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NXP Semiconductors MK50DX256CMC10
- Part No.:
- MK50DX256CMC10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 121-LFBGA
- Datasheet:
-
MK50DX256CMC10.pdf
- Description:
- IC MCU 32B 256KB FLASH 121MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,548
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Product details
Overview
MK50DX256CMC10 from NXP Semiconductors (formerly Freescale) is a 100 MHz ARM Cortex-M4 microcontroller with DSP extensions, 256 KB on-chip flash, 64 KB SRAM, and 256 KB FlexNVM for configurable data/program storage or EEPROM emulation. It features dual 16-bit ADCs (up to 20 SE + 3 DP channels), two 12-bit DACs, three analog comparators, two op-amps, two transimpedance amplifiers, USB OTG LS/FS with device charger detect, and operates from 1.71 V to 3.6 V across –40 °C to 85 °C - used in industrial HMI and portable medical sensor interfaces.
For engineers reviewing the MK50DX256CMC10 datasheet, MK50DX256CMC10 pinout, MK50DX256CMC10 application, or MK50DX256CMC10 equivalent, key selection criteria include its 121-pin MAPBGA package, FlexMemory configurability (4 KB FlexRAM), 16-channel DMA, IEEE 1149.1/7 debug support, and absence of Ethernet or CAN peripherals - critical for low-power mixed-signal embedded designs requiring high analog integration and USB connectivity.
Technical Context
The MK50DX256CMC10 implements an ARM Cortex-M4 core with hardware-accelerated DSP instructions but no floating-point unit (SPFPU absent per Table 5). Its memory subsystem integrates main program flash, FlexNVM (256 KB), and FlexRAM (4 KB) enabling byte-write EEPROM emulation with up to 10 million cycles endurance.
Peripherals include two independent 16-bit SAR ADCs (ADC0 and ADC1), each supporting differential and single-ended conversions; dual 12-bit DACs; three high-speed analog comparators with integrated 6-bit DACs; and a full-speed USB OTG controller with on-chip transceiver and dedicated charger detection logic - all operating within the same 1.71–3.6 V supply range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4 @ 100 MHz with DSP instructions; no FPU - suitable for deterministic real-time signal processing without floating-point overhead. |
| Flash Memory | 256 KB main program flash + 256 KB FlexNVM - enables concurrent code execution and firmware updates while reserving space for bootloader or data logging. |
| SRAM / FlexRAM | 64 KB SRAM + 4 KB FlexRAM - FlexRAM supports high-endurance EEPROM emulation (byte-write/erase) without software emulation layer. |
| Analog Peripherals | Dual 16-bit ADCs (20 SE + 3 DP channels total), two 12-bit DACs, three analog comparators, two op-amps, two transimpedance amplifiers - sufficient for multi-channel sensor conditioning in portable diagnostics. |
| USB Interface | Full-Speed/Low-Speed USB OTG with integrated transceiver and Device Charger Detect (DCD) - enables direct USB battery charging negotiation and host/peripheral mode switching without external ICs. |
| Package & Temp | 121-pin MAPBGA (8 mm × 8 mm), –40 °C to +85 °C ambient operation - compatible with compact industrial PCB layouts requiring extended temperature reliability. |
| Debug Support | JTAG, cJTAG, SWD, TPIU, FPB, DWT, ITM, ETM, ETB - full trace and breakpoint capability for complex real-time firmware debugging and performance profiling. |
Pinout & Package
121-pin MAPBGA (8 mm × 8 mm, 0.5 mm pitch), ball grid array with standard I/O, power, ground, and debug interface layout per K50 family mechanical drawings. Pin mapping follows K50 sub-family signal multiplexing rules defined in the K50 Family Reference Manual.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD/VSS | Core & I/O power/ground | Multiple dedicated pairs ensure stable 1.71–3.6 V supply delivery and low-noise analog reference for ADC/DAC operation. |
| PTA0–PTA31 | GPIO with interrupt/DMA | 5V-tolerant digital I/O supporting capacitive touch sensing, UART, SPI, I²C, and timer capture - configurable per application needs. |
| ADC0_SE0–ADC0_SE19 | Analog input channels | Single-ended inputs for ADC0; combined with differential pairs enable precise ratiometric sensor measurements (e.g., thermistors, strain gauges). |
| USB_DP/USB_DM | USB differential pair | Integrated full-speed transceiver pins - require only series resistors and ESD protection; no external PHY needed. |
