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NXP Semiconductors MK51DX256CLL10
- Part No.:
- MK51DX256CLL10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
MK51DX256CLL10.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:450
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Product details
Overview
MK51DX256CLL10 from NXP Semiconductors (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, operating at up to 100 MHz, featuring 256 KB on-chip flash memory and 128 KB RAM, integrated USB OTG controller, six UARTs, and dual 16-bit SAR ADCs - deployed in industrial sensor nodes requiring deterministic real-time control and low-power connectivity.
For engineers reviewing the MK51DX256CLL10 datasheet, MK51DX256CLL10 pinout, MK51DX256CLL10 application, or MK51DX256CLL10 equivalent, key selection criteria include its FlexMemory architecture (256 KB flash + 4 KB FlexRAM), -40°C to +85°C temperature grade, 100 LQFP (14 mm × 14 mm) package, and support for USB full/low-speed On-The-Go with integrated transceiver.
Technical Context
The MK51DX256CLL10 implements an ARM Cortex-M4 core with hardware DSP instructions and single-cycle MAC, paired with a multi-purpose clock generator supporting crystal oscillators at 3–32 MHz and 32 kHz. Its memory subsystem includes non-volatile FlexNVM (not present in this variant) and dedicated FlexRAM for EEPROM-like data retention without external components.
System-level features include a 16-channel DMA controller servicing 63 request sources, memory protection unit (MPU) with multi-master arbitration, and eight low-power modes - including VLLS1/VLLS2/VLLS3 - enabling sub-5 μA stop-mode current at 3.0 V while retaining RAM and RTC functionality.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4 with DSP, 100 MHz max - delivers 125 DMIPS for real-time signal processing in motor control or audio applications. |
| Flash Memory | 256 KB program flash - sufficient for complex firmware with bootloader, communication stacks, and application logic in a single chip. |
| RAM | 128 KB SRAM - supports large buffers for USB, SDHC, or I2S streaming without external memory. |
| Supply Voltage | 1.71–3.6 V - enables direct interfacing with Li-ion battery systems (3.0–3.7 V) and industrial 3.3 V rails without level-shifting. |
| Temperature Range | -40°C to +85°C - qualified for extended industrial environments including factory automation and building controls. |
| USB Interface | Full-/low-speed On-The-Go with on-chip transceiver - eliminates external PHY, reducing BOM cost and PCB area for device-side USB connectivity. |
| Analog Peripherals | Dual 16-bit SAR ADCs with PGA (×64), two 12-bit DACs, two op-amps, three comparators - enables high-precision sensor signal conditioning and closed-loop analog control. |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm), RoHS-compliant, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Digital power supply and ground | Decoupling required per pin group; supports simultaneous operation of multiple peripherals at 100 MHz. |
| VDDA, VSSA | Analog power supply and ground | Isolated analog domain with ≤0.1 V differential tolerance vs. digital rail - critical for ADC/DAC accuracy. |
| EXTAL, XTAL | Main crystal oscillator inputs | Supports 3–32 MHz crystals; internal load capacitance configurable for precision timing in communication protocols. |
| USB_DP, USB_DM | USB differential data lines | On-chip transceiver eliminates external PHY; requires 27 Ω series resistors and proper impedance-controlled routing. |
| PTA0–PTA31, PTB0–PTB17, etc. | GPIO with multiplexed peripheral functions | Each port supports interrupt-on-change, slew rate control, and configurable pull-up/down - enables flexible board design with shared pins. |
Key Features
| Feature | Design Value |
|---|---|
| FlexRAM (4 KB) | Emulates EEPROM via software-controlled wear leveling - retains data across power cycles without external serial EEPROM. |
| Low-leakage wakeup unit | Enables wake-from-VLLS3 in <92 μs with sub-3 μA quiescent current - ideal for battery-powered wireless sensors with long sleep intervals. |
| Hardware CRC module | Accelerates checksum computation for firmware updates and communication packet validation - offloads CPU and ensures deterministic latency. |
| Segment LCD controller | Drives up to 40×8 or 44×4 segments - supports standalone human-machine interface in medical or industrial displays without external driver IC. |
| TSI (Touch Sensor Interface) | Capacitive touch sensing on up to 16 channels with automatic calibration - enables robust button/slider implementation in noisy industrial environments. |
Applications
| Industrial Motor Control | Medical Sensor Hub |
|---|---|
Use Scenario: Closed-loop BLDC motor drive with current sensing, position feedback, and field-oriented control (FOC) execution. IC Role / Device Role / Timing Role: Real-time execution host for FOC algorithm, PWM generation, ADC sampling synchronization, and CAN/UART diagnostics. Use Value: 100 MHz Cortex-M4 with DSP delivers >125 DMIPS to compute FOC in <5 μs per cycle; dual ADCs sample phase currents simultaneously with <1 μs inter-channel skew. | Use Scenario: Portable vital sign monitor aggregating ECG, SpO₂, and temperature data with local display and Bluetooth LE gateway interface. IC Role / Device Role / Timing Role: Central sensor fusion processor with analog front-end conditioning, LCD display driver, and USB/UART host for firmware updates. Use Value: Integrated 16-bit ADCs with PGA achieve 16-bit ENOB for ECG signal acquisition; 4 KB FlexRAM stores calibrated sensor offsets without external NVM. |
| Smart Building Controller | Energy Metering Node |
