NXP Semiconductors MK50DN512ZCLQ10

Overview

MK50DN512ZCLQ10 from NXP Semiconductors (formerly Freescale) is a 100 MHz ARM Cortex-M4 microcontroller with DSP extensions, 512 KB program flash, 128 KB SRAM, and no FlexMemory (N suffix), housed in a 144-pin LQFP package. It integrates dual 16-bit ADCs (21/22 SE + 3 DP channels), two 12-bit DACs, three analog comparators, two op-amps, two transimpedance amplifiers, USB OTG LS/FS with device charger detect, six UARTs, three SPIs, two I²Cs, and programmable FlexTimers - enabling high-precision sensor processing and real-time control in industrial HMI systems.

For engineers reviewing the MK50DN512ZCLQ10 datasheet, MK50DN512ZCLQ10 pinout, MK50DN512ZCLQ10 application, or MK50DN512ZCLQ10 equivalent, key selection criteria include its 100 MHz Cortex-M4 core with DSP support, absence of FlexNVM/FlexRAM (distinguishing it from X-suffix variants), full-speed USB OTG capability, wide 1.71–3.6 V operating range, -40°C to 85°C temperature grade, and 144-pin LQFP mechanical compatibility within the K50 family.

Technical Context

The MK50DN512ZCLQ10 implements an ARM Cortex-M4 core with hardware-accelerated DSP instructions but no single-precision FPU (F-suffix required). Its memory subsystem features independent flash banks supporting read-while-write operation, and a 128 KB SRAM block with DMA-accessible regions - optimized for concurrent firmware execution and data buffering in deterministic control loops.

Peripherals are organized around a multi-layer AHB/APB bus matrix with configurable clock gating. The analog subsystem includes dedicated voltage reference (VREF), programmable gain amplifiers (PGA), and low-leakage wake-up unit (LLWU) integration - enabling sub-millisecond wake-from-VLPR transitions while maintaining 16-bit ADC accuracy across supply and temperature.

Key Specifications

Pinout & Package

Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with MK50DX256ZCLQ10 and MK53DN512ZCLQ10, the MK50DN512ZCLQ10 offers maximum program flash density without FlexMemory overhead or Ethernet complexity - ideal for cost-sensitive, flash-intensive applications where data persistence is handled externally or via software-emulated EEPROM.

Availability

MK50DN512ZCLQ10 is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy meters, PLC I/O modules, and medical infusion pump controllers requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.

Supply support for MK50DN512ZCLQ10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's MCU innovation.

The Kinetis K50 family was designed for low-power, mixed-signal industrial control applications demanding high analog precision, USB connectivity, and real-time determinism - positioning MK50DN512ZCLQ10 as a high-flash-density variant for complex HMI and metering firmware.

FAQ

What is the maximum CPU frequency and core architecture of the MK50DN512ZCLQ10?

The MK50DN512ZCLQ10 features an ARM Cortex-M4 core operating at up to 100 MHz with hardware-accelerated DSP instructions, delivering 1.25 DMIPS/MHz performance. It does not include a single-precision floating-point unit (FPU), distinguishing it from F-suffix Kinetis variants. This architecture balances computational throughput for real-time control with power efficiency in industrial environments.

Does the MK50DN512ZCLQ10 include FlexMemory, and how does that affect its memory configuration?

No, the MK50DN512ZCLQ10 does not include FlexMemory - the "N" in its part number explicitly denotes program flash only (no FlexNVM or FlexRAM). It provides 512 KB of main program flash and 128 KB of SRAM. This simplifies memory management versus X-suffix parts but removes on-chip EEPROM emulation capability, requiring external non-volatile storage for configuration data.

What USB capabilities does the MK50DN512ZCLQ10 support, and what external components are required?

The MK50DN512ZCLQ10 integrates a full-speed/low-speed USB OTG controller with an on-chip transceiver and Device Charger Detect (DCD) circuitry. Only two external 27 Ω series resistors on USB0_DP/USB0_DM and a 1.5 kΩ pull-up on DP (for device mode) are required - no external PHY or level shifters. This reduces bill-of-materials cost and PCB area for USB-enabled industrial devices.

How many analog-to-digital converter (ADC) channels does the MK50DN512ZCLQ10 provide, and what is their resolution?

The MK50DN512ZCLQ10 integrates two independent 16-bit SAR ADCs: ADC0 supports 21 single-ended (SE) and 3 differential pair (DP) inputs; ADC1 supports 22 SE and 3 DP inputs. Both ADCs feature programmable voltage reference, hardware averaging, and configurable conversion timing - enabling high-accuracy current sensing, temperature monitoring, and sensor signal conditioning in industrial control systems.

What package type and pin count does the MK50DN512ZCLQ10 use, and is it pin-compatible with other K50 devices?

The MK50DN512ZCLQ10 uses a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch). Per Freescale documentation, all K50 devices sharing the same package identifier (LQ = 144 LQFP) are pin-for-pin compatible. This allows hardware reuse across K50 sub-families - for example, migrating from MK50DX256ZCLQ10 to MK50DN512ZCLQ10 requires only firmware and flash configuration updates, not PCB revision.