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NXP Semiconductors MK51DX256CLK10

Part No.:
MK51DX256CLK10
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
80-LQFP
Datasheet:
AetrixMK51DX256CLK10.pdf
Description:
IC MCU 32BIT 256KB FLASH 80FQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,355

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Product details

Overview

MK51DX256CLK10 from NXP Semiconductors (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, designed for embedded control and signal processing in resource-constrained industrial and IoT edge nodes. It operates at up to 100 MHz, integrates 256 KB program flash and 4 KB FlexRAM, supports 1.71–3.6 V supply, and features dual 16-bit SAR ADCs with integrated PGA, two 12-bit DACs, and USB OTG - enabling closed-loop motor control and sensor fusion applications.

For engineers reviewing the MK51DX256CLK10 datasheet, MK51DX256CLK10 pinout, MK51DX256CLK10 application, or MK51DX256CLK10 equivalent, key selection considerations include its FlexMemory architecture (flash + FlexNVM), low-power stop modes down to 2.1 µA, 100 MHz real-time performance with DSP instructions, and integrated analog front-end for direct sensor interfacing without external signal conditioning.

Technical Context

The MK51DX256CLK10 implements a full-featured Kinetis K51 sub-family architecture centered on an ARM Cortex-M4 core with hardware DSP acceleration and single-cycle MAC operations. Its memory subsystem includes 256 KB on-chip flash with EEPROM emulation via FlexNVM, 4 KB FlexRAM, and up to 128 KB SRAM - all accessible under multiple low-power run/stop modes.

Peripherals are tightly coupled to the core via a multi-layer AHB bus matrix and supported by a 16-channel DMA controller. Clocking relies on a configurable multipurpose clock generator (MCG) supporting internal RC, external crystal (3–32 MHz), and 32 kHz RTC oscillator inputs - enabling precise timing for USB, PWM, and real-time control loops.

Key Specifications

Parameter Value and Actual Design Meaning
Core ARM Cortex-M4 with DSP extension, 100 MHz max - delivers 125 DMIPS and enables real-time filtering, FFT, and motor control algorithms in firmware.
Flash / FlexNVM 256 KB program flash + 256 KB FlexNVM - allows EEPROM-like data logging and parameter storage without external memory.
RAM 128 KB SRAM - sufficient for complex control stacks, communication buffers, and real-time OS operation.
Analog Peripherals Two 16-bit SAR ADCs (1 MSPS), each with PGA (x1–x64), two 12-bit DACs, three analog comparators with 6-bit DACs - supports high-precision sensor acquisition and actuator feedback.
Power Modes VLPS (1.12 mA), STOP (0.74 mA), VLLS3 (3.0 µA) - enables battery-powered operation for >1 year in wake-on-event sensor nodes.
Communication USB 2.0 Full/Low-Speed OTG, six UARTs, three SPIs, two I²C, SDHC, I²S - supports wired connectivity, fieldbus bridging, and audio/data streaming.
Operating Range 1.71–3.6 V supply, –40°C to +85°C ambient - suitable for industrial automation, smart meters, and automotive body electronics.

Pinout & Package

Package: 121-pin MAPBGA (8 mm × 8 mm, MC suffix). Pinout conforms to K51 Sub-Family standard assignment per Document K51P121M100SF2V2, Section 8.2. Key functional groups include dedicated USB DP/DM, multiple ADC/DAC channels mapped to specific port pins (e.g., ADC0_SE0–ADC0_SE15 on PORTA/PORTB), FlexIO-capable pins, and configurable clock inputs (EXTAL/XTAL, EXTAL32/XTAL32).

Pin/Terminal Circuit Role Design Meaning
VDD / VSS Digital power / ground Multiple dedicated pairs ensure stable core voltage delivery and noise isolation for mixed-signal operation.
VDDA / VSSA Analog power / ground Separate analog domain with ≤0.1 V differential tolerance - critical for 16-bit ADC accuracy and DAC monotonicity.
EXTAL / XTAL Main crystal oscillator input/output Supports 3–32 MHz crystals; enables precise system clock generation and USB timing compliance.
EXTAL32 / XTAL32 32 kHz RTC crystal input/output Enables calendar timekeeping and ultra-low-power wake-from-STOP using RTC alarm.
USB_DP / USB_DM USB 2.0 differential data lines Integrated transceiver eliminates external PHY; supports device/host/OTG roles with on-chip termination.
ADC0_SE0–SE15 Analog input channels 16 dedicated single-ended inputs across PORTA/PORTB; support simultaneous sampling with hardware trigger synchronization.

