NXP Semiconductors MK50DX256CLL7
- Part No.:
- MK50DX256CLL7
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
MK50DX256CLL7.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MK50DX256CLL7 from NXP Semiconductors (formerly Freescale) is a Kinetis K50-series 32-bit ARM Cortex-M4 microcontroller with DSP extension, 256 KB on-chip flash, 128 KB RAM, and 100-pin LQFP package. It operates from 1.71–3.6 V across –40 to +85°C, integrates dual 16-bit SAR ADCs with PGA, 12-bit DAC, USB OTG, five UARTs, and low-power timers - deployed in industrial sensor nodes requiring deterministic real-time control and mixed-signal acquisition.
For engineers reviewing the MK50DX256CLL7 datasheet, MK50DX256CLL7 pinout, MK50DX256CLL7 application, or MK50DX256CLL7 equivalent, key selection considerations include its 72 MHz max CPU frequency, 100-pin LQFP-14×14 mm package, integrated USB transceiver, dual ADC architecture with programmable gain amplifiers, and support for multiple low-power stop modes down to 1.47 µA (VLLS1).
Technical Context
This MCU implements an ARM Cortex-M4 core with DSP instructions and no FPU. Its clock system includes a 3–32 MHz main crystal oscillator, 32 kHz RTC oscillator, and multi-purpose clock generator supporting flexible PLL-based frequency synthesis. Memory subsystem comprises 256 KB program flash with FlexMemory capability, 128 KB SRAM, and configurable flash security.
Peripheral integration targets embedded control with analog front-end capability: two independent 16-bit SAR ADCs each with integrated PGA (up to ×64), one 12-bit DAC, three analog comparators with embedded 6-bit DACs, two op-amps, and one transimpedance amplifier. Communication interfaces include USB full-/low-speed OTG with on-chip transceiver, two SPI, two I²C, five UART, and I²S modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4 with DSP extension, no FPU - enables efficient signal processing in motor control and sensor fusion without floating-point hardware. |
| Max Clock Frequency | 72 MHz - supports real-time response in closed-loop control systems with sub-14 ns instruction cycle time. |
| Flash / RAM | 256 KB flash (FlexMemory capable) / 128 KB SRAM - sufficient for bootloader, application code, and real-time data buffers in standalone edge devices. |
| Analog Peripherals | Dual 16-bit SAR ADCs (each with PGA up to ×64), 12-bit DAC, 3× analog comparators with 6-bit DACs - enables high-resolution sensor signal conditioning and feedback generation in single-chip designs. |
| USB Interface | Full-/low-speed USB On-The-Go controller with integrated transceiver - eliminates external PHY, simplifies USB device/host implementation in portable instrumentation. |
| Low-Power Modes | VLLS1/VLLS2/VLLS3, LLS, VLPS, STOP, WAIT - achieves 1.47 µA (VLLS1) retention current, enabling battery-powered operation for >1 year on coin cell. |
| Operating Voltage | 1.71–3.6 V - compatible with single-cell Li-ion, LiFePO₄, and 3.3 V regulated supplies without level-shifting. |
| Temperature Range | –40 to +85°C - qualified for industrial automation, building controls, and outdoor sensor deployments. |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Digital power supply and ground | Multiple dedicated pins ensure stable core voltage distribution and low-noise return paths for high-speed digital logic. |
| VDDA, VSSA | Analog power supply and ground | Isolated analog domain supply pins reduce coupling noise into ADC/DAC/PGA circuits for ≥12-bit effective resolution. |
| EXTAL, XTAL | Main crystal oscillator input/output | Supports 3–32 MHz crystals for precise system timing; internal load capacitors eliminate external components in most cases. |
| RTC_XTAL32, RTC_EXTAL32 | 32 kHz RTC crystal interface | Enables autonomous real-time clock operation during deep sleep (VLLSx) with <1 ppm drift over temperature. |
| USB_DP, USB_DM | USB differential data lines | Integrated transceiver supports full-/low-speed USB without external PHY; requires only series resistors and ESD protection diodes. |
| ADC0_SE[0–15], ADC1_SE[0–15] | Analog input channels | Up to 32 total single-ended inputs mapped across two independent ADCs - allows concurrent sampling of multiple sensors with separate trigger sources. |
