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NXP Semiconductors MK50DX256ZCLQ10
- Part No.:
- MK50DX256ZCLQ10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
MK50DX256ZCLQ10.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,768
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Product details
Overview
MK50DX256ZCLQ10 from NXP Semiconductors (formerly Freescale) is a 100 MHz ARM Cortex-M4 microcontroller with DSP extensions, 256 KB program flash, 256 KB FlexNVM, 64 KB SRAM, and 4 KB FlexRAM configured as EEPROM. It features dual 16-bit ADCs (21 SE + 3 DP channels), two 12-bit DACs, three analog comparators, two op-amps, two transimpedance amplifiers, USB OTG LS/FS with device charger detect, and segment LCD controller support-designed for low-power industrial HMI and sensor fusion applications.
For engineers reviewing the MK50DX256ZCLQ10 datasheet, MK50DX256ZCLQ10 pinout, MK50DX256ZCLQ10 application, or MK50DX256ZCLQ10 equivalent, key selection criteria include its 100 MHz Cortex-M4 core with DSP, FlexMemory partitioning capability, 144-pin LQFP package with 5 V-tolerant GPIO, -40°C to +85°C temperature range, and full-speed USB OTG with integrated voltage regulator and DCD logic.
Technical Context
The MK50DX256ZCLQ10 implements a 32-bit ARM Cortex-M4 core with hardware DSP instructions but no floating-point unit. Its memory subsystem integrates main program flash, FlexNVM (reconfigurable as data flash or EEPROM backup), and FlexRAM (used here as 4 KB high-endurance EEPROM), all programmable down to 1.71 V. The device supports concurrent code execution and firmware updates via independent flash banks.
Peripherals include two 16-bit SAR ADCs with differential pair support, dual 12-bit DACs, three high-speed analog comparators with integrated 6-bit DACs, two general-purpose op-amps, two transimpedance amplifiers, and a carrier modulator transmitter for IR waveform generation. Clocking uses MCG with FLL/PLL, 3–32 MHz crystal oscillator, and 32 kHz RTC oscillator.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4 @ 100 MHz with DSP instructions; enables real-time signal processing without external co-processor. |
| Flash Memory | 256 KB main program flash + 256 KB FlexNVM; allows bootloader storage in FlexNVM while preserving main flash for application code. |
| SRAM | 64 KB on-chip SRAM; sufficient for RTOS stacks, communication buffers, and intermediate signal processing data. |
| FlexRAM / EEPROM | 4 KB FlexRAM configured as EEPROM; supports byte-write/erase with >10M cycle endurance at full voltage/temperature range. |
| Analog Peripherals | Dual 16-bit ADCs (21 SE + 3 DP channels total), two 12-bit DACs, three analog comparators, two op-amps, two TRIAMPs; enables multi-sensor signal conditioning and closed-loop control. |
| USB Interface | Full-Speed/Low-Speed USB OTG with on-chip transceiver, 120 mA regulator, and Device Charger Detect (DCD); eliminates need for external USB PHY and charging detection circuitry. |
| Package & I/O | 144-pin LQFP (20 mm × 20 mm); 109 GPIO pins including 5 V-tolerant inputs, supporting direct interfacing with legacy 5 V logic and sensors. |
Pinout & Package
Package: 144-pin LQFP (20 mm × 20 mm), RoHS-compliant, moisture sensitivity level 3. Pinout validated per MK50DX256ZCLQ10 reference schematic and K50 Family Pin Multiplexing document Rev. 8.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA / VSSA | Analog power supply / ground | Separate analog domain for ADC/DAC/PGA; requires dedicated filtering to maintain 16-bit conversion accuracy. |
| ADC0_DP0 / ADC0_DM0 | Differential input pair for ADC0 | Supports noise-rejecting measurements; usable with external instrumentation amplifier or bridge sensor outputs. |
| USB0_DP / USB0_DM | USB differential data lines | Integrated full-speed transceiver; requires only series resistors and ESD protection-no external PHY needed. |
| PTA0–PTA31 | GPIO port A pins | 5 V-tolerant digital I/O; configurable as UART, SPI, I²C, or capacitive touch inputs via TSI module. |
