NXP Semiconductors MK50DX256CLK10
- Part No.:
- MK50DX256CLK10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
MK50DX256CLK10.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 80FQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,482
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Product details
Overview
MK50DX256CLK10 from NXP (formerly Freescale) is a 100 MHz ARM Cortex-M4 microcontroller with DSP instructions, 256 KB flash, 64 KB SRAM, and FlexMemory (256 KB FlexNVM + 4 KB FlexRAM). It features dual 16-bit ADCs (19+3 SE/DP and 16+3 SE/DP channels), two 12-bit DACs, three analog comparators, two op-amps, two transimpedance amplifiers, USB OTG LS/FS with device charger detect, six UARTs, three SPI modules, two I²C interfaces, and a segment LCD controller supporting up to 320 segments. It targets low-power industrial HMI and sensor fusion applications.
For engineers reviewing the MK50DX256CLK10 datasheet, MK50DX256CLK10 pinout, MK50DX256CLK10 application, or MK50DX256CLK10 equivalent, this page delivers verified technical context, package mapping, functional pin roles, real-world use cases, and validated alternative options - all grounded in the official K50 Family Product Brief Rev. 8 (May 2011) and part number decoding rules.
Technical Context
The MK50DX256CLK10 implements an ARM Cortex-M4 core with hardware-accelerated DSP instructions but no floating-point unit. Its memory subsystem integrates main program flash (256 KB), FlexNVM (256 KB configurable as data flash or EEPROM backup), and FlexRAM (4 KB usable as high-endurance EEPROM or system RAM), enabling concurrent code execution and bootloader/data segregation without external storage.
Peripherals include two independent 16-bit SAR ADCs with programmable gain amplifiers and differential inputs, dual 12-bit DACs for analog output generation, and a full-speed USB OTG interface with integrated transceiver and device charger detection - all operating across the full 1.71–3.6 V supply range and –40°C to +85°C temperature grade.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4 @ 100 MHz with DSP instruction set; enables real-time signal processing without FPU overhead. |
| Flash Memory | 256 KB main program flash + 256 KB FlexNVM; supports read-while-write and firmware updates without halting execution. |
| SRAM | 64 KB on-chip SRAM; sufficient for RTOS stacks, communication buffers, and sensor data aggregation. |
| Analog Peripherals | Dual 16-bit ADCs (19+3 & 16+3 SE/DP channels), two 12-bit DACs, three analog comparators, two op-amps, two TRIAMPs. |
| USB Interface | Full-speed/Low-speed USB OTG with integrated transceiver and Device Charger Detect (DCD); eliminates need for external USB PHY. |
| Operating Range | 1.71–3.6 V supply voltage; flash programmable down to 1.71 V; rated for –40°C to +85°C ambient operation. |
| Package | 80-pin LQFP (12 mm × 12 mm); pin-compatible with other K50X sub-family devices in same package footprint. |
Pinout & Package
80-pin LQFP (12 mm × 12 mm, 0.5 mm pitch), RoHS-compliant, with exposed thermal pad. Pinout conforms to K50 family standard for CLK-series devices in LQFP-80 package per Table 2 and Figure 2 of K50 Family Product Brief Rev. 8.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA/VSSA | Analog power/ground | Independent analog domain supply; decoupling required for 16-bit ADC/DAC accuracy. |
| PTA0–PTA31 | GPIO port A | 32-bit general-purpose I/O with interrupt, DMA request, and 5 V-tolerant inputs. |
| ADC0_SE0–ADC0_SE18 | ADC0 single-ended inputs | 19-channel single-ended input group supporting 16-bit conversion at up to 1 MSPS. |
| USB0_DP/USB0_DM | USB differential pair | Integrated full-speed USB transceiver I/O; requires 27 Ω series resistors and 1.5 kΩ pull-up on DP. |
| XTAL/EXTAL | Primary crystal oscillator | Supports 3–32 MHz crystal; provides precision clock source for MCG and USB PLL. |
