NXP Semiconductors MK40DX256VLQ10
- Part No.:
- MK40DX256VLQ10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
MK40DX256VLQ10.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:293
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MK40DX256VLQ10 from NXP Semiconductors (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, operating at up to 100 MHz. It integrates 256 KB on-chip flash memory, 128 KB RAM, dual 16-bit SAR ADCs with integrated PGA, two 12-bit DACs, two CAN interfaces, USB OTG, and an LCD controller - designed for industrial control and human-machine interface applications requiring real-time signal processing and low-power operation.
For engineers reviewing the MK40DX256VLQ10 datasheet, MK40DX256VLQ10 pinout, MK40DX256VLQ10 application, or MK40DX256VLQ10 equivalent, key selection considerations include its FlexMemory architecture (256 KB flash + 4 KB FlexRAM), -40°C to 105°C extended temperature rating, LQFP-144 package, and support for multiple low-power modes including VLLS1/VLLS3 with sub-10 µA stop-current performance.
Technical Context
The MK40DX256VLQ10 implements an ARM Cortex-M4 core with hardware-accelerated DSP instructions and a Memory Protection Unit (MPU) supporting multi-master protection. Its clock system includes a 3–32 MHz main crystal oscillator, 32 kHz RTC oscillator, and a Multi-Purpose Clock Generator (MCG) enabling flexible PLL-based frequency synthesis up to 100 MHz.
Peripheral integration includes eight-channel motor-control/PWM timers, two quadrature decoder timers, real-time clock (RTC), programmable delay block, carrier modulator transmitter, and security modules such as hardware CRC and 128-bit unique chip ID. Analog subsystems feature transimpedance amplifiers, three analog comparators with embedded 6-bit DACs, and voltage reference circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M4 with DSP, no FPU - enables deterministic real-time math operations without floating-point overhead |
| Max Clock Frequency | 100 MHz - delivers 125 DMIPS performance for high-throughput control loops |
| Flash Memory | 256 KB program flash + 4 KB FlexRAM - supports in-application reprogramming and data retention during low-power states |
| RAM | 128 KB SRAM - sufficient for complex firmware stacks, communication buffers, and real-time data logging |
| ADC | Dual 16-bit SAR ADCs with integrated PGA (up to ×64 gain) - enables direct sensor interfacing with high dynamic range |
| DAC | Two 12-bit DACs - provides precise analog output for calibration, actuator control, or waveform generation |
| Temperature Range | -40°C to +105°C - qualified for under-hood automotive, industrial motor drives, and outdoor equipment |
| Supply Voltage | 1.71 V to 3.6 V - compatible with single Li-ion, 3.3 V, or regulated 2.5 V rails without level-shifting |
Pinout & Package
LQFP-144 (20 mm × 20 mm, 0.5 mm pitch) package with exposed thermal pad - optimized for thermal dissipation in high-density industrial PCB layouts and compatible with standard reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Digital power supply and ground | Multiple dedicated pairs reduce IR drop and noise coupling across high-speed digital domains |
| VDDA, VSSA | Analog power supply and ground | Isolated analog rail with ≤0.1 V differential tolerance ensures ADC/DAC accuracy and noise immunity |
| EXTAL/XTAL | Main crystal oscillator input/output | Supports 3–32 MHz crystals for precise system timing and USB clock derivation |
| RTC_XTAL32 | 32 kHz RTC crystal connection | Enables battery-backed real-time clock with ±20 ppm accuracy over full temperature range |
| USB_DP/USB_DM | USB 2.0 full-/low-speed differential pair | Integrated transceiver eliminates external PHY - reduces BOM cost and board area |
| CAN0_TX/CAN0_RX | Controller Area Network channel 0 | Robust differential signaling compliant with ISO 11898-2 for industrial fieldbus and automotive diagnostics |
| PTA0–PTA31, PTB0–PTB17, etc. | GPIO multiplexed pins | Configurable as UART, SPI, I²C, PWM, TSI, or LCD segment/backplane drivers - maximizes peripheral flexibility per pin |
Key Features
| Feature | Design Value |
|---|---|
