NXP Semiconductors MK50DN512CMD10R

Overview

MK50DN512CMD10R from NXP Semiconductors (formerly Freescale) is a 100 MHz ARM Cortex-M4 microcontroller with DSP instructions, 512 KB program flash, 128 KB SRAM, and no FlexMemory. It features dual 16-bit ADCs (21/22 SE + 3 DP channels), two 12-bit DACs, three analog comparators, two op-amps, two transimpedance amplifiers, USB OTG LS/FS with device charger detect, six UARTs, three SPI modules, two I²C interfaces, I²S, capacitive touch sensing (16 inputs), segment LCD controller (38×8/42×4), and IEEE 1588-capable Ethernet in a 144-pin MAPBGA package. It targets industrial HMI and metering systems requiring high analog integration and real-time connectivity.

For engineers reviewing the MK50DN512CMD10R datasheet, MK50DN512CMD10R pinout, MK50DN512CMD10R application, or MK50DN512CMD10R equivalent, key selection criteria include its 100 MHz Cortex-M4 core with DSP support, absence of FlexNVM/FlexRAM, full-speed USB OTG with DCD, dual high-resolution ADCs, integrated Ethernet with IEEE 1588 timer, and 144-pin 13×13 mm MAPBGA packaging for space-constrained embedded designs.

Technical Context

This MCU implements an ARM Cortex-M4 core with hardware DSP extensions but no floating-point unit (SPFPU). Its memory subsystem includes 512 KB of main program flash and 128 KB of SRAM-no FlexNVM or FlexRAM-making it suitable for applications requiring large code footprint and RAM without on-chip EEPROM emulation.

The analog subsystem integrates two independent 16-bit SAR ADCs (ADC0 and ADC1), each supporting up to 22 single-ended or 3 differential channels, two 12-bit DACs, three high-speed analog comparators with 6/5/5/0 input configurations, two programmable gain amplifiers, two operational amplifiers, and two transimpedance amplifiers-enabling simultaneous sensor signal conditioning, precision measurement, and feedback control.

Key Specifications

Pinout & Package

Package: 144-pin MAPBGA (13 mm × 13 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with MK53DN512CMD10R, MK50DN512CMD10R omits hardware encryption-reducing die size and cost-while retaining identical analog, timing, and connectivity capabilities. Against MK66FN2M0VLQ18, it trades FPU and flash capacity for lower power and proven qualification in industrial temperature ranges, making it more suitable for stable, long-lifecycle metering deployments.

Availability

MK50DN512CMD10R is available at Aetrix Electronics and suitable for industrial automation, smart metering, and HMI terminal designs requiring stable component supply, extended temperature operation (–40 °C to +105 °C), and long-term lifecycle support.

Supply support for MK50DN512CMD10R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The Kinetis K50 family was designed for high-integration industrial applications demanding mixed-signal precision, real-time Ethernet, USB OTG, and low-power HMI-targeting metering, PLCs, and human-machine interface terminals.

FAQ

What is the maximum operating frequency and core architecture of the MK50DN512CMD10R?

The MK50DN512CMD10R features an ARM Cortex-M4 core rated at 100 MHz with hardware DSP instruction support but no floating-point unit (SPFPU). It delivers 1.25 DMIPS/MHz and includes a nested vectored interrupt controller (NVIC), debug interfaces (SWD/JTAG/cJTAG), and trace units (TPIU/FPB/DWT/ITM/ETM/ETB) for real-time development and validation of deterministic embedded applications.

Does the MK50DN512CMD10R include FlexMemory, and how does that affect its memory configuration?

No, the MK50DN512CMD10R does not include FlexMemory (FlexNVM or FlexRAM). Its memory consists solely of 512 KB of program flash and 128 KB of SRAM. This configuration eliminates on-chip EEPROM emulation capability but simplifies memory management and improves predictability for applications where large, reliable program storage and RAM are prioritized over byte-write endurance.

What analog peripherals are integrated into the MK50DN512CMD10R, and how are they configured?

The MK50DN512CMD10R integrates dual 16-bit SAR ADCs (ADC0 with 21 SE + 3 DP channels; ADC1 with 22 SE + 3 DP), two 12-bit DACs, three analog comparators, two programmable gain amplifiers, two operational amplifiers, two transimpedance amplifiers, and a programmable voltage reference. These are fully configurable via register-based control and support simultaneous sampling triggered by timers or the programmable delay block (PDB).

How does the MK50DN512CMD10R support IEEE 1588 Precision Time Protocol in industrial Ethernet applications?

The MK50DN512CMD10R includes a dedicated IEEE 1588 hardware timer within its Ethernet MAC, enabling nanosecond-resolution timestamping of ingress/egress Ethernet frames. This allows precise synchronization of distributed nodes without software overhead-critical for time-sensitive industrial protocols like IEC 61850 GOOSE or PROFINET IRT in smart grid and factory automation systems.

What package type and pin count does the MK50DN512CMD10R use, and what are its key mechanical characteristics?

The MK50DN512CMD10R uses a 144-pin MAPBGA package measuring 13 mm × 13 mm with 0.8 mm ball pitch. It is RoHS-compliant and rated for industrial temperature range (–40 °C to +105 °C). The package supports high I/O density, thermal dissipation for sustained 100 MHz operation, and compatibility with standard PCB assembly processes including reflow soldering.