Key Features
| Feature | Design Value |
|---|---|
| FlexMemory architecture | 256 KB FlexNVM + 4 KB FlexRAM enables byte-write EEPROM emulation with >10M endurance and zero software overhead. |
| Dual 16-bit ADCs | Two independent SAR ADCs with programmable gain amplifiers support simultaneous multi-sensor acquisition with <1 LSB INL. |
| USB OTG with DCD | On-chip USB transceiver and Device Charger Detect logic allows automatic identification of wall adapters vs. PCs without external ICs. |
| Segment LCD controller | Drives up to 320 segments directly; reduces BOM cost and PCB area in metering and industrial display applications. |
| Low-power operation | 10 power modes including VLPR/VLPW; wake-up from LLS3 in <1.5 µs enables battery-powered sensor nodes with years of life. |
Applications
| Industrial HMI Panel | Smart Energy Meter |
|---|---|
Use Scenario: Standalone local control panel with capacitive touch buttons, segment LCD display, and serial communication to PLC. IC Role / Device Role / Timing Role: Main application MCU handling touch sensing, LCD refresh, UART/USB host-to-device bridging, and real-time control logic. Use Value: Integrated segment LCD controller and TSI eliminate external driver ICs; FlexMemory stores calibration tables and firmware updates atomically. | Use Scenario: DIN-rail mounted electricity meter with metrology front-end, tamper detection, and remote firmware update via USB or UART. IC Role / Device Role / Timing Role: System controller managing ADC sampling synchronization, pulse counting, secure boot, and USB-based field programming. Use Value: Dual 16-bit ADCs interface directly to metrology ASICs; CRC engine validates flash integrity during OTA updates. |
| Portable Medical Sensor Hub | Factory Automation Node |
Use Scenario: Battery-powered wearable hub aggregating ECG, temperature, and motion data before transmission via USB or UART. IC Role / Device Role / Timing Role: Signal conditioning MCU performing analog front-end filtering, oversampling, and USB CDC-class data streaming. Use Value: Two 12-bit DACs generate reference waveforms for sensor excitation; low-leakage wake-up unit extends battery life between 10 Hz sampling intervals. | Use Scenario: DIN-rail I/O module converting analog sensor inputs (4–20 mA, 0–10 V) to Modbus RTU over RS-485. IC Role / Device Role / Timing Role: Isolated analog interface MCU with precise timing for ADC sampling, PWM output generation, and protocol stack execution. Use Value: Programmable delay block (PDB) triggers synchronized ADC conversions across multiple channels; GPIOs support digital input debouncing and output slew-rate control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MK50DN512ZCLL10 | 512 KB flash, 128 KB SRAM, no FlexNVM (FlexRAM only), same 100 MHz Cortex-M4 core and peripheral set. | Preferred where larger firmware image size or extended RAM for protocol stacks is required; lacks FlexNVM-based EEPROM emulation. | Select MK50DN512ZCLL10 when application demands >256 KB code space and does not require high-endurance nonvolatile data storage. |
| MK51DX256CLK7 | 72 MHz CPU, identical 80-pin LQFP package, same FlexMemory (256 KB FlexNVM + 4 KB FlexRAM), reduced ADC channel count (16+3 SE/DP on ADC1). | Suitable for cost-sensitive designs with lower real-time processing requirements; maintains pin compatibility and migration path. | Choose MK51DX256CLK7 for applications where 72 MHz performance suffices and BOM cost reduction is prioritized over peak throughput. |
Compared with MK50DN512ZCLL10 and MK51DX256CLK7, MK50DX256CLK10 uniquely balances 100 MHz deterministic performance, 256 KB FlexNVM for robust data logging, and full peripheral feature set in an 80-pin LQFP - making it optimal for HMI and sensor fusion systems requiring both speed and nonvolatile configurability.
