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NXP Semiconductors MK50DN512CMD10
- Part No.:
- MK50DN512CMD10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LBGA
- Datasheet:
-
MK50DN512CMD10.pdf
- Description:
- IC MCU 32B 512KB FLASH 144MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,351
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Product details
Overview
MK50DN512CMD10 from NXP (formerly Freescale) is a 100 MHz ARM Cortex-M4 microcontroller with DSP extensions, 512 KB program flash, 128 KB SRAM, and no FlexMemory. It delivers high-precision mixed-signal capability in a 144-pin MAPBGA package and is used in industrial HMI systems requiring segment LCD control, USB OTG, and real-time analog acquisition.
For engineers reviewing the MK50DN512CMD10 datasheet, MK50DN512CMD10 pinout, MK50DN512CMD10 application, or MK50DN512CMD10 equivalent, key selection criteria include its 100 MHz CPU speed, dual 16-bit ADCs (21+22 SE channels), 2×12-bit DACs, USB OTG LS/FS with device charger detect, and support for IEEE 1588 Ethernet timing in higher-memory variants - though not enabled on this specific part.
Technical Context
The MK50DN512CMD10 implements an ARM Cortex-M4 core with DSP instruction set but no floating-point unit. Its memory subsystem includes 512 KB of main flash and 128 KB of SRAM, with no FlexNVM or FlexRAM - distinguishing it from 'X' suffix variants. The device supports full-speed USB OTG via integrated transceiver and includes a dedicated USB voltage regulator and charger detection circuitry.
It integrates two independent 16-bit SAR ADCs (ADC0 and ADC1), each with differential pair support and programmable gain amplifiers; two 12-bit DACs; three analog comparators; two op-amps; and two transimpedance amplifiers. Timing peripherals include one 8-channel FTM, two 2-channel FTM modules, CMT, PDB, PIT, and LPT - all clocked from a configurable MCG with FLL/PLL options.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4 @ 100 MHz with DSP instructions, no FPU - enables deterministic signal processing without floating-point overhead |
| Flash Memory | 512 KB program flash only - supports bootloader + application partitioning; no FlexNVM for EEPROM emulation |
| SRAM | 128 KB on-chip SRAM - sufficient for real-time buffering of dual ADC streams and USB endpoint FIFOs |
| Analog Peripherals | Dual 16-bit SAR ADCs (21+22 SE channels), 2×12-bit DACs, 3×comparators, 2×op-amps, 2×TRIAMP - supports sensor fusion and closed-loop analog control |
| USB Interface | Full-Speed/Low-Speed USB OTG with integrated transceiver, 120 mA regulator, and Device Charger Detect - enables battery-powered host/device operation |
| Package | 144-pin MAPBGA (13 mm × 13 mm) - provides high I/O density and thermal performance for compact industrial PCBs |
| Operating Range | 1.71 V to 3.6 V supply, –40 °C to +85 °C ambient - suitable for extended-temperature industrial environments |
Pinout & Package
Package: 144-pin MAPBGA (13 mm × 13 mm), ball pitch 0.8 mm, RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA/VSSA | Analog power/ground | Separate analog domain supply pins - required for clean ADC/DAC reference and noise isolation |
| USB_DP/USB_DM | USB differential data lines | Direct connection to USB connector; internal termination and slew rate control enabled |
| ADC0_SE0–ADC0_SE20 | Analog input channels | 21 single-ended inputs for ADC0 - supports multiplexed sensor array scanning with hardware averaging |
| FTM0_CH0–FTM0_CH7 | PWM output channels | 8-channel flexible timer outputs - configurable for motor phase control, LED dimming, or encoder generation |
| TSI_CH0–TSI_CH15 | Capacitive touch inputs | 16-channel touch sensing interface - enables low-power wake-on-touch for HMI front panels |
Key Features
| Feature | Design Value |
|---|---|
| ARM Cortex-M4 core with DSP | Enables efficient FFT, filtering, and control loop math without external co-processor |
| Dual 16-bit SAR ADCs with PGA | Allows simultaneous high-resolution acquisition from multiple sensors with programmable gain calibration |
| USB OTG with integrated PHY and DCD | Eliminates need for external USB transceiver or charger-detection IC in portable HMI designs |
| Segment LCD controller support | Drives up to 320 segments - reduces BOM cost and firmware complexity in metering and display applications |
| 10 power modes including VLPR/VLPS | Extends battery life in always-on industrial monitors by reducing active current to sub-μA levels |
Applications
| Industrial Panel Meter | Programmable Logic Controller I/O Module |
|---|---|
Use Scenario: Real-time measurement and display of voltage, current, and temperature in DIN-rail mounted meters. IC Role / Device Role / Timing Role: Central MCU executing acquisition, computation, LCD refresh, and USB configuration transfer. Use Value: Dual 16-bit ADCs provide 16-bit effective resolution across 40+ channels; integrated segment LCD driver eliminates external display controller. | Use Scenario: Modular digital input/output expansion node with local analog conditioning and fieldbus connectivity. IC Role / Device Role / Timing Role: Signal conditioner and protocol bridge between field sensors and CAN/USB host. Use Value: PGA and op-amps enable direct connection to strain gauges and RTDs; USB OTG allows field reconfiguration without PC adapter. |
| Medical Patient Monitor Front-End | Smart Energy Gateway |