Use Scenario: HVAC zone controller managing temperature, humidity, CO₂, and valve actuation via Modbus RTU over RS-485. IC Role / Device Role / Timing Role: Fieldbus protocol stack executor, analog sensor interface, and real-time scheduler for multi-sensor polling and actuator timing. Use Value: Six UARTs enable concurrent RS-485 (Modbus), debug console, and wireless module interface; low-power stop modes extend battery life in wireless variants. | Use Scenario: DIN-rail mounted electricity meter performing RMS voltage/current calculation, harmonic analysis, and tamper detection. IC Role / Device Role / Timing Role: High-accuracy metrology engine with synchronized ADC sampling, FFT acceleration, and secure firmware update via USB. Use Value: Dual 16-bit ADCs with programmable gain support ±0.1% RMS accuracy; hardware CRC ensures integrity of calibration constants stored in FlexRAM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Kinetis K22F512VLH12 | ARM Cortex-M4F (FPU), 120 MHz, 512 KB flash, no FlexMemory, different pinout (100 LQFP same footprint but signal mapping differs) | Lacks FlexRAM and segment LCD controller; adds FPU for floating-point math - better for advanced filtering but less suited for EEPROM emulation or display integration. | Select when floating-point performance outweighs EEPROM emulation needs and display integration is handled externally. |
| STM32F405RGT6 | ARM Cortex-M4F, 168 MHz, 1 MB flash, 192 KB RAM, no FlexMemory, different package (64 LQFP) | Higher clock speed and memory, but lacks integrated USB transceiver and TSI; requires external PHY and touch controller for equivalent functionality. | Choose for higher throughput applications where external components are acceptable and USB transceiver integration is not required. |
Compared with MK51DX256CLL10, K22F512VLH12 offers FPU and higher clock speed but removes FlexRAM and LCD controller - trading embedded data persistence and HMI integration for raw compute. STM32F405RGT6 provides greater memory and speed but increases BOM complexity due to missing on-chip USB transceiver and TSI.
Availability
MK51DX256CLL10 is available at Aetrix Electronics and suitable for industrial motor control, smart building controllers, energy metering nodes, and portable medical devices requiring stable component supply across extended product lifecycles.
Supply support for MK51DX256CLL10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.
The Kinetis K51 family targets cost-sensitive industrial and consumer applications requiring high analog integration, low-power operation, and USB connectivity - designed specifically for sensor hubs, motor drives, and smart edge devices.
FAQ
What is the maximum operating frequency of the MK51DX256CLL10?
The MK51DX256CLL10 operates at up to 100 MHz using its ARM Cortex-M4 core with DSP extensions. This frequency is supported across the full voltage range (1.71–3.6 V) and temperature range (-40°C to +85°C), with timing validated under FEI and FEE MCG modes per the K51P121M100SF2V2 datasheet.
Does the MK51DX256CLL10 include an integrated USB transceiver?
Yes, the MK51DX256CLL10 integrates a full-/low-speed USB On-The-Go controller with an on-chip transceiver, eliminating the need for an external PHY. This is confirmed in the "Communication interfaces" section of the K51 Sub-Family Data Sheet (Rev. 3, 6/2013), and applies directly to the MK51DX256CLL10 variant.
What type of memory architecture does the MK51DX256CLL10 use?
The MK51DX256CLL10 uses a FlexMemory architecture with 256 KB of program flash memory and 4 KB of FlexRAM. It does not include FlexNVM. This configuration enables EEPROM-like data storage in FlexRAM while reserving flash for code execution - a key differentiator from non-FlexMemory K51 variants like MK51DN512.
Which analog peripherals are integrated into the MK51DX256CLL10?
The MK51DX256CLL10 integrates two 16-bit SAR ADCs with integrated PGAs (up to ×64 gain), two 12-bit DACs, two operational amplifiers, two transimpedance amplifiers, three analog comparators (each with a 6-bit DAC and programmable reference), and a voltage reference module - all documented in Section 6.6 of the K51P121M100SF2V2 datasheet.
What package and pin count does the MK51DX256CLL10 use?
The MK51DX256CLL10 uses a 100-pin LQFP package (14 mm × 14 mm), identified by the "LL" suffix in its part number per the K51 Sub-Family Data Sheet's package identifier table. Pin assignments and multiplexing are detailed in Section 8 of document K51P121M100SF2V2.
MK51DX256CLL10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LQFP
- Series:
- Kinetis K50
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 59
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 35x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK51DX256CLL10 FAQ
1.How can I place an order for MK51DX256CLL10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK51DX256CLL10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK51DX256CLL10 reliable?
The price and inventory of MK51DX256CLL10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK51DX256CLL10 is usually 5 days.
3.What payment methods are accepted for MK51DX256CLL10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK51DX256CLL10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK51DX256CLL10?
MK51DX256CLL10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK51DX256CLL10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK51DX256CLL10?
For technical support, including MK51DX256CLL10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK51DX256CLL10 requirements.
6.How does Aetrix verify that MK51DX256CLL10 is sourced from the original manufacturer or authorized distributors?
All MK51DX256CLL10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK51DX256CLL10 meets industry standards.
7.What is the process for return or replacement of MK51DX256CLL10?
All MK51DX256CLL10 units undergo pre-shipment inspection (PSI). If there is an issue with MK51DX256CLL10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK51DX256CLL10 part is unused and in its original packaging.
Return procedure for MK51DX256CLL10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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