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NXP Semiconductors MK40DN512VMD10
- Part No.:
- MK40DN512VMD10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LBGA
- Datasheet:
-
MK40DN512VMD10.pdf
- Description:
- IC MCU 32B 512KB FLASH 144MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:800
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Product details
Overview
MK40DN512VMD10 from NXP (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, designed for embedded control applications requiring high integration, low-power operation, and mixed-signal capability. It delivers 100 MHz core performance, 512 KB on-chip flash memory, 128 KB RAM, dual 16-bit SAR ADCs with integrated PGA, two 12-bit DACs, two CAN interfaces, USB OTG, and operates across –40 to 105°C in industrial environments.
For engineers reviewing the MK40DN512VMD10 datasheet, MK40DN512VMD10 pinout, MK40DN512VMD10 application, or MK40DN512VMD10 equivalent, key selection considerations include its FlexBus interface for external memory expansion, segment LCD controller supporting up to 44 frontplanes, TSI-based touch sensing, and support for multiple low-power stop modes down to 2.1 µA in VLLS1 mode.
Technical Context
The MK40DN512VMD10 implements an ARM Cortex-M4 core with hardware DSP instructions and no FPU, paired with a multi-purpose clock generator supporting crystal oscillators at 3–32 MHz and 32 kHz. Its memory subsystem includes 512 KB of program flash (non-FlexMemory configuration), 128 KB RAM, and dedicated EzPort for serial programming.
System-level features include a 16-channel DMA controller with 63 request sources, memory protection unit (MPU) with multi-master protection, hardware CRC module, and low-leakage wakeup unit. Analog integration comprises two independent 16-bit ADCs each with programmable gain amplifier (up to ×64), two 12-bit DACs, three analog comparators with internal 6-bit DACs, and transimpedance amplifiers - all operating within the 1.71–3.6 V supply range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M4 @ 100 MHz with DSP instructions, no FPU - enables real-time signal processing in motor control and sensor fusion without floating-point overhead |
| Flash / RAM | 512 KB program flash (non-FlexMemory), 128 KB SRAM - sufficient for complex firmware with bootloader, communication stacks, and data buffers |
| ADC | Dual 16-bit SAR ADCs with integrated PGA (×1 to ×64) - supports high-resolution sensor acquisition with programmable gain for microvolt-level signals |
| DAC | Two 12-bit DACs - provides precise analog output for calibration, biasing, or waveform generation in closed-loop systems |
| Communication | 2× CAN 2.0B, 6× UART, 3× SPI, 2× I²C, USB full-/low-speed OTG, SDHC - enables robust industrial networking and peripheral interfacing |
| Operating Range | 1.71–3.6 V supply, –40 to 105°C ambient - certified for extended-temperature industrial and automotive under-hood applications |
| Low-Power Modes | VLLS1/VLLS2/VLLS3 stop modes drawing as low as 2.1 µA - suitable for battery-backed RTC, wake-on-event, and ultra-low-quiescent IoT edge nodes |
Pinout & Package
Package: 144-pin LQFP (20 mm × 20 mm), RoHS-compliant, moisture sensitivity level 3 per J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Digital power/ground | Primary 1.71–3.6 V supply domain; requires local decoupling per datasheet layout guidelines |
| VDDA, VSSA | Analog power/ground | Independent analog supply domain; must be within ±0.1 V of VDD to ensure ADC/DAC accuracy |
| EXTAL/XTAL | Main crystal oscillator inputs | Supports 3–32 MHz crystals; critical for system clock stability and USB timing compliance |
| EXTAL32/XTAL32 | 32 kHz RTC crystal inputs | Enables precision real-time clock operation with battery backup via VBAT pin |
| PTA0–PTA31, PTB0–PTB17, etc. | GPIO / peripheral multiplexed pins | Configurable as digital I/O, UART, SPI, CAN, ADC input, DAC output, or LCD segment/backplane drivers |
| USB_DP/USB_DM | USB differential data lines | Integrated full-/low-speed transceiver; requires 27 Ω series resistors and proper PCB impedance control |
| CAN0_TX/CAN0_RX, CAN1_TX/CAN1_RX | CAN bus interface signals | Direct connection to external CAN transceivers; supports ISO 11898-1 compliant differential signaling |