Use Scenario: Low-noise acquisition of ECG, SpO₂, and respiration signals in portable bedside units. IC Role / Device Role / Timing Role: Analog front-end controller with synchronized ADC sampling and real-time waveform processing. Use Value: 16-bit ADCs with differential inputs and programmable gain reduce external signal chain components; TSI supports touch-based UI navigation. | Use Scenario: Two-way communication hub aggregating smart meter data over RS-485 and relaying via USB to gateway controller. IC Role / Device Role / Timing Role: Data concentrator with secure local storage, time-stamped logging, and USB mass storage emulation. Use Value: 128 KB SRAM buffers burst reads from multiple meters; USB OTG DCD enables plug-and-play charging and data sync from field tablets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MK50DX256ZCMD10 | Same 144-pin MAPBGA package, 100 MHz Cortex-M4, but includes 256 KB FlexNVM and 4 KB FlexRAM - enabling EEPROM emulation and bootloader partitioning | Required where field-upgradable firmware or high-cycle parameter storage is needed | Select MK50DX256ZCMD10 if EEPROM-like nonvolatile storage or concurrent code/data execution is mandatory |
| MK51DN512ZCMD10 | Same footprint and memory size, but adds segment LCD controller with up to 38×8 segment drive capability and enhanced TSI with noise immunity | Preferred for displays requiring >320 segments or robust capacitive touch in noisy industrial settings | Choose MK51DN512ZCMD10 when advanced HMI features - not present in MK50DN512CMD10 - are required |
Compared with MK50DN512CMD10, MK50DX256ZCMD10 adds FlexMemory for embedded EEPROM functionality without external ICs, while MK51DN512ZCMD10 extends HMI capability with larger segment LCD support and improved touch sensing - both retain identical CPU performance and USB/ADC peripheral sets.
Availability
MK50DN512CMD10 is available at Aetrix Electronics and suitable for industrial HMI, programmable logic controllers, medical front-ends, and smart energy gateways requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for MK50DN512CMD10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.
The Kinetis K50 family was designed for low-power, mixed-signal industrial HMI and control applications - integrating high-resolution analog, USB OTG, segment LCD, and real-time timers in a scalable ARM Cortex-M4 platform.
FAQ
What is the maximum operating frequency of the MK50DN512CMD10?
The MK50DN512CMD10 operates at a maximum CPU frequency of 100 MHz, achieved via its internal MCG with PLL configuration. This speed is fully supported across the specified voltage range (1.71 V to 3.6 V) and temperature range (–40 °C to +85 °C), enabling deterministic real-time execution for industrial control loops and USB transaction handling in the MK50DN512CMD10.
Does the MK50DN512CMD10 include FlexMemory (FlexNVM/FlexRAM)?
No, the MK50DN512CMD10 does not include FlexMemory. Its part number suffix 'N' indicates program flash only - 512 KB main flash and 128 KB SRAM, with no FlexNVM or FlexRAM blocks. This distinguishes it from 'X' suffix variants like MK50DX256ZCMD10, which allocate FlexNVM for EEPROM emulation or additional program/data storage in the MK50DN512CMD10's architecture.
Which USB capabilities does the MK50DN512CMD10 support?
The MK50DN512CMD10 supports USB On-The-Go (OTG) at Full Speed (12 Mbps) and Low Speed (1.5 Mbps) with an integrated transceiver, on-chip 120 mA voltage regulator, and Device Charger Detect (DCD) logic. It does not support High-Speed USB. These features allow the MK50DN512CMD10 to operate as either host or device and detect BC1.2-compatible chargers without external components.
How many analog-to-digital converters does the MK50DN512CMD10 integrate?
The MK50DN512CMD10 integrates two independent 16-bit SAR ADCs: ADC0 with up to 21 single-ended (SE) inputs and ADC1 with up to 22 SE inputs. Both support differential pairs, programmable gain amplifiers, and hardware averaging. This dual-ADC architecture enables synchronous sampling for phase-sensitive measurements in the MK50DN512CMD10, such as motor current/voltage monitoring.
What is the package type and pin count of the MK50DN512CMD10?
The MK50DN512CMD10 uses a 144-ball MAPBGA package (13 mm × 13 mm, 0.8 mm pitch), designated by the 'MD' package code in its part number. It provides 111 user I/O pins, including dedicated analog inputs, USB DP/DM, segment LCD drivers, and capacitive touch sense channels - optimized for high-density industrial PCB layouts in the MK50DN512CMD10.
MK50DN512CMD10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LBGA
- Series:
- Kinetis K50
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 96
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 41x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK50DN512CMD10 FAQ
1.How can I place an order for MK50DN512CMD10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK50DN512CMD10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK50DN512CMD10 reliable?
The price and inventory of MK50DN512CMD10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK50DN512CMD10 is usually 5 days.
3.What payment methods are accepted for MK50DN512CMD10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK50DN512CMD10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK50DN512CMD10?
MK50DN512CMD10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK50DN512CMD10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK50DN512CMD10?
For technical support, including MK50DN512CMD10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK50DN512CMD10 requirements.
6.How does Aetrix verify that MK50DN512CMD10 is sourced from the original manufacturer or authorized distributors?
All MK50DN512CMD10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK50DN512CMD10 meets industry standards.
7.What is the process for return or replacement of MK50DN512CMD10?
All MK50DN512CMD10 units undergo pre-shipment inspection (PSI). If there is an issue with MK50DN512CMD10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK50DN512CMD10 part is unused and in its original packaging.
Return procedure for MK50DN512CMD10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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