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NXP Semiconductors MK50DN512CMC10
- Part No.:
- MK50DN512CMC10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 121-LFBGA
- Datasheet:
-
MK50DN512CMC10.pdf
- Description:
- IC MCU 32B 512KB FLASH 121MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,497
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Product details
Overview
MK50DN512CMC10 from NXP (formerly Freescale) is a 100 MHz ARM Cortex-M4 microcontroller with DSP instructions, 512 KB program flash, 128 KB SRAM, and FlexMemory supporting up to 4 KB configurable EEPROM emulation. It features dual 16-bit ADCs (21/22 SE + 3 DP channels), two 12-bit DACs, three analog comparators, two op-amps, two transimpedance amplifiers, USB OTG LS/FS with device charger detect, and operates from 1.71 V to 3.6 V across –40 °C to 85 °C. Used in industrial HMI and sensor fusion systems requiring mixed-signal processing and low-power USB connectivity.
For engineers reviewing the MK50DN512CMC10 datasheet, MK50DN512CMC10 pinout, MK50DN512CMC10 application, or MK50DN512CMC10 equivalent, this page delivers verified technical context, package mapping to 121-pin MAPBGA (8 mm × 8 mm), confirmed FlexRAM/FlexNVM partitioning capability, real-world use-value for segment LCD control and capacitive touch, and validated alternative part selection guidance based on Kinetis family documentation.
Technical Context
The MK50DN512CMC10 implements an ARM Cortex-M4 core with DSP extensions but no FPU, paired with a 16-channel DMA controller and nested vectored interrupt controller (NVIC). Its memory subsystem includes 512 KB main flash, 128 KB SRAM, and FlexMemory configured as 512 KB flash-only (no FlexNVM/FlexRAM), enabling deterministic code execution without EEPROM emulation overhead.
Peripherals include two independent 16-bit SAR ADCs with programmable gain amplifiers and voltage reference, dual 12-bit DACs for analog output generation, three high-speed analog comparators with integrated 6-bit DACs, and full-speed USB OTG with on-chip transceiver and charger detection-supporting embedded host/device roles without external PHY.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4 @ 100 MHz with DSP instructions; enables real-time signal processing without floating-point unit dependency. |
| Flash Memory | 512 KB program flash only (N-suffix); supports read-while-write and flash programming down to 1.71 V. |
| SRAM | 128 KB on-chip SRAM; sufficient for complex RTOS stacks, USB buffers, and multi-channel ADC data buffering. |
| Analog Peripherals | Dual 16-bit ADCs (21/22 SE + 3 DP inputs), two 12-bit DACs, three analog comparators, two op-amps, two transimpedance amplifiers - enables sensor signal conditioning and closed-loop analog control. |
| USB Interface | Full-Speed/Low-Speed USB OTG with integrated transceiver and Device Charger Detect (DCD); eliminates need for external USB PHY and simplifies battery-powered device charging detection. |
| Operating Range | 1.71 V to 3.6 V supply; –40 °C to +85 °C ambient temperature; supports industrial-grade deployment without derating. |
| Package | 121-pin MAPBGA (8 mm × 8 mm); pin-compatible with other K50N sub-family devices in same package footprint. |
Pinout & Package
Package: 121-pin MAPBGA (8 mm × 8 mm), ball pitch 0.5 mm, RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core power supply | 1.71–3.6 V input; powers CPU, memory, and digital logic; requires local decoupling per datasheet layout guidelines. |
| VDDA | Analog power supply | Separate 1.71–3.6 V rail for ADC/DAC/PGA; isolation prevents digital noise coupling into precision analog paths. |
| VREFH/VREFL | Analog reference inputs | External or internal reference selection for 16-bit ADCs; enables ratiometric or absolute voltage measurement modes. |
| USB_DP/USB_DM | USB differential pair | Full-speed USB 2.0 physical interface; routed as controlled-impedance differential pair (90 Ω) for EMI compliance. |
| PTA0–PTA31 | GPIO port A | 32-bit general-purpose I/O bank with interrupt, DMA request, and digital glitch filter; supports 5 V tolerant inputs for legacy interface compatibility. |
Key Features
| Feature | Design Value |
|---|---|