Key Features
| Feature | Design Value |
|---|---|
| Segment LCD controller | Drives up to 44 frontplanes × 4 backplanes or 40 × 8 - eliminates external display driver IC in HMI applications |
| Low-power hardware touch sensing (TSI) | Capacitive touch detection with <1 µA active current - enables battery-operated touch panels without dedicated touch controller |
| FlexBus external bus interface | 8/16-bit parallel interface with wait-state control - supports NOR flash, SRAM, FPGA, or ASIC co-processor expansion |
| Programmable delay block (PDB) | High-resolution timing engine synchronized to ADC conversions - enables precise PWM dead-time insertion and motor phase current sampling |
| Hardware CRC module | Polynomial-agnostic 32-bit CRC calculation in one clock cycle - accelerates firmware integrity checks and communication frame validation |
Applications
| Industrial Motor Control | Medical Sensor Hub |
|---|---|
Use Scenario: Closed-loop control of BLDC/PMSM motors in HVAC blowers, pumps, and compressors with field-oriented control (FOC). IC Role / Device Role / Timing Role: Primary MCU executing FOC algorithm, sampling current/voltage via dual synchronized ADCs, generating 8-channel PWM with PDB-triggered dead-time, and communicating over CAN. Use Value: Integrated PGA enables direct shunt resistor measurement without external op-amps; 100 MHz core handles real-time FOC math while low-power stop modes reduce idle energy consumption. | Use Scenario: Portable patient monitor aggregating ECG, SpO₂, temperature, and motion data with local preprocessing and Bluetooth/WiFi offload. IC Role / Device Role / Timing Role: Central sensor fusion processor managing analog front-end (ADC/DAC/comparators), real-time clock, secure data logging to SDHC, and USB host for configuration. Use Value: Dual 16-bit ADCs with PGA support high-precision biopotential acquisition; VLLS3 mode (<23 µA) extends battery life during standby without losing RTC or RAM context. |
| Automotive Body Controller | Smart Building HMI Panel |
Use Scenario: Gateway and sub-system controller for lighting, door locks, window lift, and climate actuation in 12 V vehicle architectures. IC Role / Device Role / Timing Role: CAN-connected node performing LIN master emulation, PWM dimming, GPIO-driven relay control, and watchdog-monitored safety logic. Use Value: Two independent CAN modules allow simultaneous connection to powertrain and body networks; wide temperature range (–40 to 105°C) ensures reliability in engine bay proximity. | Use Scenario: Wall-mounted building automation interface with segmented LCD display, capacitive touch keys, environmental sensors, and Ethernet/RS-485 connectivity. IC Role / Device Role / Timing Role: HMI controller driving 40-segment LCD, scanning TSI electrodes, reading temperature/humidity ADC inputs, and managing network stack via UART/Ethernet MAC. Use Value: On-chip LCD controller reduces BOM cost and PCB area; TSI hardware offloads touch processing from CPU, enabling responsive UI with minimal firmware overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| K22FN512VLH12 | ARM Cortex-M4F (with FPU), 120 MHz max, 512 KB flash, same 144-LQFP package but different pinout and peripheral mapping | Lacks integrated segment LCD controller and TSI; adds FPU for floating-point math but removes LCD/TSI analog peripherals | Select when floating-point computation dominates and display/touch are handled externally |
| STM32F407VGT6 | ARM Cortex-M4F @ 168 MHz, 1 MB flash, 192 KB RAM, 144-LQFP, no integrated LCD/TSI, different ADC/DAC architecture | Higher clock speed and memory, but requires external components for LCD and touch; USB OTG HS vs. FS/LS on MK40DN512VMD10 | Choose for higher throughput applications where external display/touch ICs are acceptable and FPU is required |
Compared with K22FN512VLH12 and STM32F407VGT6, the MK40DN512VMD10 offers unique on-die segment LCD and TSI controllers - reducing component count and power in HMI-centric designs - while trading off FPU and maximum clock frequency for deterministic analog integration and industrial temperature certification.
