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NXP Semiconductors MK30DN512VLQ10

Part No.:
MK30DN512VLQ10
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixMK30DN512VLQ10.pdf
Description:
IC MCU 32BIT 512KB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:300

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Product details

Overview

MK30DN512VLQ10 from NXP (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, designed for embedded control applications requiring high integration, low-power operation, and industrial temperature support. It delivers 100 MHz core performance, integrates 512 KB on-chip flash memory (program-only), 128 KB RAM, dual 16-bit SAR ADCs with PGA, two 12-bit DACs, two CAN interfaces, and operates across –40°C to +105°C.

For engineers reviewing the MK30DN512VLQ10 datasheet, MK30DN512VLQ10 pinout, MK30DN512VLQ10 application, or MK30DN512VLQ10 equivalent, key selection considerations include its 144-pin LQFP package, FlexBus interface, real-time clock, low-leakage stop modes, and compatibility with Kinetis K30 sub-family toolchains and SDKs.

Technical Context

The MK30DN512VLQ10 implements an ARM Cortex-M4 core with hardware DSP instructions and a Memory Protection Unit (MPU), supporting deterministic real-time execution. Its clock system includes a 3–32 MHz crystal oscillator, 32 kHz RTC oscillator, and a multi-purpose clock generator enabling flexible PLL-based frequency synthesis up to 100 MHz.

System-level integration includes an 8-channel motor control/PWM timer, two quadrature decoder timers, programmable delay block, carrier modulator transmitter, and a 16-channel DMA controller with 63 request sources - all coordinated via a multi-master bus architecture with dedicated arbitration logic.

Key Specifications

ParameterValue and Actual Design Meaning
CoreARM Cortex-M4 with DSP, no FPU - enables efficient signal processing in motor control and sensor fusion without floating-point overhead
Max Clock Frequency100 MHz - supports real-time response in closed-loop control systems with sub-μs interrupt latency
Flash Memory512 KB program flash only (no FlexMemory) - provides ample space for firmware, bootloader, and field-upgradable code in industrial devices
RAM128 KB SRAM - sufficient for complex data buffering, stack depth, and RTOS task management
Operating Voltage1.71–3.6 V - compatible with single-cell Li-ion, 3.3 V rails, and wide-input DC-DC converters
Temperature Range–40°C to +105°C - qualified for under-hood automotive, industrial PLC, and outdoor metering environments
Analog PeripheralsDual 16-bit SAR ADCs (each with PGA up to ×64), two 12-bit DACs, three analog comparators - enables high-precision sensor acquisition and actuator feedback without external signal conditioning
Communication Interfaces2× CAN, 6× UART, 3× SPI, 2× I²C, SDHC, I²S - supports robust fieldbus connectivity, human-machine interface, and secure data logging

Pinout & Package

This device is housed in a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch), designated by "LQ" in the part number. The package supports full signal access including FlexBus multiplexing, LCD segment drive capability, and TSI touch sensing inputs.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSDigital power supply and groundMultiple dedicated pairs ensure stable core voltage delivery and noise isolation for mixed-signal operation
VDDA, VSSAAnalog power supply and groundSeparate analog domain with tight coupling to ADC/DAC/PGA blocks minimizes switching noise impact on precision conversion
EXTAL/XTALMain crystal oscillator input/outputSupports 3–32 MHz crystals for precise timing; internal load capacitors reduce BOM count
EXTAL32/XTAL3232 kHz RTC crystal terminalsEnables ultra-low-power timekeeping with independent oscillator domain during deep sleep modes
PTA0–PTA31, PTB0–PTB17, etc.General-purpose I/O with multiplexed functionsEach port supports configurable slew rate, drive strength, pull-up/down, and digital filtering - critical for EMI control and signal integrity
ADC0_SE0–ADC0_SE15, ADC1_SE0–ADC1_SE15Analog input channelsUp to 32 total single-ended inputs across two ADCs; channel selection controlled via software register mapping
CAN0_TX/CAN0_RX, CAN1_TX/CAN1_RXCAN transceiver interfaceDedicated differential pins with internal termination resistors and loopback test mode for validation
FLEXBUS_A0–FLEXBUS_A23, FLEXBUS_D0–FLEXBUS_D15External memory bus signalsEnables connection to NOR/NAND flash, SRAM, or FPGA peripherals with configurable wait states and burst support

