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NXP Semiconductors MK30DX256ZVLQ10

Part No.:
MK30DX256ZVLQ10
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixMK30DX256ZVLQ10.pdf
Description:
IC MCU 32BIT 256KB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,292

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Product details

Overview

MK30DX256ZVLQ10 from NXP Semiconductors (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, designed for embedded control applications requiring real-time signal processing, low-power operation, and integrated analog peripherals. It features 256 KB flash, 128 KB RAM, dual CAN interfaces, two 16-bit SAR ADCs with PGA, and operates from 1.71–3.6 V across –40 to 105°C ambient.

For engineers reviewing the MK30DX256ZVLQ10 datasheet, MK30DX256ZVLQ10 pinout, MK30DX256ZVLQ10 application, or MK30DX256ZVLQ10 equivalent, key selection considerations include its 100 MHz CPU frequency, LQFP-144 package with 114 GPIOs, FlexBus interface for external memory expansion, segment LCD controller, and hardware TSI for touch sensing in industrial HMI designs.

Technical Context

The MK30DX256ZVLQ10 implements an ARM Cortex-M4 core with single-cycle DSP instructions and a Memory Protection Unit (MPU) supporting multi-master protection. Its clock system integrates a 3–32 MHz crystal oscillator, 32 kHz RTC oscillator, and Multi-Purpose Clock Generator (MCG) with multiple modes including FEI, FEE, and BLPE for dynamic power/performance scaling.

Peripheral integration includes eight-channel motor control/PWM timer, two quadrature decoder timers, real-time clock, carrier modulator transmitter, and security modules such as hardware CRC and 128-bit unique chip ID. Analog subsystem comprises two independent 16-bit ADCs each with programmable gain amplifier (up to ×64), two 12-bit DACs, three analog comparators with integrated 6-bit DACs, and voltage reference.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M4 with DSP instructions, delivering 1.25 Dhrystone MIPS/MHz at 100 MHz - enables efficient real-time control and sensor fusion algorithms.
Flash / RAM256 KB program flash + 128 KB SRAM - supports complex firmware with large buffers and real-time data logging without external memory.
Operating Voltage1.71–3.6 V supply range - compatible with single Li-ion, 3.3 V, or 2.5 V system rails; eliminates need for additional voltage regulators.
Temperature Range–40 to 105°C ambient - qualified for under-hood automotive, industrial motor drives, and outdoor metering applications.
Analog PeripheralsTwo 16-bit SAR ADCs (each with PGA up to ×64), two 12-bit DACs, three analog comparators - enables high-precision sensor acquisition and closed-loop analog control in one chip.
Communication InterfacesDual CAN 2.0B, six UARTs, three SPIs, two I²C, SDHC, I²S - supports robust fieldbus connectivity, wireless co-processor interfacing, and audio/data streaming.
Low-Power ModesVLPS, LLS, VLLS1–3 stop modes with sub-μA current (e.g., 2.1 μA in VLLS1 @ –40 to 25°C) - extends battery life in portable and energy-harvested systems.

Pinout & Package

Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VDD/VSSDigital power/ground12 dedicated pairs ensure stable core voltage delivery and noise isolation for mixed-signal operation.
VDDA/VSSAAnalog power/groundSeparate analog domain pins reduce coupling noise into ADC/DAC paths; require local decoupling per datasheet layout guidelines.
EXTAL/XTALMain crystal oscillator inputsSupport 3–32 MHz crystal; enable precise timing for USB, CAN, and real-time control loops.
EXTAL32/XTAL3232 kHz RTC crystal inputsEnable low-power timekeeping during deep sleep modes with <2.1 μA VLLS1 current draw.
PTA0–PTA31, PTB0–PTB17, etc.GPIO with multiplexed peripherals114 total GPIOs with configurable pull-up/down, slew rate, and drive strength - support flexible board routing and legacy interface emulation.
CAN0_TX/CAN0_RXCAN 2.0B differential transceiver signalsDedicated pins for first CAN bus; require external transceiver and termination for ISO 11898-2 compliance.
ADC0_SE0–ADC0_SE15Analog input channels16 single-ended inputs for first ADC; support simultaneous sampling with hardware trigger from timers or DMA.