| TPM0_CH0–TPM0_CH7 | PWM/timer output channels | Eight-channel motor control timer supports complementary PWM with dead-time insertion - suitable for 3-phase BLDC drive without external gate drivers. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware CRC module | Accelerates firmware integrity checks and communication frame validation at full bus speed - reduces CPU overhead in OTA update and CAN/FlexCAN applications. |
| Low-power hardware touch sensor interface (TSI) | Enables capacitive touch buttons/sliders with <1 µA active current and automatic wake-on-touch - ideal for HMI in battery-powered medical or home appliances. |
| Programmable gain amplifier (PGA) per ADC | Configurable gain (1×, 2×, 4×, 8×, 16×, 32×, 64×) eliminates external op-amp stages for microvolt-level sensor signals like thermopiles or strain gauges. |
| 128-bit unique chip ID | Provides immutable hardware identity for secure device authentication, license binding, and anti-cloning in industrial IoT gateways. |
| External watchdog monitor + software watchdog | Dual independent watchdogs prevent lockup from firmware faults or electromagnetic interference - critical for unattended remote equipment. |
Applications
| Industrial Sensor Node | Portable Medical Monitor |
|---|---|
|
Use Scenario: Wireless temperature/humidity/pressure node with local logging and BLE gateway interface. IC Role / Device Role / Timing Role: Primary controller executing sensor fusion, data encryption, USB CDC virtual COM port for configuration, and RTC-synchronized sampling. Use Value: Integrated dual ADCs with PGA enable direct connection of thermistor and MEMS pressure sensors; 128 KB RAM buffers 72 hours of 10 Hz sampled data before transmission. |
Use Scenario: Battery-powered pulse oximeter with optical front-end, display, and USB recharging/data export. IC Role / Device Role / Timing Role: Signal processor for red/IR LED current control, photodiode signal acquisition, SpO₂ calculation, and USB HID interface to PC. Use Value: Transimpedance amplifier and 16-bit ADC resolve weak photodiode currents; VLLS1 mode draws 1.47 µA during standby - extends 200 mAh coin cell life to >18 months. |
| Smart Building Controller | Motor Drive Reference Design |
|
Use Scenario: HVAC zone controller managing damper actuation, CO₂ sensing, and Modbus RTU communication. IC Role / Device Role / Timing Role: Real-time scheduler coordinating analog inputs, PWM fan control, UART-based fieldbus, and secure boot verification. Use Value: Five UARTs support simultaneous Modbus RTU, debug console, and sensor telemetry; hardware CRC validates firmware updates over RS-485 link. |
Use Scenario: 3-phase BLDC motor evaluation board with hall-effect feedback, current sensing, and GUI-based tuning. IC Role / Device Role / Timing Role: Motion controller generating space-vector PWM, executing FOC algorithm, and monitoring overcurrent via analog comparators. Use Value: Eight-channel TPM timer delivers synchronized 3-phase PWM with programmable dead time; analog comparators with 6-bit DAC provide fast overcurrent shutdown (<200 ns response). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| K22FN512VLH12 | ARM Cortex-M4F (with FPU), 512 KB flash, 120 MHz max, same 100-pin LQFP package | Better suited for floating-point intensive tasks (e.g., FFT-based vibration analysis); higher power consumption in active mode | Select when FPU acceleration is required and thermal/power budget allows higher active current. |
| STM32F405RGT6 | ARM Cortex-M4F, 1 MB flash, 168 MHz, 100-pin LQFP, different peripheral set (no TSI, no transimpedance amp) | Lacks integrated analog front-end features (PGA, TIA, TSI); requires external components for precision sensor interfacing | Choose when high clock speed and large flash dominate requirements, and analog signal chain is implemented externally. |
Compared with MK50DX256CLL7, K22FN512VLH12 adds FPU and flash but increases active power; STM32F405RGT6 offers higher performance and memory but lacks on-die analog signal conditioning - making MK50DX256CLL7 optimal for cost-sensitive, analog-rich industrial edge nodes where mixed-signal integration reduces BOM count and layout complexity.
