations - enables secure firmware updates and encrypted sensor data transmission at <1% CPU utilization.
Dual QuadSPI with XIP SupportEnables direct code execution from external serial NOR flash - removes requirement for large on-chip flash, simplifies firmware versioning, and supports field-upgradable displays.
120 GPIOs with Flexible MultiplexingSupports up to 120 configurable digital I/Os across multiple voltage domains (VDD/VDDIO_E/VBAT) - accommodates complex HMI, sensor arrays, and multi-protocol connectivity in space-constrained layouts.
Seven Low-Power Modes (VLLS0–RUN)Sub-1 μA VLLS0 current with POR detect enabled - extends battery life in wearables and wireless sensors requiring periodic wake-up and short active bursts.
Integrated Power Management Controller (PMC)Manages dynamic voltage/frequency scaling, power gating, and domain isolation - simplifies power sequencing and enables adaptive energy optimization across diverse workloads.

Applications

Wearable Fitness TrackerSmart Home Hub Controller

Use Scenario: Compact wrist-worn device collecting accelerometer, heart rate, and ambient light data, with BLE wireless upload and OLED display refresh.

IC Role / Device Role / Timing Role: Central application processor executing sensor fusion algorithms, managing display timing via SDRAM frame buffer, and handling USB-based firmware updates.

Use Value: 1 MB SRAM buffers multi-sensor streams; 150 MHz M4+FPU processes real-time motion algorithms; VLLS0 mode draws only 0.73 μA to extend 7-day battery life.

Use Scenario: Cost-optimized multi-standard hub aggregating Zigbee, Z-Wave, and Bluetooth LE traffic, with local UI and cloud sync via Ethernet or Wi-Fi.

IC Role / Device Role / Timing Role: Main MCU coordinating concurrent wireless stacks, driving LCD/LED indicators, and managing secure OTA updates via hardware crypto acceleration.

Use Value: Dual USB controllers enable simultaneous debug port and host-mode flash programming; MMCAU accelerates TLS handshake and firmware signature verification.

Low-End Graphic Display TerminalIndustrial Human-Machine Interface

Use Scenario: 4.3" TFT display panel with touch controller, used in retail kiosks or medical equipment status monitors.

IC Role / Device Role / Timing Role: Graphics controller interfacing with SDRAM for frame buffer, driving display via RGB or LVDS, and decoding touch events via I2C or SPI.

Use Value: 32-bit SDRAM controller supports 800×480@60 Hz frame buffer; QuadSPI XIP loads display assets directly from serial flash; 120 GPIOs route touch, backlight, and button signals.

Use Scenario: Panel-mounted control interface in factory automation, monitoring PLC I/O, displaying alarms, and logging events to SD card.

IC Role / Device Role / Timing Role: Real-time controller with deterministic interrupt latency, managing SDHC, UARTs for Modbus RTU, and PWM for indicator LEDs.

Use Value: -40°C to 105°C rating ensures reliability in unconditioned enclosures; hardware CRC validates SD card writes; 16-bit ADC reads analog sensor inputs with 1.2 V reference stability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MK28FN2M0AVMI15Same K27F family, but with enhanced security: CAU v2 (adds RSA/ECC), TrustZone support, and additional tamper detection - no change in memory, clock, or peripheral count.Required for applications needing certified secure boot, cryptographic key management, or protection against physical side-channel attacks.Select MK28FN2M0AVMI15 when FIPS 140-2 Level 2 or Common Criteria EAL4+ compliance is mandated.
MK66FX1M0VLQ18Lower memory (1 MB flash / 256 KB SRAM), no SDRAM controller or QuadSPI, but adds Ethernet MAC and higher USB HS bandwidth - same 169 MAPBGA footprint and pin-compatible I/O mapping.Suitable for networked edge nodes where wired connectivity outweighs external memory needs, e.g., industrial gateways with Modbus TCP.Choose MK66FX1M0VLQ18 if Ethernet is essential and SDRAM/XIP are unnecessary - retains software compatibility via Kinetis SDK.

Compared with MK28FN2M0AVMI15, MK27FN2M0VMI15 offers identical performance and memory but lacks TrustZone and advanced crypto; versus MK66FX1M0VLQ18, it trades Ethernet for SDRAM/QuadSPI - making it optimal for display-rich, memory-intensive embedded UIs rather than network-centric control.