| FlexMemory architecture | Configured as 512 KB program flash only (N-suffix); eliminates EEPROM emulation software overhead and flash wear management complexity. |
| Dual 16-bit ADCs with PGA | Simultaneous sampling of up to 22 single-ended or 3 differential sensor inputs per ADC; programmable gain (1×–32×) enables direct connection to low-output sensors like thermocouples. |
| USB OTG with DCD | Hardware-level detection of USB wall chargers and battery charging ports; enables automatic power path management without host CPU polling or external ICs. |
| Capacitive touch support | 16-channel TSI module with low-power wake-up capability; supports button/slider implementation with <1 µA active current during touch sensing. |
| Low-power operation | 10 distinct power modes including VLPR (Very Low Power Run) at 4 MHz; achieves <2 µA stop-mode current with RTC and LLWU active for periodic wake-up events. |
Applications
| Industrial HMI Panel | Medical Sensor Node |
|---|---|
Use Scenario: Standalone panel with segmented LCD display, tactile buttons, and USB configuration port in factory automation equipment. IC Role / Device Role / Timing Role: Central MCU managing segment LCD driver timing, capacitive touch scanning, USB CDC communication, and real-time alarm response via GPIO interrupts. Use Value: Integrated segment LCD controller and TSI eliminate external driver ICs; USB DCD enables plug-and-play firmware updates via standard chargers. | Use Scenario: Portable patient monitor acquiring ECG, temperature, and SpO₂ signals with local display and USB data export. IC Role / Device Role / Timing Role: Signal acquisition hub performing synchronized dual ADC sampling, PGA-based gain adjustment, and real-time waveform generation via dual 12-bit DACs. Use Value: 16-bit ADC resolution and programmable gain enable direct sensor interfacing without external signal conditioning; 128 KB SRAM buffers multi-second waveform records. |
| Smart Energy Meter | Building Automation Controller |
Use Scenario: DIN-rail mounted meter with isolated RS-485, pulse counting inputs, and USB service port for calibration and firmware upgrade. IC Role / Device Role / Timing Role: Main controller executing metrology algorithms, managing isolated communication peripherals, and handling secure USB DFU with flash protection. Use Value: Flash security features prevent unauthorized firmware modification; 5 V tolerant GPIOs interface directly to opto-isolator outputs without level shifters. | Use Scenario: HVAC zone controller with temperature/humidity sensors, relay drivers, and USB-based commissioning interface. IC Role / Device Role / Timing Role: Mixed-signal processor acquiring analog sensor data, generating PWM fan control, and implementing USB HID for field technician configuration. Use Value: Dual ADCs sample multiple sensors simultaneously; USB OTG allows direct connection to Windows tablets for setup without additional dongles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MK50DN512ZCLQ10 | 144-pin LQFP package (20 mm × 20 mm); identical flash/SRAM/FlexMemory configuration and peripheral set. | Preferred where PCB rework for BGA assembly is impractical; larger footprint eases prototyping and manual soldering. | Select when board-level testability, hand-soldering feasibility, or thermal management via exposed pad is prioritized over compactness. |
| MK51DN512ZCLQ10 | Adds segment LCD controller supporting up to 32×8 segments; otherwise matches MK50DN512CMC10 in CPU, memory, and analog specs. | Required for designs needing integrated segment LCD driving without external controllers or boost converters. | Choose only if segment LCD display is mandatory; otherwise MK50DN512CMC10 offers identical core functionality at lower cost. |
Compared with MK50DN512ZCLQ10, the MK50DN512CMC10 reduces board area by 60% using MAPBGA packaging while maintaining identical electrical performance; versus MK51DN512ZCLQ10, it omits segment LCD hardware-reducing gate count and dynamic power by ~8% in non-LCD applications.
Availability
MK50DN512CMC10 is available at Aetrix Electronics and suitable for industrial HMI panels, medical sensor nodes, smart energy meters, and building automation controllers requiring stable component supply, long-term lifecycle assurance, and qualified automotive-grade traceability.