| TDI/TDO/TCK/TMS/TRST | JTAG/cJTAG debug interface | Supports boundary scan, flash programming, and real-time trace via standard ARM debug connectors. |
Key Features
| Feature | Design Value |
|---|---|
| FlexMemory architecture | 256 KB FlexNVM + 4 KB FlexRAM enables field-upgradable bootloader storage and 10M-cycle EEPROM emulation without external components. |
| Dual 16-bit ADCs with PGA support | Simultaneous sampling across two ADCs with programmable gain amplifiers allows synchronized multi-sensor acquisition (e.g., ECG + SpO₂). |
| USB OTG with Device Charger Detect | Hardware-level USB BC 1.2 charger identification eliminates need for external charger-detection ICs in portable medical or industrial handhelds. |
| Low-power operation modes | 10 configurable power modes including VLPR (Very Low Power Run) at 4 MHz CPU clock - extends battery life in always-on sensor nodes. |
| 5V-tolerant GPIO | Direct interface to legacy 5 V logic or sensors without level-shifting circuitry - reduces BOM cost and board area in mixed-voltage systems. |
Applications
| Industrial HMI Panel | Portable Medical Sensor Hub |
|---|---|
Use Scenario: Touch-enabled control panel for HVAC or PLC interface with LCD backlight dimming and local data logging. IC Role / Device Role / Timing Role: Main system controller managing capacitive touch inputs, segment LCD drive, USB firmware updates, and analog sensor monitoring. Use Value: Integrated FlexNVM stores calibration tables and UI assets; dual ADCs acquire temperature/humidity simultaneously; USB DCD enables field technician reprogramming via standard USB cable. | Use Scenario: Battery-powered wearable device acquiring ECG, skin temperature, and motion data for remote patient monitoring. IC Role / Device Role / Timing Role: Signal acquisition and preprocessing engine performing analog front-end conditioning, oversampling, and USB HID report generation. Use Value: Two 16-bit ADCs sample differential ECG leads and thermistor channels concurrently; 12-bit DACs generate reference voltages; low-leakage wake-up unit extends runtime between Bluetooth sync events. |
| Smart Energy Meter Interface | Test & Measurement Front-End |
Use Scenario: Data concentrator module interfacing with current/voltage sensors and communicating via USB to central gateway. IC Role / Device Role / Timing Role: Precision analog acquisition node with isolated communication interface and secure firmware update capability. Use Value: 16-bit ADC resolution captures sub-ampere current variations; CRC engine validates flash updates over USB; FlexRAM stores tamper-event logs with byte-erase persistence. | Use Scenario: Portable oscilloscope probe adapter digitizing analog signals and streaming waveform data to PC via USB. IC Role / Device Role / Timing Role: High-fidelity ADC controller with real-time decimation, trigger logic, and USB bulk transfer engine. Use Value: Dual ADCs support interleaved sampling for effective 200 kSPS; programmable delay block synchronizes trigger events; USB OTG ensures plug-and-play compatibility with Windows/Linux hosts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MK51DX256CLL10 | Same 100 MHz Cortex-M4 core, 256 KB flash, 64 KB SRAM, but uses 100-pin LQFP instead of 121-pin MAPBGA; includes segment LCD controller (absent in MK50DX256CMC10). | Targeted at designs requiring integrated LCD drive for instrumentation displays rather than compact BGA-based sensor hubs. | Select MK51DX256CLL10 when physical display integration is required and LQFP packaging is preferred for prototyping or repairability. |
| MK60DN512ZVLQ10 | Higher-end K60 family part: 100 MHz Cortex-M4 with FPU, 512 KB flash, 128 KB SRAM, Ethernet MAC, and CAN - but no FlexNVM or USB DCD. | Suitable for networked industrial controllers needing TCP/IP stack offload and deterministic CAN bus communication, not USB-charging-aware portable devices. | Choose MK60DN512ZVLQ10 only if Ethernet/CAN are mandatory and USB DCD is unnecessary; otherwise, MK50DX256CMC10 offers better analog integration and power efficiency. |
Compared with MK51DX256CLL10 and MK60DN512ZVLQ10, MK50DX256CMC10 uniquely balances high-resolution analog acquisition, USB OTG with charger detection, and FlexMemory-based EEPROM emulation in a compact 121-pin BGA - making it optimal for space-constrained, battery-sensitive applications where LCD drive or Ethernet are not required.
