NXP Semiconductors MK50DX256ZCLL10
- Part No.:
- MK50DX256ZCLL10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
MK50DX256ZCLL10.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MK50DX256ZCLL10 from NXP Semiconductors (formerly Freescale) is a 100 MHz ARM Cortex-M4 microcontroller with DSP extensions, 256 KB on-chip flash, 256 KB FlexNVM, 64 KB SRAM, and 4 KB FlexRAM configured as EEPROM. It features dual 16-bit ADCs (19+3 SE/DP and 18+3 SE/DP channels), two 12-bit DACs, three analog comparators, two op-amps, two transimpedance amplifiers, USB OTG LS/FS with device charger detect, six UARTs, three SPI modules, two I²C interfaces, I²S, carrier modulator transmitter, and segment LCD controller support - deployed in industrial HMI and metering systems requiring mixed-signal precision and low-power operation.
For engineers reviewing the MK50DX256ZCLL10 datasheet, MK50DX256ZCLL10 pinout, MK50DX256ZCLL10 application, or MK50DX256ZCLL10 equivalent, key selection criteria include its 100 MHz Cortex-M4 core with DSP, FlexMemory partitioning (256 KB FlexNVM + 4 KB FlexRAM), 100-pin LQFP package with 59 GPIOs (5V-tolerant), -40°C to +85°C temperature range, 1.71–3.6 V supply, and integrated USB OTG with DCD and 120 mA regulator.
Technical Context
This MCU implements a full-featured ARM Cortex-M4 core with hardware floating-point unit (FPU) not enabled in this variant (D = DSP-only), nested vectored interrupt controller (NVIC), and debug support via SWD/JTAG/cJTAG with TPIU, FPB, DWT, and ITM trace. Its memory subsystem includes independent flash banks enabling read-while-write, FlexMemory allowing dynamic allocation between program flash, data flash, and high-endurance EEPROM emulation, and 64 KB SRAM with DMA-accelerated access.
The analog subsystem integrates two synchronized 16-bit SAR ADCs with programmable gain amplifiers (PGA), voltage reference, 12-bit DACs, high-speed comparators with internal 6-bit DACs, op-amps, and transimpedance amplifiers - supporting sensor signal conditioning, closed-loop control, and precision metrology. Timing peripherals include one 8-channel FTM, two 2-channel FTM modules, CMT, PDB, PIT, and LPT for motor control, PWM generation, IR modulation, and low-power scheduling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4 @ 100 MHz with DSP instructions (no FPU) |
| Flash Memory | 256 KB main program flash + 256 KB FlexNVM for configurable code/data/EEPROM backup |
| SRAM / FlexRAM | 64 KB SRAM + 4 KB FlexRAM usable as high-endurance EEPROM (10M cycles) |
| Analog Peripherals | Dual 16-bit ADCs (19+3 & 18+3 ch), two 12-bit DACs, three comparators, two op-amps, two TRIAMPs |
| USB Interface | Full-Speed/Low-Speed USB OTG with on-chip transceiver, device charger detect (DCD), and 120 mA regulator |
| Package & Pins | 100-pin LQFP (14 mm × 14 mm), 59 GPIOs with 5V tolerance and pin-interrupt capability |
| Operating Range | -40°C to +85°C ambient, 1.71 V to 3.6 V supply; flash programmable down to 1.71 V |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Core and I/O power domains; decoupling required per datasheet layout guidelines |
| PTA0–PTA31, PTB0–PTB17, PTC0–PTC17, PTD0–PTD7, PTE0–PTE29 | GPIO bank terminals | 59 total GPIOs; all 5V-tolerant, configurable for interrupts, DMA, digital filtering, and peripheral multiplexing |
| USB0_DP / USB0_DM | USB differential pair | Integrated full-speed/low-speed transceiver; requires external 1.5 kΩ pull-up on DP for device mode |
| ADC0_SE0–ADC0_SE18, ADC1_SE0–ADC1_SE17 | Analog input channels | 37 total single-ended ADC inputs across two 16-bit SAR converters; supports simultaneous sampling and hardware triggering |
| FTM0_CH0–FTM0_CH7 | PWM/timer output channels | 8-channel flexible timer supporting edge-aligned/complementary PWM, quadrature decoding, and dead-time insertion |
Key Features
| Feature | Design Value |
|---|---|
| FlexMemory architecture | Enables runtime reconfiguration of 256 KB FlexNVM between additional program flash, data flash, or EEPROM backup - eliminating need for external EEPROM |
| Dual synchronized 16-bit ADCs | Supports time-aligned sampling across two converters for phase-current measurement in motor control or multi-sensor acquisition without CPU overhead |
