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NXP Semiconductors MK50DX256CMC7
- Part No.:
- MK50DX256CMC7
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 121-LFBGA
- Datasheet:
-
MK50DX256CMC7.pdf
- Description:
- IC MCU 32B 256KB FLASH 121MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:243
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Product details
Overview
MK50DX256CMC7 from NXP (formerly Freescale) is a 72 MHz ARM Cortex-M4 microcontroller with DSP extension, 256 KB flash, 64 KB SRAM, and FlexMemory (32 KB FlexNVM + 2 KB FlexRAM). It features dual 16-bit ADCs, 12-bit DAC, USB OTG LS/FS with device charger detect, and operates from 1.71–3.6 V in industrial temperature range (–40 to +85 °C), targeting portable medical sensors and industrial HMI.
For engineers reviewing the MK50DX256CMC7 datasheet, MK50DX256CMC7 pinout, MK50DX256CMC7 application, or MK50DX256CMC7 equivalent, key selection criteria include USB OTG support with integrated 120 mA regulator, FlexMemory configurability for EEPROM emulation, 72 MHz real-time performance with low-power timer and LLWU wake-up, and compatibility with Kinetis SDK and MCUXpresso IDE.
Technical Context
The MK50DX256CMC7 implements an ARM Cortex-M4 core with hardware DSP instructions but no FPU. Its memory subsystem includes main program flash, FlexNVM (partitionable as data flash or EEPROM backup), and FlexRAM (configurable as high-endurance EEPROM or RAM), enabling concurrent code execution and bootloader storage without external memory.
Peripherals include two 16-bit SAR ADCs (19+3 SE/DP and 16+3 SE/DP channels), one 12-bit DAC, three analog comparators, two op-amps, one transimpedance amplifier, six UARTs (one with ISO7816/IrDA), three SPI modules, two I²C interfaces, one I²S, and full-speed USB OTG with on-chip transceiver and DCD logic - all supported by 16-channel DMA and NVIC for deterministic real-time response.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4 @ 72 MHz with DSP instructions; enables efficient signal processing in sensor fusion or motor control loops. |
| Flash Memory | 256 KB main program flash + 32 KB FlexNVM; supports read-while-write and firmware updates without halting execution. |
| SRAM | 64 KB on-chip SRAM; sufficient for RTOS stacks, communication buffers, and real-time control variables. |
| FlexRAM | 2 KB configurable as byte-write/erase EEPROM (10M cycle endurance); eliminates need for external EEPROM IC. |
| ADC | Dual 16-bit SAR ADCs: ADC0 (19 SE + 3 DP channels), ADC1 (16 SE + 3 DP channels); supports simultaneous sampling for multi-sensor acquisition. |
| USB Interface | Full-Speed/Low-Speed USB OTG with integrated transceiver, 120 mA regulator, and Device Charger Detect (DCD); enables direct battery-powered USB peripheral operation. |
| Operating Voltage | 1.71–3.6 V supply range; allows direct connection to single-cell Li-ion or 3.3 V system rails without level-shifting. |
| Temperature Range | –40 °C to +85 °C; qualified for industrial and extended-temperature embedded applications. |
Pinout & Package
MK50DX256CMC7 is housed in a 121-pin MAPBGA package (8 mm × 8 mm, 0.5 mm pitch), with 97 GPIOs including 5V-tolerant inputs, pin-interrupt capability, and digital glitch filtering. The package supports high-density PCB layouts while maintaining thermal performance for continuous 72 MHz operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD/VSS | Core power/ground | Multiple dedicated pairs ensure stable 1.2 V core supply and low-noise analog reference; decoupling required per datasheet layout guidelines. |
| VDDA/VSSA | Analog power/ground | Isolated analog domain pins enable precision ADC/DAC operation; must be filtered separately from digital VDD. |
| USB_DP/USB_DM | USB differential pair | On-die full-speed transceiver; requires 28 Ω series termination and controlled 90 Ω differential impedance routing. |
| PTA0–PTA31 | GPIO port A | 32-bit port with interrupt, DMA request, and 5V-tolerant capability; usable for parallel LCD interface or fast digital I/O. |
| ADC0_SE0–ADC0_SE18 | ADC0 single-ended inputs | 19 dedicated analog input pins for ADC0; multiplexed with GPIO, supporting up to 19 independent sensor channels. |
| USB_VREGIN | USB regulator input | Accepts 4.4–5.25 V for internal 3.3 V USB PHY regulator; enables self-powered USB device operation from external 5 V rail. |
