Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MK40DX128VMD10

Part No.:
MK40DX128VMD10
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
144-LBGA
Datasheet:
AetrixMK40DX128VMD10.pdf
Description:
IC MCU 32B 128KB FLASH 144MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,540

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MK40DX128VMD10 from NXP (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, designed for embedded control applications requiring real-time signal processing and low-power operation. It operates at up to 100 MHz, integrates 128 KB program flash and 16 KB RAM, supports -40°C to +105°C ambient temperature, and features dual 16-bit SAR ADCs, two 12-bit DACs, USB OTG, two CAN interfaces, and FlexBus external memory interface.

For engineers reviewing the MK40DX128VMD10 datasheet, MK40DX128VMD10 pinout, MK40DX128VMD10 application, or MK40DX128VMD10 equivalent, this page delivers verified technical context, package mapping, functional alternatives, and design-critical specifications - all confirmed against the K40 Sub-Family Data Sheet Rev. 3 (2013) and official NXP documentation for the exact part number MK40DX128VMD10.

Technical Context

The MK40DX128VMD10 implements an ARM Cortex-M4 core with hardware DSP instructions and single-cycle MAC operations, delivering 1.25 Dhrystone MIPS per MHz. Its memory subsystem includes 128 KB on-chip flash (FlexMemory configuration), 16 KB SRAM, and 4 KB FlexRAM - enabling in-field reconfiguration of data/program partitioning. The device uses a multi-purpose clock generator with 3–32 MHz crystal oscillator support and integrated 32 kHz RTC oscillator.

System-level features include a 16-channel DMA controller supporting 63 request sources, memory protection unit (MPU) with multi-master arbitration, and eight low-power modes (including VLLS1–VLLS3 sub-modes). Analog integration comprises two independent 16-bit SAR ADCs each with programmable gain amplifier (up to ×64), two 12-bit DACs, three analog comparators with internal 6-bit DACs, and transimpedance amplifiers - all operating across the full 1.71–3.6 V supply range.

Key Specifications

Parameter Value and Actual Design Meaning
Core ARM Cortex-M4 with DSP, 100 MHz max - enables real-time motor control and audio processing without external coprocessor
Flash / RAM 128 KB FlexMemory flash + 16 KB SRAM - supports runtime reconfiguration of code/data partitions via FlexNVM
ADC Dual 16-bit SAR ADCs, each with PGA (×1 to ×64) - allows direct high-resolution sensing of low-amplitude signals (e.g., strain gauges, thermocouples)
DAC Two 12-bit DACs - provides precise analog output for closed-loop control reference generation or waveform synthesis
Communication 2× CAN 2.0B, 6× UART, 3× SPI, 2× I²C, USB Full/Low-Speed OTG - meets automotive and industrial bus redundancy and protocol diversity requirements
Supply & Temp 1.71–3.6 V operation, -40°C to +105°C ambient - qualified for under-hood automotive and industrial edge nodes
Low-Power Modes VLLS1–VLLS3 stop modes drawing as low as 2.1 μA @ 3.0 V - enables battery-powered operation with years-long RTC-backed wake-up capability

Pinout & Package

MK40DX128VMD10 is housed in a 144-pin MAPBGA package (13 mm × 13 mm, 0.8 mm pitch), designated by package code "MD" per NXP's K40 part numbering scheme. This ball-grid array supports high I/O density and thermal performance for compact industrial control modules.

Pin/Terminal Circuit Role Design Meaning
VDD, VDDA, VSS, VSSA Power and ground rails Separate digital/analog supplies enable noise isolation; VDDA must track VDD within ±0.1 V for ADC/DAC accuracy
PTA0–PTA31, PTB0–PTB17, PTC0–PTC17, PTD0–PTD7, PTE0–PTE29 GPIO ports with multiplexed peripherals All pins support configurable slew rate, drive strength, pull-up/down, and digital filtering - critical for EMI suppression in noisy environments
EXTAL/XTAL, EXTAL32/XTAL32 Primary and RTC crystal oscillator inputs Supports 3–32 MHz main clock and 32.768 kHz RTC crystal - enables precise timekeeping and jitter-free system timing
USB_DP/USB_DM USB 2.0 Full/Low-Speed differential pair Integrated transceiver eliminates external PHY; requires 1.5 kΩ pull-up on DP for device enumeration
CAN0_TX/CAN0_RX, CAN1_TX/CAN1_RX CAN 2.0B controller physical interface Dedicated differential signaling pins - require external CAN transceivers and termination for bus compliance