| USB OTG with Device Charger Detect | Automatically identifies wall adapters, PCs, and charging ports per USB Battery Charging Spec v1.2 - critical for portable medical and handheld instrumentation |
| Low-power operation | 10 configurable power modes including VLPR/VLPW/LLS/ULP with sub-μA RTC wake-up and fast 3.5 μs wake-from-VLPR - extends battery life in remote sensors |
| Segment LCD controller | Drives up to 320 segments (e.g., 40×8 or 36×4) with internal bias generation and charge pump - enables cost-effective display in utility meters and HVAC controls |
Applications
| Industrial Metering | Portable Medical Devices |
|---|---|
Use Scenario: Smart electricity/water/gas meter with real-time energy calculation, tamper detection, and local display. IC Role / Device Role / Timing Role: Primary system controller executing metrology algorithms, managing LCD, reading isolated current/voltage sensors via ADCs, and handling secure firmware updates over USB. Use Value: FlexNVM stores calibration tables and tariff data with EEPROM-level endurance; dual ADCs enable simultaneous voltage/current sampling for Class 0.5 accuracy. | Use Scenario: Handheld ECG monitor with analog front-end, OLED/LCD display, and USB-based data export. IC Role / Device Role / Timing Role: Signal acquisition controller interfacing with precision analog front-end, driving segment LCD, and managing USB mass storage mode for waveform download. Use Value: 16-bit ADCs resolve microvolt-level ECG signals; USB DCD ensures reliable charging from hospital-grade adapters; low-power modes extend battery runtime beyond 8 hours. |
| Building Automation HMI | Motor Control Gateway |
Use Scenario: Wall-mounted thermostat or lighting controller with capacitive touch buttons and segmented display. IC Role / Device Role / Timing Role: Human-machine interface processor handling TSI inputs, segment LCD refresh, environmental sensor reads (temp/humidity), and RS-485 communication to building BMS. Use Value: Integrated segment LCD controller reduces BOM count; 5V-tolerant GPIOs simplify interface to legacy 5V sensors and actuators; FlexRAM stores user preferences with 10M-cycle reliability. | Use Scenario: BLDC motor drive gateway aggregating position feedback, current sensing, and CAN bus commands. IC Role / Device Role / Timing Role: Real-time motor control coordinator generating PWM via FTM modules, acquiring current/voltage via synchronized ADCs, and communicating over UART/CAN to host controller. Use Value: Dual FTM modules provide complementary PWM with dead-time control; ADC synchronization ensures precise current reconstruction; USB enables field firmware updates without CAN tool dependency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MK50DN512ZCLL10 | Same 100-pin LQFP package, but 512 KB main flash, no FlexNVM, 128 KB SRAM - lacks FlexMemory EEPROM capability | Better suited for applications needing larger bootloaders or complex protocol stacks, but cannot emulate EEPROM without software overhead | Select MK50DN512ZCLL10 only if >256 KB program flash is mandatory and external EEPROM or flash emulation is acceptable |
| MK51DX256ZCLL7 | Same pinout and peripherals, but 72 MHz max frequency, 288 KB total flash (256 KB + 32 KB FlexNVM), 64 KB SRAM, 2 KB FlexRAM | Lower performance and reduced FlexRAM size limit high-cycle data logging; suitable for cost-sensitive, lower-throughput HMI | Choose MK51DX256ZCLL7 when 100 MHz processing and 4 KB EEPROM endurance are not required - reduces power and cost |
Compared with MK50DN512ZCLL10 and MK51DX256ZCLL7, MK50DX256ZCLL10 uniquely balances 100 MHz real-time performance, 256 KB FlexNVM for robust data logging, and 4 KB FlexRAM for 10M-cycle EEPROM replacement - making it optimal for field-deployed devices requiring long-term data integrity without external components.
Availability
MK50DX256ZCLL10 is available at Aetrix Electronics and suitable for industrial metering, portable medical instrumentation, building automation HMI, and motor control gateways requiring stable component supply, long lifecycle support, and verified automotive-grade reliability.