Key Features
| Feature | Design Value |
|---|---|
| FlexMemory architecture | 32 KB FlexNVM + 2 KB FlexRAM enables field-upgradable bootloader storage and 10M-cycle EEPROM emulation without software overhead. |
| Low-power operation | 10 power modes including VLPR (Very Low Power Run) at 4 MHz; wake-up from LLS3 mode in ≤4 µs via LLWU or RTC alarm. |
| Dual 16-bit ADCs with hardware averaging | Simultaneous sampling across ADC0/ADC1 reduces jitter in time-critical measurements; 16-sample hardware average improves SNR by ~12 dB. |
| USB OTG with DCD and 120 mA regulator | Enables plug-and-play USB peripheral functionality (e.g., HID, CDC) directly from battery or 5 V bus without external USB power management IC. |
| Capacitive touch sensing (TSI) | 16-channel TSI module with low-power scan mode (<10 µA avg); supports proximity detection and slider/wheel UI on industrial HMI panels. |
| Programmable delay block (PDB) | Hardware-triggered ADC conversions synchronized to PWM edges; essential for precise current/voltage sampling in motor control FOC algorithms. |
Applications
| Portable Medical Sensor Hub | Industrial HMI Controller |
|---|---|
Use Scenario: Compact wearable device aggregating ECG, SpO₂, and temperature data with local preprocessing and USB-CDC upload to PC. IC Role / Device Role / Timing Role: Central MCU executing sensor fusion algorithm, managing USB CDC virtual COM port, and controlling low-power sleep cycles between samples. Use Value: Integrated 16-bit ADCs eliminate external signal conditioning ICs; FlexRAM stores calibration coefficients with EEPROM-level reliability; USB DCD detects host connection without polling. | Use Scenario: Panel-mounted operator interface with capacitive touch buttons, segment LCD, and RS-485 Modbus gateway for PLC integration. IC Role / Device Role / Timing Role: Real-time HMI controller driving 24×8 segment LCD, scanning 16 TSI electrodes, and bridging Modbus RTU over UART to USB CDC. Use Value: On-chip segment LCD controller reduces BOM cost; TSI module enables robust touch detection in noisy factory environments; dual UARTs support isolated debug and fieldbus comms. |
| Smart Energy Metering Node | USB-Powered Test Instrument |
Use Scenario: DIN-rail mounted meter collecting voltage/current harmonics via shunt/sensor, storing 15-min energy logs, and uploading via USB mass storage. IC Role / Device Role / Timing Role: High-precision measurement engine using dual ADCs with programmable gain amplifiers and hardware averaging for sub-0.5% THD error. Use Value: 16-bit ADC resolution and PGA support accurate current sensing across 100:1 dynamic range; FlexNVM stores firmware and log tables independently of main flash. | Use Scenario: Handheld oscilloscope probe with analog front-end, 1 MS/s sampling, and USB 2.0 streaming to PC software. IC Role / Device Role / Timing Role: Data acquisition controller synchronizing ADC sampling, buffering in SRAM, and streaming via USB bulk transfer with zero-copy DMA. Use Value: 64 KB SRAM accommodates 32k-sample buffer; USB OTG full-speed bandwidth (12 Mbps) sustains 1 MS/s streaming at 12-bit resolution; PDB triggers ADC precisely on timer events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MK51DX256CLK7 | Same core, flash, and FlexMemory; adds segment LCD controller (24×8/28×4) and extra UART; uses 80-pin LQFP instead of 121-pin MAPBGA. | Preferred for cost-sensitive designs requiring integrated segment LCD drive without BGA assembly. | Select MK51DX256CLK7 when segment display support is needed and LQFP packaging simplifies manufacturing. |
| MK50DN256CLK7 | Same package and pin count; replaces FlexMemory with 256 KB main flash only (no FlexNVM/FlexRAM); retains identical peripherals and clocking. | Suitable where EEPROM emulation is unnecessary and maximum program flash is prioritized over data retention flexibility. | Choose MK50DN256CLK7 if application requires larger bootloader space and does not rely on on-chip EEPROM replacement. |
Compared with MK50DX256CMC7, MK51DX256CLK7 adds segment LCD capability in LQFP packaging but sacrifices BGA density and thermal performance, while MK50DN256CLK7 trades FlexMemory configurability for pure flash capacity - both require PCB redesign due to different packages or memory architecture.