Supply support for MK50DN512CMC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Freescale Semiconductor and Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The Kinetis K50 family was designed for low-power, mixed-signal embedded applications demanding USB connectivity, high-precision analog front-ends, and scalable memory-targeting industrial control, medical instrumentation, and human-machine interface systems.
FAQ
What is the maximum operating frequency of the MK50DN512CMC10?
The MK50DN512CMC10 operates at a maximum CPU frequency of 100 MHz, achieved via its internal PLL and MCG clock generator. This frequency is fully supported across the specified voltage range (1.71 V to 3.6 V) and temperature range (–40 °C to +85 °C), with all peripherals-including dual ADCs, USB OTG, and FlexTimers-functionally rated at this speed. The MK50DN512CMC10 does not include a floating-point unit, relying on DSP instruction acceleration for math-intensive tasks.
Does the MK50DN512CMC10 support USB Device Charger Detect (DCD)?
Yes, the MK50DN512CMC10 integrates hardware-level USB Device Charger Detect (DCD) compliant with USB Battery Charging Specification v1.2. This feature enables automatic identification of SDP (standard downstream port), CDP (charging downstream port), and DCP (dedicated charging port) without host CPU intervention. The MK50DN512CMC10 uses dedicated USB_ID and USB_VBUS pins to perform detection within 1 second, allowing rapid power-path configuration in portable devices.
What analog peripherals are included in the MK50DN512CMC10?
The MK50DN512CMC10 includes two independent 16-bit SAR ADCs (ADC0 and ADC1) with up to 22 single-ended or 3 differential inputs each, two 12-bit DACs, three high-speed analog comparators (each with integrated 6-bit DAC), two programmable gain amplifiers (PGAs), two operational amplifiers, and two transimpedance amplifiers. All analog blocks share a common voltage reference and operate across the full 1.71–3.6 V supply range, enabling simultaneous sensor acquisition and signal conditioning without external components.
Is the MK50DN512CMC10 pin-compatible with other K50 family devices?
Yes, the MK50DN512CMC10 is pin-for-pin compatible with other K50N sub-family devices in the 121-pin MAPBGA (MC) package, including MK50DN512ZCMB10 and MK50DN512ZCLL10. This compatibility extends to identical ball mapping, power/ground pin locations, and peripheral signal assignments-enabling hardware reuse across memory and feature variants without PCB redesign. However, it is not compatible with K50X (FlexMemory-enabled) or K51/K52/K53 derivatives due to differing peripheral enablement.
What is the FlexMemory configuration of the MK50DN512CMC10?
The MK50DN512CMC10 uses the 'N' suffix indicating program flash only-no FlexNVM or FlexRAM. Its total non-volatile memory consists solely of 512 KB of main program flash, which supports read-while-write, flash security, and programming down to 1.71 V. Unlike 'X'-suffix K50 devices, the MK50DN512CMC10 does not provide configurable EEPROM emulation or additional data flash; all data storage must be implemented in SRAM or external memory.
MK50DN512CMC10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 121-LFBGA
- Series:
- Kinetis K50
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 27x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK50DN512CMC10 FAQ
1.How can I place an order for MK50DN512CMC10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK50DN512CMC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK50DN512CMC10 reliable?
The price and inventory of MK50DN512CMC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK50DN512CMC10 is usually 5 days.
3.What payment methods are accepted for MK50DN512CMC10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK50DN512CMC10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK50DN512CMC10?
MK50DN512CMC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK50DN512CMC10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK50DN512CMC10?
For technical support, including MK50DN512CMC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK50DN512CMC10 requirements.
6.How does Aetrix verify that MK50DN512CMC10 is sourced from the original manufacturer or authorized distributors?
All MK50DN512CMC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK50DN512CMC10 meets industry standards.
7.What is the process for return or replacement of MK50DN512CMC10?
All MK50DN512CMC10 units undergo pre-shipment inspection (PSI). If there is an issue with MK50DN512CMC10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK50DN512CMC10 part is unused and in its original packaging.
Return procedure for MK50DN512CMC10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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