Key Features

FeatureDesign Value
Segment LCD controllerDrives up to 40 frontplanes × 8 backplanes or 44 × 4 - enables cost-effective alphanumeric displays in HVAC, medical devices, and industrial panels without external display driver IC.
Hardware touch sensing interface (TSI)16-channel capacitive touch sensing with low-power wake-on-touch - replaces mechanical buttons in battery-powered HMI with <1 μA standby current.
FlexBus external bus interface8/16-bit parallel interface with wait-state control - connects NOR/NAND flash, SRAM, or FPGA logic for memory expansion or custom peripheral offload.
Programmable delay block (PDB)High-resolution timing module synchronized to ADC conversions - enables precise phase-shifted PWM generation for motor control and resonant converters.
Memory Protection Unit (MPU)Configurable regions with privilege/access attributes - enforces software partitioning between RTOS tasks and prevents accidental memory corruption in safety-critical firmware.

Applications

Industrial Motor ControlSmart Energy Metering

Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC compressors or pump drives using space-vector PWM and real-time current sensing.

IC Role / Device Role / Timing Role: Primary MCU executing FOC algorithm, acquiring dual ADC samples synchronously, generating 6-channel complementary PWM with dead-time insertion, and communicating via CAN to master controller.

Use Value: Integrated PDB and motor control timer eliminate external timing ICs; 100 MHz M4 core processes 20 kHz PWM updates with margin for communication and diagnostics.

Use Scenario: Polyphase electricity meter with harmonic analysis, tamper detection, and DLMS/COSEM protocol over PLC or RF mesh.

IC Role / Device Role / Timing Role: System-on-chip managing metrology ADC interface, secure crypto acceleration, RTC-backed data logging, and dual-port communication (UART + SPI to external modem).

Use Value: Dual CAN and six UARTs support redundant fieldbus and modem interfaces; 256 KB flash stores full DLMS stack and firmware updates; VLLS3 mode enables <3.1 μA RTC-only operation.

Medical Patient MonitorAutomotive Body Control Module

Use Scenario: Portable vital signs monitor measuring ECG, SpO₂, and temperature with graphical LCD and Bluetooth LE interface.

IC Role / Device Role / Timing Role: Signal processor acquiring analog biosignals via PGA-augmented ADCs, driving segment LCD, managing touch UI, and handling BLE HCI over UART.

Use Value: On-chip TSI reduces BOM count for touch buttons; LCD controller drives 128×64 display directly; low-leakage wakeup unit enables fast resume from sleep on button press.

Use Scenario: Central body controller managing door locks, lighting, wipers, and LIN slave nodes in entry-level vehicles.

IC Role / Device Role / Timing Role: Main controller executing CAN message filtering, PWM dimming for LED lighting, LIN master arbitration, and EEPROM-based configuration storage.

Use Value: Dual CAN interfaces handle powertrain and body networks independently; 128 KB RAM buffers CAN messages during peak bus load; –40 to 105°C rating meets automotive AEC-Q100 Grade 2 requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MK30DN512ZVLQ10Same K30 family, Cortex-M4 core, but 512 KB flash, no FlexMemory; identical 144-LQFP package and pinout.Targets larger firmware images (e.g., OTA update stacks, advanced cryptography) where 256 KB is insufficient.Select when firmware size exceeds 256 KB and FlexMemory is not required; drop-in replacement with no PCB changes.
KEA128AMLHCortex-M0+ core, 128 KB flash, 16 KB RAM, 80-LQFP; lower performance, simpler peripheral set, and reduced analog capability.Suitable for cost-sensitive, lower-complexity body electronics (e.g., seat control, mirror adjustment) without motor control or advanced HMI.Choose for BOM cost reduction where 100 MHz M4 performance and dual CAN are unnecessary; requires PCB redesign due to different package and pin count.

Compared with MK30DX256ZVLQ10, MK30DN512ZVLQ10 offers double flash capacity with identical footprint and feature set, while KEA128AMLH trades performance and integration for cost and simplicity-making it suitable only for less demanding applications lacking DSP, high-speed ADC, or LCD requirements.

Availability

MK30DX256ZVLQ10 is available at Aetrix Electronics and suitable for industrial motor control, smart energy metering, medical patient monitors, and automotive body control modules requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for MK30DX256ZVLQ10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's Kinetis portfolio.