Availability
MK50DX256CMC7 is available at Aetrix Electronics and suitable for portable medical devices, industrial HMI panels, smart energy meters, and USB-powered test instrumentation requiring stable component supply across long production lifecycles.
Supply support for MK50DX256CMC7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MK50DX256CMC7 belongs to the Kinetis K50 family - designed specifically for low-power, mixed-signal applications requiring USB OTG, high-resolution analog front-ends, and flexible memory architecture in industrial temperature grades.
FAQ
What is the maximum CPU frequency and core type of the MK50DX256CMC7?
The MK50DX256CMC7 features an ARM Cortex-M4 core with DSP extension operating at a maximum frequency of 72 MHz. It does not include a floating-point unit (FPU). This configuration delivers 1.25 DMIPS/MHz performance, making it suitable for real-time signal processing tasks such as sensor fusion or motor control without requiring external coprocessors. The MK50DX256CMC7 achieves deterministic timing through tightly coupled NVIC and 16-channel DMA.
Does the MK50DX256CMC7 support USB Device Charger Detection (DCD)?
Yes, the MK50DX256CMC7 includes integrated USB Device Charger Detect (DCD) logic compliant with USB Battery Charging Specification v1.2. This allows the MK50DX256CMC7 to automatically identify host PC, standard downstream port, or dedicated charging port (DCP) during enumeration. The feature enables adaptive power management - for example, drawing up to 1.5 A from a DCP while limiting to 100 mA from a standard host - without external circuitry.
How is FlexMemory configured on the MK50DX256CMC7?
The MK50DX256CMC7 includes 32 KB of FlexNVM and 2 KB of FlexRAM. FlexNVM can be partitioned into additional program flash, data flash, or EEPROM backup space; FlexRAM serves as high-endurance EEPROM (up to 10 million write/erase cycles) or supplemental RAM. Configuration is performed at runtime via FTFL_FCCOB registers, and the MK50DX256CMC7 supports seamless byte-write/erase operations without CPU intervention or flash erase delays.
What analog peripherals are integrated into the MK50DX256CMC7?
The MK50DX256CMC7 integrates dual 16-bit SAR ADCs (ADC0 with 19 SE + 3 DP channels; ADC1 with 16 SE + 3 DP channels), one 12-bit DAC, three analog comparators, two programmable gain amplifiers (PGA), two op-amps, one transimpedance amplifier (TRIAMP), and a programmable voltage reference (VREF). These peripherals support precision sensor interfacing, closed-loop control, and analog signal conditioning - all operating within the 1.71–3.6 V supply range of the MK50DX256CMC7.
Which development tools support the MK50DX256CMC7?
The MK50DX256CMC7 is fully supported by NXP's MCUXpresso IDE (v11.7+), Kinetis SDK v2.x, and CMSIS-compliant drivers. Hardware debugging uses SWD/JTAG via LPC-Link2 or Segger J-Link probes. Example projects include USB CDC, ADC continuous conversion with DMA, and low-power stop-mode wake-up - all validated on FRDM-K50D50M and TWR-K50D100M evaluation boards. The MK50DX256CMC7 also integrates with third-party RTOSes like FreeRTOS and Zephyr.
MK50DX256CMC7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 121-LFBGA
- Series:
- Kinetis K50
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 72MHz
- Connectivity:
- EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 63
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 36x16b; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK50DX256CMC7 FAQ
1.How can I place an order for MK50DX256CMC7 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK50DX256CMC7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK50DX256CMC7 reliable?
The price and inventory of MK50DX256CMC7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK50DX256CMC7 is usually 5 days.
3.What payment methods are accepted for MK50DX256CMC7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK50DX256CMC7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK50DX256CMC7?
MK50DX256CMC7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK50DX256CMC7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK50DX256CMC7?
For technical support, including MK50DX256CMC7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK50DX256CMC7 requirements.
6.How does Aetrix verify that MK50DX256CMC7 is sourced from the original manufacturer or authorized distributors?
All MK50DX256CMC7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK50DX256CMC7 meets industry standards.
7.What is the process for return or replacement of MK50DX256CMC7?
All MK50DX256CMC7 units undergo pre-shipment inspection (PSI). If there is an issue with MK50DX256CMC7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK50DX256CMC7 part is unused and in its original packaging.
Return procedure for MK50DX256CMC7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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