Key Features

FeatureDesign Value
Low-Power ModesSeven distinct power modes (RUN, VLPR, WAIT, STOP, VLPS, LLS, VLLSx) with sub-μA retention current - enables battery-powered operation for years in metering and remote sensing
Segment LCD ControllerDrives up to 40 frontplanes × 8 backplanes - eliminates need for external LCD driver IC in industrial HMI and medical displays
Hardware CRC ModuleAccelerates checksum calculation for firmware updates and data integrity verification - reduces CPU load and improves OTA update reliability
Touch Sensing Interface (TSI)Capacitive touch sensing on up to 16 channels with automatic calibration - supports robust button/slider implementation without external components
Memory Protection Unit (MPU)Configurable region-based protection for flash, RAM, and peripherals - enforces secure partitioning in safety-critical firmware
Unique 128-bit IDFactory-programmed per-chip serial number - enables secure device authentication and cryptographic key binding

Applications

Industrial Motor ControlSmart Energy Metering

Use Scenario: Closed-loop control of BLDC motors in HVAC compressors and pump drives using PWM, quadrature decoding, and current sensing.

IC Role / Device Role / Timing Role: Primary controller executing FOC algorithms, managing gate drivers via PWM outputs, and synchronizing ADC sampling with commutation events.

Use Value: Integrated 100 MHz M4 core with DSP accelerates motor control math; dual ADCs enable simultaneous phase current and DC bus voltage capture at 1 MSps.

Use Scenario: Polyphase electricity meter with tariff switching, tamper detection, and wireless communication via UART-to-PLC or RF modules.

IC Role / Device Role / Timing Role: System-on-chip managing metrology calculations, RTC-based billing intervals, secure storage, and host interface protocol handling.

Use Value: On-chip 16-bit ADCs with PGA provide direct connection to current transformers; 512 KB flash stores multiple firmware versions and encryption keys.

Automotive Body ElectronicsMedical Patient Monitoring

Use Scenario: Central body controller managing door locks, lighting, window lift, and LIN/CAN gateway functions in passenger vehicles.

IC Role / Device Role / Timing Role: Real-time coordinator interfacing with sensors, actuators, and external ECUs via CAN and LIN (via UART+transceiver).

Use Value: Dual CAN controllers support redundant communication paths; –40°C to +105°C rating ensures reliability in engine bay proximity mounting.

Use Scenario: Portable ECG/SpO₂ monitor requiring low-noise analog front-end, battery longevity, and graphical display output.

IC Role / Device Role / Timing Role: Signal acquisition hub digitizing biopotentials, driving segmented LCD, and managing USB/Bluetooth data transfer.

Use Value: Integrated TSI supports touch-button UI; low-leakage stop modes extend battery life beyond 72 hours on coin cell; 128 KB RAM buffers waveform data.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MK30DX256VLQ10256 KB flash + 256 KB FlexNVM + 4 KB FlexRAM; same 100 MHz M4 core and peripheral setBetter suited for applications requiring EEPROM-like wear leveling or data logging with nonvolatile RAM emulationSelect when persistent data storage with byte-level write endurance is required over pure program storage capacity
KEA128M64S2VLDCortex-M0+ core, 64 KB flash, 8 KB RAM, no CAN, lower max frequency (48 MHz), smaller 64-pin LQFPTargeted at cost-sensitive, low-complexity control tasks where CAN and high-speed DSP are unnecessaryChoose for simpler subsystems like fan control or basic sensor nodes where footprint and BOM cost outweigh advanced feature needs

Compared with MK30DX256VLQ10, the MK30DN512VLQ10 trades FlexMemory capability for double the program flash - ideal for large firmware images and secure boot partitions. Versus KEA128M64S2VLD, it offers significantly higher compute throughput, dual CAN, and richer analog resources at the cost of larger package and higher power consumption.