Key Features

Feature Design Value
FlexMemory architecture 256 KB flash + 256 KB FlexNVM enables wear-leveling and byte-write EEPROM emulation - eliminates need for external serial EEPROM in data-logging designs.
Low-leakage wakeup unit Supports selective pin-triggered wake from VLLS3 mode with <5 µA retention current - ideal for battery-backed security sensors and remote monitors.
Hardware CRC module Accelerates checksum calculation for firmware updates and communication packet validation - reduces CPU load and improves OTA reliability.
Segment LCD controller Drives up to 40×8 or 44×4 segments directly - enables cost-effective human interface in metering and HMI applications without display driver IC.
TSI touch interface Capacitive touch sensing with hardware charge-transfer measurement - supports up to 16 electrodes with <1 µA active current, suitable for low-power touch buttons.

Applications

Industrial Motor Control Smart Energy Metering

Use Scenario: Closed-loop PMSM/BLDC motor drive with current sensing, position feedback, and thermal monitoring.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm, synchronized ADC sampling, PWM generation with dead-time insertion, and CAN/UART telemetry.

Use Value: 100 MHz Cortex-M4 with DSP delivers >10 kHz current loop bandwidth; integrated dual ADCs enable simultaneous phase current capture; FlexRAM stores runtime tuning parameters.

Use Scenario: Polyphase electricity meter with metrology, tamper detection, and secure communication via PLC or RF.

IC Role / Device Role / Timing Role: High-accuracy energy computation engine, isolated communication interface controller, and secure boot manager for firmware integrity.

Use Value: 16-bit ADCs with PGA achieve Class 0.2 accuracy; hardware CRC ensures firmware update authenticity; RTC with VBAT backup maintains billing timestamp during mains failure.

Medical Sensor Hub Building Automation Node

Use Scenario: Wearable vital sign monitor aggregating ECG, SpO₂, and temperature data for Bluetooth LE transmission.

IC Role / Device Role / Timing Role: Analog front-end signal conditioner, digital filter processor, and low-power BLE host controller interface.

Use Value: Dual ADCs with programmable gain acquire microvolt-level biopotentials; VLPR mode draws 1.12 mA at 4 MHz - extends coin-cell life; TSI enables touch-based user control.

Use Scenario: HVAC zone controller with temperature/humidity sensing, valve actuation, and BACnet/IP or Modbus RTU gateway functionality.

IC Role / Device Role / Timing Role: Environmental data acquisition node, PID loop executor, and protocol translation bridge between field sensors and building management network.

Use Value: Integrated SDHC supports local firmware/log storage; six UARTs enable concurrent RS-485 Modbus and Wi-Fi/BLE module control; STOP mode current <1 µA enables battery backup during power outage.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MK51DN512CMC10 512 KB flash, no FlexNVM, same 100 MHz Cortex-M4 core and peripheral set - lacks EEPROM emulation capability. Better suited for applications requiring larger code space but no persistent nonvolatile data storage. Select when firmware size exceeds 256 KB and FlexNVM functionality is unnecessary.
KE1xF128LQ64 ARM Cortex-M0+ core, 128 KB flash, 16 KB RAM, lower power (1.9 µA VLLS), no USB OTG or FlexMemory - optimized for ultra-low-cost, ultra-low-power nodes. Targeted at simple sensor endpoints where DSP compute and USB connectivity are not required. Choose for cost-sensitive, battery-only applications with minimal processing needs and no host-facing interfaces.

Compared with MK51DX256CLK10, MK51DN512CMC10 trades FlexNVM for higher flash capacity while retaining identical real-time performance and analog integration; KE1xF128LQ64 reduces complexity and power at the expense of DSP capability, USB, and flexible nonvolatile storage - making it suitable only for simpler control tasks.