| FlexMemory architecture | 256 KB flash + 4 KB FlexRAM allows simultaneous code execution and nonvolatile data storage without erasing flash sectors |
| Low-power timer suite | Includes VLPR/VLPS/VLLS modes with sub-10 µA stop current - extends battery life in portable HMI and sensor nodes |
| Segment LCD controller | Drives up to 40×8 or 44×4 LCD segments directly - eliminates external display driver IC in instrumentation panels |
| Hardware CRC module | Accelerates checksum computation for firmware updates and secure boot verification - reduces CPU load by >95% vs software CRC |
| TSI touch interface | Capacitive touch sensing with hardware charge-transfer measurement - enables robust button/slider implementation with <1 µA active current |
| Multi-channel DMA | 16-channel controller with 63 request sources - offloads data movement from CPU for ADC sampling, USB transfers, and SPI buffering |
Applications
| Industrial Motor Control | Medical Diagnostic Equipment |
|---|---|
Use Scenario: Closed-loop servo drive for HVAC compressors and pump controllers requiring precise PWM timing and current feedback. IC Role / Device Role / Timing Role: Primary MCU executing FOC algorithms, managing dual ADC sampling at 1 MSps, generating synchronized 6-channel PWM outputs with dead-time insertion. Use Value: Integrated motor-control timers and 16-bit ADCs with PGA eliminate external signal conditioning, reducing component count and board space by 30%. | Use Scenario: Portable ultrasound front-end with analog beamforming, real-time image processing, and battery-powered operation. IC Role / Device Role / Timing Role: System-on-chip handling RF signal digitization via dual ADCs, DSP-based filtering, LCD display rendering, and USB host data export. Use Value: 100 MHz Cortex-M4 with DSP instructions processes 128-sample FFTs in <25 µs, while VLLS3 mode extends battery runtime to >72 hours between charges. |
| Automotive Body Control Module | Smart Energy Metering |
Use Scenario: Gateway node aggregating LIN/CAN messages, driving segmented dashboard displays, and monitoring door/window status. IC Role / Device Role / Timing Role: CAN/LIN protocol handler with hardware message filtering, LCD segment driver, and low-leakage wakeup unit for periodic CAN bus monitoring. Use Value: Dual CAN controllers and integrated LCD driver reduce external IC count by 4, while -40°C to 105°C rating ensures reliability in engine bay proximity. | Use Scenario: DIN-rail mounted electricity meter with harmonic analysis, tamper detection, and optical/IR communication interfaces. IC Role / Device Role / Timing Role: High-accuracy metrology processor acquiring voltage/current waveforms via dual ADCs, computing RMS, THD, and billing parameters in real time. Use Value: 16-bit ADCs with programmable gain amplifier achieve >99.9% accuracy across 1000:1 dynamic range, meeting IEC 62053-22 Class 0.5S requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| K22F512VLH12 | ARM Cortex-M4F (with FPU), 512 KB flash, 128 KB RAM, same LQFP-144 package but 120 MHz max clock | Better suited for floating-point intensive tasks (e.g., sensor fusion, predictive maintenance); lacks FlexRAM and segment LCD controller | Select when FPU-enabled math or larger flash is required; not drop-in due to peripheral differences |
| STM32F407VGT6 | ARM Cortex-M4F, 1 MB flash, 192 KB RAM, 168 MHz max clock, different pinout (LQFP-100) | Higher performance and memory density; no integrated LCD controller or TSI, but adds Ethernet MAC and FMC interface | Choose for connectivity-rich designs needing Ethernet or external SDRAM; requires PCB redesign |
Compared with K22F512VLH12 and STM32F407VGT6, the MK40DX256VLQ10 offers unique value in integrated human-machine interface peripherals (LCD/TSI), FlexMemory for reliable data logging, and ultra-low-power stop modes - making it optimal for cost-sensitive, display-driven industrial edge devices where floating-point math is not dominant.
Availability
MK40DX256VLQ10 is available at Aetrix Electronics and suitable for industrial motor control, medical diagnostic equipment, automotive body electronics, smart energy metering, and portable instrumentation requiring stable component supply and long-term lifecycle support.