| RTC_CLKIN | 32.768 kHz crystal input | Connects to external 32 kHz crystal for battery-backed real-time clock operation during low-power modes. |
Key Features
| Feature | Design Value |
|---|---|
| FlexMemory architecture | 256 KB FlexNVM + 4 KB FlexRAM enables field-upgradable bootloader storage and 10M-cycle EEPROM emulation without software overhead. |
| Dual 16-bit ADCs with PGA support | Simultaneous sampling of up to 21 single-ended or 3 differential sensor channels with programmable gain amplification for microvolt-level signal capture. |
| USB OTG with integrated DCD | Hardware-based USB device charger detection identifies wall adapters vs. PCs-enables smart battery charging without host enumeration delay. |
| 10 low-power operating modes | Includes VLPR (Very Low Power Run) at 4 MHz and LLS3 (Low-Leakage Stop) with RTC wake-up; extends battery life in portable HMIs beyond 5 years. |
| Segment LCD controller | Drives up to 320 segments; supports static, 2-, 3-, or 4-mux displays-eliminates external LCD driver IC in medical and industrial panel meters. |
Applications
| Industrial Panel Meter | Medical Patient Monitor |
|---|---|
Use Scenario: Standalone DIN-rail mounted meter measuring voltage, current, and power factor in 3-phase AC systems. IC Role / Device Role / Timing Role: Primary MCU executing real-time RMS calculations, driving 4-digit 7-segment display via integrated segment LCD controller, and logging data to internal FlexNVM. Use Value: Dual 16-bit ADCs enable ±0.1% measurement accuracy; FlexNVM stores calibration coefficients and 30-day waveform history without external memory. | Use Scenario: Bedside vital signs monitor acquiring ECG, SpO₂, and respiration signals with battery backup. IC Role / Device Role / Timing Role: Signal acquisition hub with simultaneous ADC sampling, digital filtering via DSP instructions, and USB HID interface for PC data export. Use Value: 100 MHz Cortex-M4 processes QRS detection algorithms in real time; 4 KB FlexRAM stores patient alarm thresholds with guaranteed 10M write cycles. |
| Smart Energy Gateway | Programmable Logic Controller (PLC) I/O Module |
Use Scenario: Sub-metering gateway aggregating consumption data from 16 smart meters via RS-485 and reporting via cellular modem. IC Role / Device Role / Timing Role: Communication concentrator managing multiple UARTs, SPI peripherals, and USB host for firmware updates. Use Value: Six UARTs (including ISO7816-capable) support legacy meter protocols; USB OTG DCD detects when service technician connects USB stick for field update. | Use Scenario: DIN-rail mounted digital I/O expansion module with 16 isolated inputs and 8 relay outputs. IC Role / Device Role / Timing Role: Real-time I/O controller running deterministic ladder logic via FreeRTOS, with watchdog supervision and EEPROM-backed configuration storage. Use Value: Hardware CRC engine validates firmware integrity on boot; FlexRAM stores user-defined I/O mapping tables with instant byte-write access. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MK50DN512ZCLQ10 | 512 KB main flash, no FlexNVM; same 144-LQFP package and peripheral set. | Better suited for large firmware images requiring secure boot and OTA updates, but lacks FlexMemory EEPROM flexibility. | Select when application demands larger program space over field-configurable nonvolatile data storage. |
| MK51DX256ZCLQ10 | Same flash/FlexRAM/SRAM sizes, but adds segment LCD controller with 32×8 segment drive capability. | Optimized for higher-resolution segmented displays (e.g., multimeter front panels), with identical analog and USB capabilities. | Select when display requirements exceed 24×8 segments and full LCD controller feature set is required. |
Compared with MK50DN512ZCLQ10 and MK51DX256ZCLQ10, the MK50DX256ZCLQ10 uniquely balances 256 KB program flash with 256 KB FlexNVM for bootloader/data partitioning and retains full analog/USB functionality in the 144-LQFP package-making it optimal for cost-sensitive, mixed-signal edge devices needing robust nonvolatile parameter storage.