Availability

MK30DN512VLQ10 is available at Aetrix Electronics and suitable for industrial motor control, smart energy metering, automotive body electronics, and portable medical monitoring requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for MK30DN512VLQ10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's Kinetis portfolio.

The MK30DN512VLQ10 belongs to the Kinetis K30 sub-family, engineered for high-integration, low-power embedded control in harsh environments - emphasizing analog-rich peripherals, real-time responsiveness, and functional safety readiness.

FAQ

What is the maximum operating frequency of the MK30DN512VLQ10?

The MK30DN512VLQ10 operates at a maximum core frequency of 100 MHz, achieved via its internal multi-purpose clock generator and PLL. This frequency is fully supported across the –40°C to +105°C ambient temperature range and 1.71–3.6 V supply voltage, with timing validated per the K30 Sub-Family Data Sheet Rev. 3. The MK30DN512VLQ10 maintains deterministic interrupt latency and bus bandwidth at this speed, making it suitable for time-critical control loops.

Does the MK30DN512VLQ10 include a hardware floating-point unit (FPU)?

No, the MK30DN512VLQ10 implements an ARM Cortex-M4 core with DSP instruction extensions but does not integrate a hardware floating-point unit. Its part number encoding ("D" = Cortex-M4 w/DSP, "N" = program flash only) confirms the absence of FPU. Applications requiring intensive floating-point computation must use software libraries or consider FPU-equipped variants like MK30DF512VLQ10 - though that part is not offered in the VLQ10 package.

What package type and pin count does the MK30DN512VLQ10 use?

The MK30DN512VLQ10 uses a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch), indicated by the "LQ" suffix in its part number. This package provides full access to all integrated peripherals including FlexBus, LCD segment drivers, TSI channels, dual CAN transceivers, and 100+ GPIOs with configurable analog/digital functions - enabling high-density board layouts without sacrificing I/O flexibility.

Can the MK30DN512VLQ10 support external memory expansion?

Yes, the MK30DN512VLQ10 includes a FlexBus external bus interface supporting asynchronous and synchronous memory mapping. It can connect to external NOR/NAND flash, SRAM, and peripherals via 24-bit address and 16-bit data buses, with programmable wait states, burst transfers, and chip select control. This capability is confirmed in the K30 Sub-Family Data Sheet Section 6.4.3 and enables firmware overlays, data logging buffers, or FPGA co-processing - all directly accessible by the MK30DN512VLQ10's CPU.

Is the MK30DN512VLQ10 qualified for automotive applications?

The MK30DN512VLQ10 is specified for operation from –40°C to +105°C and features dual CAN interfaces, AEC-Q100 stress testing compliance (as part of the broader K30 family qualification), and robust ESD ratings (±2 kV HBM). While not explicitly branded as "automotive grade" in its ordering code, its electrical and thermal specifications align with body electronics and chassis control requirements. Designers should verify specific vehicle OEM requirements and consult NXP's automotive qualification documentation for the MK30DN512VLQ10.

MK30DN512VLQ10 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
144-LQFP
Series:
Kinetis K30
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
102
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 46x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MK30DN512VLQ10 FAQ

1.How can I place an order for MK30DN512VLQ10 through Aetrix?

Please submit a Request for Quotation (RFQ) for MK30DN512VLQ10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MK30DN512VLQ10 reliable?

The price and inventory of MK30DN512VLQ10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK30DN512VLQ10 is usually 5 days.

3.What payment methods are accepted for MK30DN512VLQ10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK30DN512VLQ10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MK30DN512VLQ10?

MK30DN512VLQ10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MK30DN512VLQ10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MK30DN512VLQ10?

For technical support, including MK30DN512VLQ10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK30DN512VLQ10 requirements.

6.How does Aetrix verify that MK30DN512VLQ10 is sourced from the original manufacturer or authorized distributors?

All MK30DN512VLQ10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK30DN512VLQ10 meets industry standards.

7.What is the process for return or replacement of MK30DN512VLQ10?

All MK30DN512VLQ10 units undergo pre-shipment inspection (PSI). If there is an issue with MK30DN512VLQ10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MK30DN512VLQ10 part is unused and in its original packaging.

Return procedure for MK30DN512VLQ10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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