The MK30DX256ZVLQ10 belongs to the Kinetis K30 microcontroller family, engineered for cost-optimized, mixed-signal embedded systems requiring real-time control, low-power operation, and integrated analog peripherals in harsh environments.

FAQ

What is the maximum operating frequency of the MK30DX256ZVLQ10?

The MK30DX256ZVLQ10 operates at a maximum CPU frequency of 100 MHz, enabled by its ARM Cortex-M4 core with DSP extensions. This frequency is supported across the full –40 to 105°C temperature range and 1.71–3.6 V supply voltage, with clock stability ensured by the integrated Multi-Purpose Clock Generator (MCG) and external crystal oscillator options. The MK30DX256ZVLQ10 achieves 1.25 Dhrystone MIPS per MHz, making it suitable for computationally intensive real-time tasks.

Does the MK30DX256ZVLQ10 support CAN FD or only classical CAN?

The MK30DX256ZVLQ10 supports only Classical CAN 2.0B, not CAN FD. It integrates two independent CAN modules compliant with ISO 11898-1, each featuring message buffering, acceptance filtering, and loopback self-test modes. CAN FD capabilities-including higher data rates and extended payload length-are absent in the K30 family; those features appear in later NXP families such as S32K or K32L series. For MK30DX256ZVLQ10 designs, external CAN FD controllers or gateway MCUs are required if FD compatibility is needed.

What package type and pin count does the MK30DX256ZVLQ10 use?

The MK30DX256ZVLQ10 uses a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch), denoted by the "LQ" suffix in its part number. This package provides 114 general-purpose I/O pins with extensive peripheral multiplexing, including dedicated CAN, USB, SDHC, and LCD signals. It is RoHS-compliant, rated at Moisture Sensitivity Level 3, and compatible with standard surface-mount reflow profiles per IPC/JEDEC J-STD-020.

How much SRAM and flash memory does the MK30DX256ZVLQ10 include?

The MK30DX256ZVLQ10 integrates 256 KB of on-chip program flash memory and 128 KB of SRAM. Flash memory supports read-while-write operation and includes error correction circuitry; SRAM is organized as a unified block accessible by CPU and DMA. Both memories operate across the full temperature and voltage range, with retention guaranteed down to 1.2 V for RAM and full functionality maintained from 1.71 V. The MK30DX256ZVLQ10 does not include FlexMemory - its flash is dedicated to program storage only.

Is the MK30DX256ZVLQ10 qualified for automotive applications?

The MK30DX256ZVLQ10 is specified for operation from –40 to 105°C and meets industrial reliability standards, but it is not AEC-Q100 qualified. While its temperature range overlaps with Automotive Grade 2 (–40 to 105°C), NXP does not list this part in its official AEC-Q100-certified portfolio. For automotive body control or infotainment applications requiring formal qualification, designers should select AEC-Q100-compliant alternatives such as the S32K144 or K32L2B series. The MK30DX256ZVLQ10 remains appropriate for industrial and medical applications within its rated conditions.

MK30DX256ZVLQ10 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
144-LQFP
Series:
Kinetis K30
Packaging:
Tray
Product Status:
Not For New Designs
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
102
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 46x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MK30DX256ZVLQ10 FAQ

1.How can I place an order for MK30DX256ZVLQ10 through Aetrix?

Please submit a Request for Quotation (RFQ) for MK30DX256ZVLQ10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MK30DX256ZVLQ10 reliable?

The price and inventory of MK30DX256ZVLQ10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK30DX256ZVLQ10 is usually 5 days.

3.What payment methods are accepted for MK30DX256ZVLQ10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK30DX256ZVLQ10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MK30DX256ZVLQ10?

MK30DX256ZVLQ10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MK30DX256ZVLQ10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MK30DX256ZVLQ10?

For technical support, including MK30DX256ZVLQ10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK30DX256ZVLQ10 requirements.

6.How does Aetrix verify that MK30DX256ZVLQ10 is sourced from the original manufacturer or authorized distributors?

All MK30DX256ZVLQ10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK30DX256ZVLQ10 meets industry standards.

7.What is the process for return or replacement of MK30DX256ZVLQ10?

All MK30DX256ZVLQ10 units undergo pre-shipment inspection (PSI). If there is an issue with MK30DX256ZVLQ10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MK30DX256ZVLQ10 part is unused and in its original packaging.

Return procedure for MK30DX256ZVLQ10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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