Availability

MK27FN2M0VMI15 is available at Aetrix Electronics and suitable for wearable electronics, smart home hubs, and industrial HMI applications requiring stable component supply, long-term lifecycle support, and guaranteed traceability.

Supply support for MK27FN2M0VMI15 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge AI acceleration.

The Kinetis K27F product line targets high-memory, high-interface embedded applications - designed to deliver scalable performance, external memory flexibility, and hardware security for next-generation human-machine interfaces and intelligent edge devices.

FAQ

What is the maximum operating frequency of the MK27FN2M0VMI15 core?

The MK27FN2M0VMI15 features an ARM Cortex-M4 core rated for up to 150 MHz in High-Speed Run (HSRUN) mode with full peripheral enablement. This frequency is sustained under 3.0 V supply and 105°C ambient conditions, as validated in the official NXP datasheet Rev. 1 (03/2017). The MK27FN2M0VMI15 achieves this using its Phase-Locked Loop (PLL) with PEE mode configuration and 25 MHz flash clock timing.

Does the MK27FN2M0VMI15 support execution-in-place (XIP) from external flash memory?

Yes, the MK27FN2M0VMI15 supports XIP via its dual QuadSPI interfaces, enabling direct code execution from external serial NOR flash devices in SDR, DDR, and octal configurations. This capability is confirmed in the K27F Sub-Family datasheet Section 3.3.1 and leverages dedicated instruction prefetch logic. The MK27FN2M0VMI15 does not require copying firmware to internal RAM, reducing boot latency and SRAM usage.

What are the power supply requirements for the MK27FN2M0VMI15's QuadSPI interface?

The MK27FN2M0VMI15 requires a dedicated VDDIO_E supply (1.71–3.6 V) for its PORTE pins, which include all QuadSPI signal lines. This independent rail allows interfacing with 1.8 V or 3.3 V serial flash while the main VDD operates at a different voltage - critical for mixed-voltage system designs. The MK27FN2M0VMI15 datasheet explicitly defines VDDIO_E as separate from VDD and specifies no LVD circuit for this domain.

How many general-purpose I/O pins does the MK27FN2M0VMI15 provide, and what voltage domains do they support?

The MK27FN2M0VMI15 provides up to 120 GPIOs distributed across four I/O groups: Group 1 (VBAT domain), Group 2/3 (VDD domain), and Group 4 (VDDIO_E domain). Each group has distinct drive strength and voltage tolerance characteristics - for example, PORTE (Group 4) must be supplied by VDDIO_E. This multi-domain architecture is documented in Table 4 of the MK27FN2M0VMI15 datasheet and enables flexible mixed-signal board design.

Which hardware security features are integrated into the MK27FN2M0VMI15?

The MK27FN2M0VMI15 integrates a hardware random-number generator (TRNG), Memory-Mapped Crypto Acceleration Unit (MMCAU) supporting AES-128/256, SHA-1/256, DES/3DES, and MD5, plus a Cyclic Redundancy Check (CRC) engine. These are silicon-verified features detailed in Sections 2.4 and 3.4 of the official datasheet. The MK27FN2M0VMI15 does not include TrustZone or ECC acceleration - those appear in the pin-compatible MK28F variant.

MK27FN2M0VMI15 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
169-LFBGA
Series:
Kinetis K27F
Packaging:
Tray
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB
Peripherals:
DMA, I2S, PWM, WDT
Number of I/O:
120
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1M x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 16b SAR; D/A 2x6b, 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MK27FN2M0VMI15 FAQ

1.How can I place an order for MK27FN2M0VMI15 through Aetrix?

Please submit a Request for Quotation (RFQ) for MK27FN2M0VMI15 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MK27FN2M0VMI15 reliable?

The price and inventory of MK27FN2M0VMI15 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK27FN2M0VMI15 is usually 5 days.

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MK27FN2M0VMI15 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MK27FN2M0VMI15 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MK27FN2M0VMI15?

For technical support, including MK27FN2M0VMI15 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK27FN2M0VMI15 requirements.

6.How does Aetrix verify that MK27FN2M0VMI15 is sourced from the original manufacturer or authorized distributors?

All MK27FN2M0VMI15 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK27FN2M0VMI15 meets industry standards.

7.What is the process for return or replacement of MK27FN2M0VMI15?

All MK27FN2M0VMI15 units undergo pre-shipment inspection (PSI). If there is an issue with MK27FN2M0VMI15, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MK27FN2M0VMI15 part is unused and in its original packaging.

Return procedure for MK27FN2M0VMI15:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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