Availability
MK40DN512VMD10 is available at Aetrix Electronics and suitable for industrial motor control, medical sensor hubs, automotive body electronics, and smart building HMI panels requiring stable component supply, long-term lifecycle assurance, and extended-temperature operation.
Supply support for MK40DN512VMD10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The K40 microcontroller family, including MK40DN512VMD10, was engineered for high-integration industrial control with emphasis on analog precision, low-power operation, and mixed-signal HMI capabilities - targeting applications where sensor interfacing, motor control, and human interaction converge.
FAQ
What is the maximum operating frequency and core type of the MK40DN512VMD10?
The MK40DN512VMD10 features an ARM Cortex-M4 core with DSP extensions running at up to 100 MHz. It does not include a floating-point unit (FPU). This configuration balances computational throughput for real-time control algorithms with deterministic interrupt latency and power efficiency - making MK40DN512VMD10 well-suited for motor control, sensor processing, and industrial automation where fixed-point math suffices.
Does the MK40DN512VMD10 support external memory expansion?
Yes, the MK40DN512VMD10 includes a FlexBus external bus interface supporting 8-bit or 16-bit parallel connections to NOR flash, SRAM, or peripheral ASICs. The interface provides address/data multiplexing, chip select control, and programmable wait states - enabling seamless expansion beyond its on-chip 512 KB flash and 128 KB RAM. This capability is directly implemented in MK40DN512VMD10's pinout and requires no external glue logic.
What analog peripherals are integrated into the MK40DN512VMD10?
The MK40DN512VMD10 integrates two independent 16-bit SAR ADCs, each with a programmable gain amplifier (PGA) offering gains from ×1 to ×64; two 12-bit DACs; three analog comparators with internal 6-bit DACs and programmable reference inputs; two transimpedance amplifiers; and a precision voltage reference. These are fully operational across the device's 1.71–3.6 V supply and –40 to 105°C range - confirming MK40DN512VMD10's suitability for high-fidelity sensor signal chains in harsh environments.
Can the MK40DN512VMD10 drive a segment LCD display directly?
Yes, the MK40DN512VMD10 includes a dedicated segment LCD controller capable of driving up to 44 frontplanes and 4 backplanes, or 40 frontplanes and 8 backplanes, depending on configuration. This eliminates the need for external LCD driver ICs in applications such as industrial HMIs, medical devices, or smart meters - reducing BOM cost and PCB complexity. The LCD controller is fully integrated and functional in MK40DN512VMD10's 144-LQFP package.
What low-power modes are supported by the MK40DN512VMD10?
The MK40DN512VMD10 supports seven low-power modes including RUN, WAIT, VLPR, STOP, VLPS, LLS, and VLLS (submodes 1–3), with VLLS1 consuming as little as 2.1 µA at 3.0 V and –40 to 25°C. All modes retain RAM content and selected peripheral states, and VLLS3 preserves RTC operation and limited GPIO wake capability. These modes are hardware-controlled and validated across the full industrial temperature range - a key design feature of MK40DN512VMD10 for battery-powered and energy-sensitive applications.
MK40DN512VMD10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LBGA
- Series:
- Kinetis K40
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 98
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 42x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK40DN512VMD10 FAQ
1.How can I place an order for MK40DN512VMD10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK40DN512VMD10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK40DN512VMD10 reliable?
The price and inventory of MK40DN512VMD10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK40DN512VMD10 is usually 5 days.
3.What payment methods are accepted for MK40DN512VMD10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK40DN512VMD10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK40DN512VMD10?
MK40DN512VMD10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK40DN512VMD10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK40DN512VMD10?
For technical support, including MK40DN512VMD10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK40DN512VMD10 requirements.
6.How does Aetrix verify that MK40DN512VMD10 is sourced from the original manufacturer or authorized distributors?
All MK40DN512VMD10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK40DN512VMD10 meets industry standards.
7.What is the process for return or replacement of MK40DN512VMD10?
All MK40DN512VMD10 units undergo pre-shipment inspection (PSI). If there is an issue with MK40DN512VMD10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK40DN512VMD10 part is unused and in its original packaging.
Return procedure for MK40DN512VMD10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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