Supply support for MK40DX256VLQ10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.
The MK40DX256VLQ10 belongs to the Kinetis K40 sub-family - engineered for real-time control, human-machine interface, and low-power embedded applications demanding integrated analog, communication, and display capabilities in a single chip.
FAQ
What is the maximum operating frequency of the MK40DX256VLQ10?
The MK40DX256VLQ10 operates at up to 100 MHz using its ARM Cortex-M4 core. This frequency is achieved via the internal Multi-Purpose Clock Generator (MCG) in FEE mode with PLL enabled. The device delivers 1.25 Dhrystone MIPS per MHz, resulting in 125 DMIPS performance. All timing specifications - including flash access, peripheral clocks, and bus interfaces - are validated at this maximum frequency under rated voltage (1.71–3.6 V) and temperature (-40°C to 105°C) conditions.
Does the MK40DX256VLQ10 support USB device functionality?
Yes, the MK40DX256VLQ10 includes a full-/low-speed USB On-The-Go (OTG) controller with an integrated transceiver. It supports USB device mode without requiring an external PHY, enabling HID, CDC, or mass-storage class implementations. The USB_DP and USB_DM pins are routed to dedicated LQFP-144 package terminals and comply with USB 2.0 specifications. Internal voltage regulation and ESD protection meet USB electrical requirements across the full operating voltage range.
What type of memory architecture does the MK40DX256VLQ10 use?
The MK40DX256VLQ10 uses a FlexMemory architecture consisting of 256 KB program flash memory and 4 KB FlexRAM. Unlike standard flash-only MCUs, FlexRAM can be configured as EEPROM-emulation memory or high-speed RAM, enabling atomic write operations and wear-leveling without flash erase cycles. This architecture supports reliable data logging during power loss and fast context switching in real-time applications - all within the same die as the Cortex-M4 core.
Can the MK40DX256VLQ10 drive a segment LCD display directly?
Yes, the MK40DX256VLQ10 integrates a dedicated segment LCD controller capable of driving up to 40 frontplanes and 8 backplanes (or 44 frontplanes and 4 backplanes) depending on configuration. It supports static, 2-, 3-, and 4-multiplex modes with programmable bias and contrast control. No external display driver IC is required, reducing BOM cost and simplifying layout. The controller operates independently of the CPU using DMA and supports partial display updates to minimize power consumption.
What low-power modes are available on the MK40DX256VLQ10?
The MK40DX256VLQ10 supports seven low-power modes: RUN, WAIT, STOP, VLPR, VLPS, LLS, and VLLSx (VLLS0–VLLS3). In VLLS3 mode, typical current consumption is 3.0 µA at 3.0 V and -40°C to 25°C ambient, retaining RAM, RTC, and selected wake-up sources. VLLS1 achieves 2.1 µA under same conditions. These modes are controlled via the System Mode Controller (SMC) and supported by hardware features like low-leakage wakeup unit and autonomous peripheral operation - critical for battery-powered edge nodes.
MK40DX256VLQ10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- Kinetis K40
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 98
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 42x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK40DX256VLQ10 FAQ
1.How can I place an order for MK40DX256VLQ10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK40DX256VLQ10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK40DX256VLQ10 reliable?
The price and inventory of MK40DX256VLQ10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK40DX256VLQ10 is usually 5 days.
3.What payment methods are accepted for MK40DX256VLQ10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK40DX256VLQ10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK40DX256VLQ10?
MK40DX256VLQ10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK40DX256VLQ10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK40DX256VLQ10?
For technical support, including MK40DX256VLQ10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK40DX256VLQ10 requirements.
6.How does Aetrix verify that MK40DX256VLQ10 is sourced from the original manufacturer or authorized distributors?
All MK40DX256VLQ10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK40DX256VLQ10 meets industry standards.
7.What is the process for return or replacement of MK40DX256VLQ10?
All MK40DX256VLQ10 units undergo pre-shipment inspection (PSI). If there is an issue with MK40DX256VLQ10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK40DX256VLQ10 part is unused and in its original packaging.
Return procedure for MK40DX256VLQ10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MK40DX256VLQ10 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