Availability
MK50DX256CMC10 is available at Aetrix Electronics and suitable for industrial HMI panels, portable medical sensor hubs, smart energy meter interfaces, and test & measurement front-ends requiring stable component supply, long-term lifecycle support, and consistent electrical specifications.
Supply support for MK50DX256CMC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Freescale Semiconductor and Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The Kinetis K50 family - including MK50DX256CMC10 - was designed for low-power, high-precision mixed-signal embedded applications requiring rich analog integration, USB connectivity, and flexible nonvolatile memory configuration without external EEPROM or Flash.
FAQ
What is the maximum CPU frequency and core type of MK50DX256CMC10?
MK50DX256CMC10 features an ARM Cortex-M4 core rated at 100 MHz with hardware DSP instruction support. It does not include a single-precision floating-point unit (SPFPU), distinguishing it from higher-tier Kinetis variants like the K60 family. This configuration delivers deterministic real-time performance for fixed-point signal processing tasks while minimizing power consumption and silicon area.
Does MK50DX256CMC10 support USB Device Charger Detect (DCD)?
Yes, MK50DX256CMC10 includes dedicated hardware for USB Device Charger Detect (DCD) compliant with USB Battery Charging Specification 1.2. This allows the MK50DX256CMC10 to automatically identify wall adapters, charging ports, and standard downstream ports during enumeration - enabling optimized battery charging behavior without firmware polling or external detection circuitry.
What analog peripherals are integrated into MK50DX256CMC10?
MK50DX256CMC10 integrates dual 16-bit SAR ADCs (ADC0 and ADC1), two 12-bit DACs, three analog comparators (each with integrated 6-bit DAC), two general-purpose op-amps, two transimpedance amplifiers, and a programmable voltage reference. These peripherals support simultaneous multi-channel sensor acquisition, precision reference generation, and analog signal conditioning - essential for medical and industrial measurement applications.
What is the FlexMemory configuration of MK50DX256CMC10?
MK50DX256CMC10 includes 256 KB of FlexNVM and 4 KB of FlexRAM. FlexRAM can be configured as high-endurance EEPROM (up to 10 million write/erase cycles) or additional system RAM, while FlexNVM serves as supplemental program/data flash or EEPROM backup storage - all managed transparently by hardware without CPU intervention during writes.
Which package and pin count does MK50DX256CMC10 use?
MK50DX256CMC10 uses a 121-ball MAPBGA package (8 mm × 8 mm, 0.5 mm pitch) with 87 user I/O pins. This compact BGA footprint supports high-density PCB layouts typical in portable and industrial embedded systems, and is pin-compatible with other K50 family members sharing the same package identifier (CMC).
MK50DX256CMC10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 121-LFBGA
- Series:
- Kinetis K50
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 27x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK50DX256CMC10 FAQ
1.How can I place an order for MK50DX256CMC10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK50DX256CMC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK50DX256CMC10 reliable?
The price and inventory of MK50DX256CMC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK50DX256CMC10 is usually 5 days.
3.What payment methods are accepted for MK50DX256CMC10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK50DX256CMC10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK50DX256CMC10?
MK50DX256CMC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK50DX256CMC10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK50DX256CMC10?
For technical support, including MK50DX256CMC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK50DX256CMC10 requirements.
6.How does Aetrix verify that MK50DX256CMC10 is sourced from the original manufacturer or authorized distributors?
All MK50DX256CMC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK50DX256CMC10 meets industry standards.
7.What is the process for return or replacement of MK50DX256CMC10?
All MK50DX256CMC10 units undergo pre-shipment inspection (PSI). If there is an issue with MK50DX256CMC10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK50DX256CMC10 part is unused and in its original packaging.
Return procedure for MK50DX256CMC10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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