Availability
MK50DX256ZCLQ10 is available at Aetrix Electronics and suitable for industrial HMI, medical monitoring, smart energy gateways, and PLC I/O modules requiring stable component supply across extended product lifecycles.
Supply support for MK50DX256ZCLQ10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The Kinetis K50 family was designed for low-power, mixed-signal applications demanding high-precision analog integration, USB connectivity, and flexible memory architecture-targeting industrial control, medical instrumentation, and human-machine interface systems.
FAQ
What is the maximum CPU frequency and core type of the MK50DX256ZCLQ10?
The MK50DX256ZCLQ10 features an ARM Cortex-M4 core rated at 100 MHz with hardware-accelerated DSP instructions. It does not include a floating-point unit (FPU). This configuration delivers 125 DMIPS of performance while maintaining low dynamic power consumption-ideal for real-time control and sensor signal processing in battery-powered or thermally constrained environments where the MK50DX256ZCLQ10 operates.
Does the MK50DX256ZCLQ10 support USB Device Charger Detection (DCD)?
Yes, the MK50DX256ZCLQ10 includes dedicated hardware logic for USB Device Charger Detect (DCD) compliant with USB Battery Charging Specification v1.2. This allows the MK50DX256ZCLQ10 to autonomously identify downstream charging ports (e.g., wall adapters vs. PCs) without host enumeration, enabling immediate high-current charging-critical for portable medical and industrial devices using the MK50DX256ZCLQ10.
How is FlexMemory configured on the MK50DX256ZCLQ10?
The MK50DX256ZCLQ10 integrates 256 KB FlexNVM and 4 KB FlexRAM. In this variant, FlexRAM is configured as high-endurance EEPROM (≥10M write/erase cycles), while FlexNVM serves as additional program or data flash. Configuration is done at runtime via FTFL registers-no hardware changes needed. This FlexMemory setup is factory-default for the MK50DX256ZCLQ10 and enables robust parameter storage without external EEPROM.
What analog peripherals are included in the MK50DX256ZCLQ10?
The MK50DX256ZCLQ10 includes two 16-bit SAR ADCs (ADC0 and ADC1) supporting up to 21 single-ended or 3 differential channels, two 12-bit DACs, three analog comparators (each with integrated 6-bit DAC), two general-purpose op-amps, and two transimpedance amplifiers. These peripherals are fully operational across the 1.71–3.6 V supply range and support simultaneous sampling-making the MK50DX256ZCLQ10 suitable for precision sensor interfaces.
What is the operating temperature range and package type of the MK50DX256ZCLQ10?
The MK50DX256ZCLQ10 is specified for operation from –40°C to +85°C and is housed in a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch). This package provides 109 GPIOs-including 5 V-tolerant inputs-and supports standard reflow soldering profiles. The industrial temperature grade and LQFP form factor make the MK50DX256ZCLQ10 appropriate for deployment in harsh environments without thermal derating.
MK50DX256ZCLQ10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- Kinetis K50
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 96
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 41x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK50DX256ZCLQ10 FAQ
1.How can I place an order for MK50DX256ZCLQ10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK50DX256ZCLQ10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK50DX256ZCLQ10 reliable?
The price and inventory of MK50DX256ZCLQ10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK50DX256ZCLQ10 is usually 5 days.
3.What payment methods are accepted for MK50DX256ZCLQ10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK50DX256ZCLQ10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK50DX256ZCLQ10?
MK50DX256ZCLQ10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK50DX256ZCLQ10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK50DX256ZCLQ10?
For technical support, including MK50DX256ZCLQ10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK50DX256ZCLQ10 requirements.
6.How does Aetrix verify that MK50DX256ZCLQ10 is sourced from the original manufacturer or authorized distributors?
All MK50DX256ZCLQ10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK50DX256ZCLQ10 meets industry standards.
7.What is the process for return or replacement of MK50DX256ZCLQ10?
All MK50DX256ZCLQ10 units undergo pre-shipment inspection (PSI). If there is an issue with MK50DX256ZCLQ10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK50DX256ZCLQ10 part is unused and in its original packaging.
Return procedure for MK50DX256ZCLQ10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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