Availability

MK51DX256CLK10 is available at Aetrix Electronics and suitable for industrial motor control, smart energy metering, medical sensor hubs, and building automation nodes requiring stable component supply, long-term lifecycle support, and qualified automotive-grade variants.

Supply support for MK51DX256CLK10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.

The MK51DX256CLK10 belongs to the Kinetis K51 sub-family, engineered specifically for cost-sensitive industrial control and sensor processing applications demanding high analog integration, deterministic real-time response, and robust low-power operation.

FAQ

What is the maximum operating frequency and core type of the MK51DX256CLK10?

The MK51DX256CLK10 features an ARM Cortex-M4 core with DSP extensions, rated for operation up to 100 MHz across its specified temperature range (–40°C to +85°C). This frequency is achievable with proper decoupling, stable 1.71–3.6 V supply, and correct MCG configuration - delivering 125 DMIPS and enabling real-time signal processing tasks such as motor control and sensor fusion within the MK51DX256CLK10.

Does the MK51DX256CLK10 include on-chip EEPROM or data retention memory?

Yes, the MK51DX256CLK10 includes FlexNVM - a configurable memory block that can be partitioned to emulate EEPROM functionality. With 256 KB FlexNVM available, the MK51DX256CLK10 supports byte-write, wear-leveling, and data retention without external serial EEPROM, making it suitable for applications requiring frequent parameter updates like calibration data or event logs.

What analog peripherals are integrated into the MK51DX256CLK10?

The MK51DX256CLK10 integrates two independent 16-bit SAR ADCs (each with programmable gain amplifier up to x64), two 12-bit DACs, three analog comparators (each with integrated 6-bit DAC and reference selection), two operational amplifiers, two transimpedance amplifiers, and a precision voltage reference. These resources enable direct sensor interfacing and closed-loop analog control without external signal conditioning circuitry in the MK51DX256CLK10.

Which low-power modes does the MK51DX256CLK10 support, and what is the lowest current draw?

The MK51DX256CLK10 supports seven low-power modes including VLPR, VLPS, STOP, LLS, and three VLLS variants. In VLLS3 mode with RTC running from VBAT and selected wake sources enabled, the MK51DX256CLK10 achieves as low as 3.0 µA typical current draw at 3.0 V and –40°C to +25°C - enabling multi-year battery life in intermittent-sensing applications.

Is USB functionality available on the MK51DX256CLK10, and what type is supported?

Yes, the MK51DX256CLK10 includes a full-speed/low-speed USB 2.0 On-The-Go controller with an integrated transceiver. It supports device, host, and OTG roles, requires no external PHY, and provides on-chip termination and voltage regulation - allowing direct USB connectivity for firmware updates, data logging, or HID-class peripherals using the MK51DX256CLK10.

MK51DX256CLK10 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
80-LQFP
Series:
Kinetis K50
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
39
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 30x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MK51DX256CLK10 FAQ

1.How can I place an order for MK51DX256CLK10 through Aetrix?

Please submit a Request for Quotation (RFQ) for MK51DX256CLK10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MK51DX256CLK10 reliable?

The price and inventory of MK51DX256CLK10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK51DX256CLK10 is usually 5 days.

3.What payment methods are accepted for MK51DX256CLK10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK51DX256CLK10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MK51DX256CLK10?

MK51DX256CLK10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MK51DX256CLK10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MK51DX256CLK10?

For technical support, including MK51DX256CLK10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK51DX256CLK10 requirements.

6.How does Aetrix verify that MK51DX256CLK10 is sourced from the original manufacturer or authorized distributors?

All MK51DX256CLK10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK51DX256CLK10 meets industry standards.

7.What is the process for return or replacement of MK51DX256CLK10?

All MK51DX256CLK10 units undergo pre-shipment inspection (PSI). If there is an issue with MK51DX256CLK10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MK51DX256CLK10 part is unused and in its original packaging.

Return procedure for MK51DX256CLK10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MK51DX256CLK10 Tags

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