Availability
MK50DX256CLK10 is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy meters, portable medical sensor hubs, and factory automation nodes requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.
Supply support for MK50DX256CLK10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Freescale Semiconductor and Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The Kinetis K50 family was designed specifically for low-power, mixed-signal industrial human-machine interface and sensor processing applications - integrating segment LCD controllers, high-resolution analog peripherals, and USB OTG with charger detection in a scalable ARM Cortex-M4 platform.
FAQ
What is the maximum CPU frequency and core type of the MK50DX256CLK10?
The MK50DX256CLK10 operates at a maximum CPU frequency of 100 MHz and uses an ARM Cortex-M4 core with DSP instruction support. It does not include a floating-point unit (FPU). This configuration delivers deterministic real-time performance for signal processing tasks while maintaining low power consumption - a key design goal of the Kinetis K50 family as documented in the K50 Family Product Brief Rev. 8.
Does the MK50DX256CLK10 support USB Device Charger Detection (DCD)?
Yes, the MK50DX256CLK10 includes hardware-level USB Device Charger Detect (DCD) functionality within its integrated USB OTG controller. This allows the MK50DX256CLK10 to automatically distinguish between standard USB hosts and dedicated charging ports (e.g., wall adapters), enabling appropriate current draw without external circuitry - a confirmed feature listed in Table 3 and Table 5 of the K50 Family Product Brief.
What memory resources are available on the MK50DX256CLK10 besides main flash?
In addition to 256 KB of main program flash, the MK50DX256CLK10 includes 256 KB of FlexNVM and 4 KB of FlexRAM. FlexNVM can be partitioned for data flash or EEPROM backup; FlexRAM serves as high-endurance EEPROM (up to 10M cycles) or additional system RAM. This architecture is explicitly defined in Section 4.2 of the K50 Family Product Brief Rev. 8 for all K50X sub-family devices including MK50DX256CLK10.
Which package type and pin count does the MK50DX256CLK10 use?
The MK50DX256CLK10 uses an 80-pin LQFP package (12 mm × 12 mm, 0.5 mm pitch), designated by "LK" in the part number decoding scheme (Figure 3). This matches the "CLK" prefix and is confirmed in Table 2 and Table 5 of the K50 Family Product Brief Rev. 8, where MK50DX256CLK10 is listed under the 80 LQFP (12x12) column.
What analog peripherals are integrated into the MK50DX256CLK10?
The MK50DX256CLK10 integrates dual 16-bit SAR ADCs (ADC0 with 19 SE + 3 DP channels; ADC1 with 16 SE + 3 DP channels), two 12-bit DACs, three analog comparators, two operational amplifiers, two transimpedance amplifiers, and a programmable voltage reference. These are fully specified in Table 5 of the K50 Family Product Brief Rev. 8 and enable high-precision sensor interfacing without external signal conditioning.
MK50DX256CLK10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 80-LQFP
- Series:
- Kinetis K50
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 39
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 30x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK50DX256CLK10 FAQ
1.How can I place an order for MK50DX256CLK10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK50DX256CLK10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK50DX256CLK10 reliable?
The price and inventory of MK50DX256CLK10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK50DX256CLK10 is usually 5 days.
3.What payment methods are accepted for MK50DX256CLK10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK50DX256CLK10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK50DX256CLK10?
MK50DX256CLK10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK50DX256CLK10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK50DX256CLK10?
For technical support, including MK50DX256CLK10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK50DX256CLK10 requirements.
6.How does Aetrix verify that MK50DX256CLK10 is sourced from the original manufacturer or authorized distributors?
All MK50DX256CLK10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK50DX256CLK10 meets industry standards.
7.What is the process for return or replacement of MK50DX256CLK10?
All MK50DX256CLK10 units undergo pre-shipment inspection (PSI). If there is an issue with MK50DX256CLK10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK50DX256CLK10 part is unused and in its original packaging.
Return procedure for MK50DX256CLK10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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