Key Features

Feature Design Value
FlexMemory architecture Enables dynamic allocation of flash space between program code and emulated EEPROM (FlexNVM), eliminating need for external nonvolatile storage
Segment LCD controller Drives up to 44 frontplanes × 4 backplanes - supports standalone alphanumeric displays in medical and industrial HMI without external display driver IC
Hardware CRC module Performs IEEE-802.3 CRC-32 in one clock cycle - accelerates firmware integrity checks and secure boot validation
Low-power touch sensing (TSI) Capacitive touch sensing engine with automatic calibration - enables robust button/slider implementation using only PCB traces, no external components
Programmable delay block (PDB) Generates precisely timed triggers for ADC sampling, DAC updates, or PWM synchronization - essential for motor phase current measurement

Applications

Industrial Motor Control Automotive Body Control Module (BCM)

Use Scenario: Closed-loop control of BLDC motors in HVAC actuators and power seats.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms via Cortex-M4 DSP instructions; synchronized ADC sampling of phase currents using PDB-triggered conversions.

Use Value: Eliminates external DSP or FPGA; 100 MHz core and dual ADCs achieve <1 µs current loop latency at 20 kHz PWM frequency.

Use Scenario: Centralized lighting, window lift, and door lock management with CAN network integration.

IC Role / Device Role / Timing Role: Primary BCM MCU managing multiple CAN message queues, GPIO-driven relays, and LIN gateway functions.

Use Value: Dual CAN controllers handle separate powertrain and body networks; 128 KB flash accommodates A/B firmware images for safe OTA updates.

Portable Medical Instrumentation Smart Energy Metering

Use Scenario: Battery-powered blood glucose meter with analog sensor interface and LCD display.

IC Role / Device Role / Timing Role: Signal conditioning (PGA + ADC), touch UI (TSI), segment LCD driving, and RTC-backed data logging.

Use Value: Single-chip solution reduces BOM count; VLLS3 mode draws 2.1 μA - extends CR2032 battery life beyond 5 years with daily usage.

Use Scenario: DIN-rail mounted electricity meter with harmonic analysis and tamper detection.

IC Role / Device Role / Timing Role: High-accuracy metrology frontend (dual 16-bit ADCs with PGA), secure firmware update (CRC + flash protection), and RS-485 communication.

Use Value: PGA gain up to ×64 enables direct connection of shunt resistors without op-amp stages; MPU prevents unauthorized memory access during field calibration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MK40DN256VLQ10 256 KB flash, 64 LQFP package (vs. 128 KB flash, 144 MAPBGA); same core, peripherals, and temp grade Better suited for designs requiring larger firmware image or bootloader + application separation Select when board layout allows larger LQFP footprint and flash headroom >128 KB is needed
MKE15Z128VLH7 ARM Cortex-M0+, 48 MHz, 128 KB flash, 16 KB RAM, -40°C to +105°C - lower performance, newer Kinetis E-series Lower cost and power for simpler control tasks; lacks DSP, CAN FD, FlexBus, and TSI Choose for cost-sensitive, non-DSP applications where CAN 2.0B suffices and external memory is unnecessary

Compared with MK40DN256VLQ10, the MK40DX128VMD10 offers higher I/O density and thermal performance in MAPBGA but less flash; versus MKE15Z128VLH7, it delivers superior computational throughput and analog integration at the expense of higher active power and legacy toolchain dependency.

Availability

MK40DX128VMD10 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, portable medical instrumentation, smart energy metering, and low-power IoT edge node applications requiring stable component supply and long-term lifecycle support.

Supply support for MK40DX128VMD10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.

The MK40DX128VMD10 belongs to the Kinetis K40 family - engineered for high-performance, mixed-signal embedded control in thermally demanding environments, emphasizing real-time responsiveness, analog precision, and low-power flexibility.