Supply support for MK50DX256ZCLL10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader delivering secure, scalable solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.
The MK50DX256ZCLL10 belongs to the Kinetis K50 family - designed specifically for low-power, mixed-signal applications demanding high-precision analog integration, USB connectivity, segment LCD support, and flexible memory architecture in industrial and medical edge devices.
FAQ
What is the maximum operating frequency and core type of MK50DX256ZCLL10?
MK50DX256ZCLL10 operates at a maximum CPU frequency of 100 MHz and uses an ARM Cortex-M4 core with DSP instruction set support. It does not include a hardware floating-point unit (FPU); the 'D' in the part number denotes DSP capability only. This configuration delivers 125 DMIPS of performance while maintaining low power consumption for real-time control and signal processing tasks in the MK50DX256ZCLL10.
Does MK50DX256ZCLL10 support USB device charger detection (DCD)?
Yes, MK50DX256ZCLL10 includes full USB On-The-Go (OTG) functionality with integrated Device Charger Detect (DCD) compliant with USB Battery Charging Specification v1.2. The MK50DX256ZCLL10 uses its on-chip USB transceiver and dedicated DCD logic to automatically identify standard downstream ports (SDP), charging downstream ports (CDP), and dedicated chargers (DCP) - enabling intelligent power management in portable MK50DX256ZCLL10-based designs.
How is FlexMemory allocated in MK50DX256ZCLL10, and what is its practical use?
MK50DX256ZCLL10 contains 256 KB FlexNVM and 4 KB FlexRAM. FlexRAM is factory-configured as 4 KB high-endurance EEPROM (10M write/erase cycles), while FlexNVM can be partitioned at runtime between additional program flash, data flash, or EEPROM backup. This allows MK50DX256ZCLL10 to eliminate external EEPROM in applications like smart meters where calibration data or usage logs require frequent, reliable nonvolatile writes without wear leveling overhead.
What analog peripherals are integrated into MK50DX256ZCLL10?
MK50DX256ZCLL10 integrates dual 16-bit SAR ADCs (ADC0 with 19 SE + 3 DP channels; ADC1 with 18 SE + 3 DP channels), two 12-bit DACs, three high-speed analog comparators (each with internal 6-bit DAC), two general-purpose op-amps, two transimpedance amplifiers, and a programmable voltage reference. These peripherals enable MK50DX256ZCLL10 to perform precision sensor signal conditioning, closed-loop control, and metrology-grade measurements without external signal chain components.
Is MK50DX256ZCLL10 pin-compatible with other K50 family members in the same package?
Yes, MK50DX256ZCLL10 is pin-for-pin compatible with all other K50 family devices in the 100-pin LQFP (LL) package, including MK50DN512ZCLL10 and MK51DX256ZCLL7. This compatibility allows hardware reuse across performance tiers - for example, upgrading from 72 MHz to 100 MHz or migrating from FlexNVM-based to larger main flash variants - without PCB redesign, provided peripheral pin assignments and power delivery meet the higher-spec variant's requirements.
MK50DX256ZCLL10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LQFP
- Series:
- Kinetis K50
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 59
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 34x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK50DX256ZCLL10 FAQ
1.How can I place an order for MK50DX256ZCLL10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK50DX256ZCLL10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK50DX256ZCLL10 reliable?
The price and inventory of MK50DX256ZCLL10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK50DX256ZCLL10 is usually 5 days.
3.What payment methods are accepted for MK50DX256ZCLL10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK50DX256ZCLL10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK50DX256ZCLL10?
MK50DX256ZCLL10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK50DX256ZCLL10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK50DX256ZCLL10?
For technical support, including MK50DX256ZCLL10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK50DX256ZCLL10 requirements.
6.How does Aetrix verify that MK50DX256ZCLL10 is sourced from the original manufacturer or authorized distributors?
All MK50DX256ZCLL10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK50DX256ZCLL10 meets industry standards.
7.What is the process for return or replacement of MK50DX256ZCLL10?
All MK50DX256ZCLL10 units undergo pre-shipment inspection (PSI). If there is an issue with MK50DX256ZCLL10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK50DX256ZCLL10 part is unused and in its original packaging.
Return procedure for MK50DX256ZCLL10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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