Availability
MK50DX256CLL7 is available at Aetrix Electronics and suitable for industrial sensor nodes, portable medical monitors, smart building controllers, and motor drive reference designs requiring stable component supply, long-term lifecycle support, and consistent parametric performance across temperature extremes.
Supply support for MK50DX256CLL7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with heritage in Freescale's Kinetis portfolio.
The Kinetis K50 family - including MK50DX256CLL7 - was designed for cost-optimized, analog-intensive embedded control applications demanding high integration, low power, and robust real-time performance in harsh environments.
FAQ
What is the maximum operating frequency of the MK50DX256CLL7?
The MK50DX256CLL7 operates at a maximum system and core clock frequency of 72 MHz. This is achieved using the internal PLL driven by the main crystal oscillator (3–32 MHz) or internal reference clock. The 72 MHz limit applies across the full –40 to +85°C ambient temperature range and 1.71–3.6 V supply voltage, as specified in the K50 Sub-Family Data Sheet Rev. 3.
Does the MK50DX256CLL7 include a hardware floating-point unit (FPU)?
No, the MK50DX256CLL7 implements an ARM Cortex-M4 core with DSP extensions but does not include a hardware FPU. Its part number suffix "D" (as in MK50D…) denotes the DSP-enabled M4 variant without FPU; FPU-equipped variants use the "F" suffix (e.g., MK50FN…). All floating-point operations on MK50DX256CLL7 execute in software using the CMSIS-DSP library.
What analog peripherals are integrated into the MK50DX256CLL7?
The MK50DX256CLL7 integrates two independent 16-bit SAR ADCs, each with a programmable gain amplifier (PGA) supporting gains up to ×64; one 12-bit DAC; three analog comparators (each with an embedded 6-bit DAC and programmable reference); two operational amplifiers; one transimpedance amplifier; and a precision voltage reference. These are documented in Section 6.6 of the K50 Sub-Family Data Sheet.
What low-power modes does the MK50DX256CLL7 support, and what is the lowest current draw?
The MK50DX256CLL7 supports seven low-power modes: RUN, WAIT, STOP, VLPS, LLS, VLLS1, VLLS2, and VLLS3. The lowest active-retention current is 1.47 µA in VLLS1 mode at –40 to +25°C and 3.0 V supply, as measured with RTC and 32 kHz oscillator disabled. Full details appear in Table 6 of the K50 Sub-Family Data Sheet Rev. 3.
Is the MK50DX256CLL7 pin-compatible with other Kinetis K50 family members?
Pin compatibility within the K50 family is package-dependent and not guaranteed across all variants. The MK50DX256CLL7 uses a 100-pin LQFP (LL package), and pinouts for this package are defined in Section 8.2 of the K50 Sub-Family Data Sheet. While some K50 variants share the LL package, differences in peripheral mapping, power pin allocation, and reset configuration require verification against the specific device's signal multiplexing table before substitution.
MK50DX256CLL7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LQFP
- Series:
- Kinetis K50
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 72MHz
- Connectivity:
- EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 59
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 34x16b; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK50DX256CLL7 FAQ
1.How can I place an order for MK50DX256CLL7 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK50DX256CLL7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK50DX256CLL7 reliable?
The price and inventory of MK50DX256CLL7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK50DX256CLL7 is usually 5 days.
3.What payment methods are accepted for MK50DX256CLL7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK50DX256CLL7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK50DX256CLL7?
MK50DX256CLL7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK50DX256CLL7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK50DX256CLL7?
For technical support, including MK50DX256CLL7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK50DX256CLL7 requirements.
6.How does Aetrix verify that MK50DX256CLL7 is sourced from the original manufacturer or authorized distributors?
All MK50DX256CLL7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK50DX256CLL7 meets industry standards.
7.What is the process for return or replacement of MK50DX256CLL7?
All MK50DX256CLL7 units undergo pre-shipment inspection (PSI). If there is an issue with MK50DX256CLL7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK50DX256CLL7 part is unused and in its original packaging.
Return procedure for MK50DX256CLL7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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