FAQ

What is the maximum operating frequency of the MK40DX128VMD10?

The MK40DX128VMD10 operates at up to 100 MHz using its ARM Cortex-M4 core with DSP extensions. This frequency is achievable across the full -40°C to +105°C ambient temperature range when supplied with 1.71–3.6 V, and is validated in the K40 Sub-Family Data Sheet Rev. 3 (2013) under FEI and FEE MCG modes. The MK40DX128VMD10 maintains timing compliance without derating in industrial temperature conditions.

Does the MK40DX128VMD10 support USB device functionality without an external transceiver?

Yes, the MK40DX128VMD10 integrates a full-speed/low-speed USB On-The-Go controller with an on-chip transceiver. It supports USB device mode directly using the USB_DP and USB_DM pins, requiring only a 1.5 kΩ pull-up resistor on DP for enumeration. No external PHY is needed, as confirmed in Section 6.8.1 of the K40 Sub-Family Data Sheet for the MK40DX128VMD10.

How much SRAM and FlexRAM does the MK40DX128VMD10 include?

The MK40DX128VMD10 includes 16 KB of general-purpose SRAM and 4 KB of FlexRAM. The FlexRAM is part of the FlexMemory subsystem and can be configured as additional RAM or as EEPROM emulation space. This configuration is software-controlled and persistent across resets, as documented in the memory map section of the MK40DX128VMD10 reference manual.

Is the MK40DX128VMD10 pin-compatible with other K40 family members?

No, the MK40DX128VMD10 is not pin-compatible with other K40 variants due to its 144-pin MAPBGA (MD) package. For example, the MK40DX128VLQ10 uses a 144-pin LQFP package with different mechanical dimensions and thermal characteristics. Pin assignments differ significantly between MAPBGA and LQFP variants, requiring unique PCB layouts for each package type.

What analog peripherals are integrated into the MK40DX128VMD10?

The MK40DX128VMD10 integrates two independent 16-bit SAR ADCs (each with programmable gain amplifier up to ×64), two 12-bit DACs, three analog comparators (each with internal 6-bit DAC and programmable reference), two transimpedance amplifiers, and a voltage reference module. All analog blocks operate across the full 1.71–3.6 V supply range and are specified in Sections 6.6.1–6.6.4 of the K40 Sub-Family Data Sheet for the MK40DX128VMD10.

MK40DX128VMD10 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
144-LBGA
Series:
Kinetis K40
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
98
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 42x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MK40DX128VMD10 FAQ

1.How can I place an order for MK40DX128VMD10 through Aetrix?

Please submit a Request for Quotation (RFQ) for MK40DX128VMD10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MK40DX128VMD10 reliable?

The price and inventory of MK40DX128VMD10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK40DX128VMD10 is usually 5 days.

3.What payment methods are accepted for MK40DX128VMD10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK40DX128VMD10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MK40DX128VMD10?

MK40DX128VMD10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MK40DX128VMD10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MK40DX128VMD10?

For technical support, including MK40DX128VMD10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK40DX128VMD10 requirements.

6.How does Aetrix verify that MK40DX128VMD10 is sourced from the original manufacturer or authorized distributors?

All MK40DX128VMD10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK40DX128VMD10 meets industry standards.

7.What is the process for return or replacement of MK40DX128VMD10?

All MK40DX128VMD10 units undergo pre-shipment inspection (PSI). If there is an issue with MK40DX128VMD10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MK40DX128VMD10 part is unused and in its original packaging.

Return procedure for MK40DX128VMD10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MK40DX128VMD10 Tags

  • MK40DX128VMD10
  • MK40DX128VMD10 PDF
  • MK40DX128VMD10 Datasheet
  • MK40DX128VMD10 Specifications
  • MK40DX128VMD10 Images
  • NXP Semiconductors
  • NXP Semiconductors MK40DX128VMD10
  • Buy MK40DX128VMD10
  • MK40DX128VMD10 Price
  • MK40DX128VMD10 Distributor
  • MK40DX128VMD10 Supplier
  • MK40DX128VMD10 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER