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NXP Semiconductors MK50DX256CMD10
- Part No.:
- MK50DX256CMD10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LBGA
- Datasheet:
-
MK50DX256CMD10.pdf
- Description:
- IC MCU 32B 256KB FLASH 144MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,807
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Product details
Overview
MK50DX256CMD10 from NXP Semiconductors (formerly Freescale) is a 100 MHz ARM Cortex-M4 microcontroller with DSP extensions, 256 KB program flash, 256 KB FlexNVM, 64 KB SRAM, and 4 KB FlexRAM configured as EEPROM backup. It integrates dual 16-bit ADCs, two 12-bit DACs, three analog comparators, two op-amps, two transimpedance amplifiers, USB OTG LS/FS with device charger detect, six UARTs, three SPI modules, two I²C interfaces, I²S, and capacitive touch sensing. It targets industrial HMI, portable medical devices, and smart energy meters requiring mixed-signal precision and low-power operation.
For engineers reviewing the MK50DX256CMD10 datasheet, MK50DX256CMD10 pinout, MK50DX256CMD10 application, or MK50DX256CMD10 equivalent, key selection criteria include its 100 MHz Cortex-M4 core with DSP support, FlexMemory partitioning capability (256 KB FlexNVM + 4 KB FlexRAM), 144-pin MAPBGA package, -40°C to 85°C temperature range, and full-speed USB OTG with integrated transceiver and charger detection.
Technical Context
The MK50DX256CMD10 implements a 32-bit ARM Cortex-M4 core with hardware DSP instructions but no floating-point unit. Its memory subsystem includes independent flash banks enabling concurrent code execution and firmware updates, plus FlexMemory allowing dynamic allocation of FlexNVM for program/data storage or EEPROM backup and FlexRAM for high-endurance byte-write EEPROM emulation.
Peripherals are organized around a multi-layer AHB bus matrix with DMA servicing all major peripherals including ADCs, UARTs, SPI, I²C, USB, and timers. The device supports 10 low-power modes, features an asynchronous wake-up interrupt controller (AWIC), and includes a low-leakage wake-up unit (LLWU) with configurable pin sources for battery-sensitive applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4 @ 100 MHz with DSP instructions - enables real-time signal processing without external co-processor |
| Flash Memory | 256 KB main program flash - sufficient for complex embedded applications with bootloader and application code separation |
| FlexNVM | 256 KB non-volatile memory - configurable as additional program flash, data flash, or EEPROM backup storage |
| FlexRAM | 4 KB RAM - used as high-endurance EEPROM (up to 10M cycles) with byte-write/erase capability |
| ADC | Dual 16-bit SAR ADCs (ADC0: 19 SE + 3 DP; ADC1: 20 SE + 3 DP) - supports simultaneous sampling and high-precision sensor interfacing |
| USB Interface | Full-Speed/Low-Speed USB OTG with on-chip transceiver and Device Charger Detect - eliminates external PHY and enables battery charging negotiation |
| Package | 144-pin MAPBGA (13 mm × 13 mm) - compact footprint with 0.8 mm pitch, suitable for space-constrained industrial PCBs |
| Operating Range | 1.71 V to 3.6 V supply, -40°C to +85°C ambient - supports wide-input power supplies and extended industrial environments |
Pinout & Package
Package: 144-pin MAPBGA (13 mm × 13 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VREFH | Analog/Digital Power Supply | Separate analog and digital domains ensure clean ADC reference and low-noise operation |
| VSS, VSSA, VREFL | Analog/Digital Ground | Dedicated ground planes minimize coupling noise between analog and digital sections |
| PTA0–PTA31, PTB0–PTB17, PTC0–PTC17, PTD0–PTD15, PTE0–PTE25 | GPIO with Multiplexing | 112 total GPIO pins with 5 V tolerant inputs, pin interrupt, DMA request, and digital glitch filter |
| USB0_DP / USB0_DM | USB Differential Pair | Integrated full-speed USB transceiver requires no external PHY; supports LS/FS OTG operation |
| ADC0_SE0–ADC0_SE18, ADC1_SE0–ADC1_SE19 | Analog Input Channels | 39 total single-ended ADC inputs across two converters - enables multi-sensor monitoring without external mux |
| FTM0_CH0–FTM0_CH7 | PWM Output Terminals | 8-channel flexible timer supports motor control, LED dimming, and precise waveform generation |
Key Features
| Feature | Design Value |
|---|---|
| FlexMemory architecture | 256 KB FlexNVM + 4 KB FlexRAM enables field-configurable EEPROM replacement or expanded program/data storage without hardware change |
| Dual 16-bit ADCs with differential support | Simultaneous sampling on two ADCs with up to 3 DP channels each reduces sensor acquisition time and improves noise rejection |
| USB OTG with Device Charger Detect (DCD) | Automatically identifies wall adapters, PCs, and charging ports - critical for portable medical and battery-powered HMI devices |
| Capacitive Touch Sensing Interface (TSI) | 16-channel TSI with low-power operation and minimal current adder - enables touch buttons/sliders in always-on UIs |
| 10 low-power operating modes | Includes VLPR (Very Low Power Run) at 4 MHz and LLS (Low-Leakage Stop) with RTC wake-up - extends battery life in intermittent-sensing applications |
| 5 V tolerant GPIO | Eliminates level-shifting circuitry when interfacing with legacy 5 V peripherals or sensors |
Applications
| Industrial Human-Machine Interface | Portable Medical Monitoring |
|---|---|
Use Scenario: Panel-mounted control interface for PLCs and factory HMIs with segmented LCD and tactile feedback. IC Role / Device Role / Timing Role: Primary MCU managing display refresh, button scanning, serial communication to controllers, and real-time alarm response. Use Value: Integrated segment LCD controller (not present in this variant), dual ADCs for analog input monitoring, and USB OTG for configuration updates reduce BOM cost and board area. | Use Scenario: Battery-powered ECG or glucose meter with analog front-end, touch interface, and USB data export. IC Role / Device Role / Timing Role: Signal acquisition MCU performing analog sensor conditioning, digital filtering, and secure USB data transfer. Use Value: 16-bit ADC resolution, low-power stop modes with RTC wake-up, and DCD-enabled USB charging extend runtime while ensuring regulatory-compliant data handling. |
| Smart Energy Metering | Industrial Sensor Gateway |
Use Scenario: DIN-rail mounted electricity meter with voltage/current sensing, tamper detection, and local USB configuration port. IC Role / Device Role / Timing Role: Main measurement controller executing metrology algorithms, managing EEPROM-backed calibration data, and supporting field firmware updates. Use Value: FlexRAM provides 4 KB of 10M-cycle EEPROM for calibration constants; USB OTG allows technician-level firmware patching without JTAG debuggers. | Use Scenario: Edge node aggregating RS-485 Modbus sensor data and forwarding via USB to host PC or gateway. IC Role / Device Role / Timing Role: Protocol translation hub with multiple UARTs, SPI for local flash storage, and USB host/device for flexible connectivity. Use Value: Six UARTs (including ISO7816-capable) and three SPI modules enable concurrent Modbus RTU, SD card logging, and USB CDC communication without external bridge ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MK50DN512ZCMD10 | 512 KB main flash, no FlexNVM, 128 KB SRAM - higher code capacity but no configurable EEPROM backup | Better suited for large firmware images where EEPROM emulation is handled externally or via software | Select when application requires >256 KB application code space and does not rely on FlexRAM-based EEPROM |
| MK51DX256ZCMD10 | Same package and clock; adds segment LCD controller (32×8/36×4) and enhanced TSI (16 inputs + proximity) | Required for designs needing direct drive of segment displays or advanced capacitive touch with proximity sensing | Select when integrated segment LCD controller or enhanced touch performance is mandatory |
Compared with MK50DN512ZCMD10 and MK51DX256ZCMD10, the MK50DX256CMD10 uniquely balances high FlexNVM capacity for field-upgradable data storage and robust mixed-signal capability without LCD overhead - ideal for sensor-centric industrial edge nodes where EEPROM endurance and USB configurability outweigh display needs.
Availability
MK50DX256CMD10 is available at Aetrix Electronics and suitable for industrial HMI, portable medical devices, smart energy metering, and sensor gateway applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for MK50DX256CMD10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Freescale Semiconductor and merged with NXP in 2015. It specializes in secure connectivity solutions for automotive, industrial, and IoT markets.
The Kinetis K50 family was designed by Freescale (now NXP) as a low-power, mixed-signal ARM Cortex-M4 MCU line targeting industrial human-machine interfaces, portable instrumentation, and smart grid endpoints with integrated analog front-ends and USB OTG.
FAQ
What is the maximum CPU frequency supported by the MK50DX256CMD10?
The MK50DX256CMD10 operates at a maximum CPU frequency of 100 MHz using its ARM Cortex-M4 core. This speed is achieved via the internal PLL or FLL clock sources, and the device maintains full functionality-including flash execution, ADC conversions, and USB transactions-at this rated frequency across the specified voltage (1.71 V–3.6 V) and temperature (-40°C to +85°C) ranges. The MK50DX256CMD10 datasheet confirms this rating under "Electrical Characteristics" and "Clock Modules" sections.
Does the MK50DX256CMD10 include a floating-point unit (FPU)?
No, the MK50DX256CMD10 does not include a hardware floating-point unit. It implements the ARM Cortex-M4 core with DSP instruction support (e.g., MAC, saturating arithmetic) but omits the optional single-precision FPU. Applications requiring intensive floating-point computation must use software libraries or offload to external processors. This aligns with the K50 family's focus on deterministic real-time control and mixed-signal processing rather than high-throughput math.
How is FlexMemory configured on the MK50DX256CMD10?
The MK50DX256CMD10 includes 256 KB of FlexNVM and 4 KB of FlexRAM. FlexRAM is preconfigured as EEPROM backup, supporting byte-write/erase operations with up to 10 million cycles. FlexNVM can be partitioned during initialization to serve as additional program flash, data flash, or EEPROM backup-enabling field-upgradable firmware or persistent calibration tables without external memory. Configuration is performed via runtime commands or bootloader utilities documented in the K50 Reference Manual.
What USB capabilities does the MK50DX256CMD10 provide?
The MK50DX256CMD10 integrates a full-speed/low-speed USB OTG controller with an on-chip transceiver and Device Charger Detect (DCD) logic. It supports USB device, host, and OTG roles, and automatically identifies USB chargers (SDP, CDP, DCP) per USB Battery Charging Specification v1.2. No external PHY or charger-detection circuitry is required, simplifying design for portable and battery-backed applications where USB-powered operation and firmware updates are essential.
Is the MK50DX256CMD10 pin-compatible with other K50 family members in the same package?
Yes, the MK50DX256CMD10 is pin-for-pin compatible with all other K50 devices in the 144-pin MAPBGA (MD) package, including MK50DN512ZCMD10 and MK51DX256ZCMD10. This compatibility extends to signal multiplexing, power, ground, and debug pins. However, peripheral availability (e.g., segment LCD controller, Ethernet) varies by part number, so firmware must be validated for the specific feature set enabled on the target device.
MK50DX256CMD10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LBGA
- Series:
- Kinetis K50
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 96
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 41x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK50DX256CMD10 FAQ
1.How can I place an order for MK50DX256CMD10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK50DX256CMD10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK50DX256CMD10 reliable?
The price and inventory of MK50DX256CMD10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK50DX256CMD10 is usually 5 days.
3.What payment methods are accepted for MK50DX256CMD10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK50DX256CMD10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK50DX256CMD10?
MK50DX256CMD10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK50DX256CMD10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK50DX256CMD10?
For technical support, including MK50DX256CMD10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK50DX256CMD10 requirements.
6.How does Aetrix verify that MK50DX256CMD10 is sourced from the original manufacturer or authorized distributors?
All MK50DX256CMD10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK50DX256CMD10 meets industry standards.
7.What is the process for return or replacement of MK50DX256CMD10?
All MK50DX256CMD10 units undergo pre-shipment inspection (PSI). If there is an issue with MK50DX256CMD10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK50DX256CMD10 part is unused and in its original packaging.
Return procedure for MK50DX256CMD10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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