NXP Semiconductors MK52DN512CMD10
- Part No.:
- MK52DN512CMD10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LBGA
- Datasheet:
-
MK52DN512CMD10.pdf
- Description:
- IC MCU 32B 512KB FLASH 144MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:790
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MK52DN512CMD10 from NXP Semiconductors (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, operating at up to 100 MHz, featuring 512 KB flash, 128 KB RAM, dual 16-bit SAR ADCs with integrated PGA, two 12-bit DACs, Ethernet MAC, USB OTG, six UARTs, and hardware cryptographic acceleration (AES, SHA-256, DES). It targets industrial control and connected gateway applications requiring real-time processing, secure communications, and mixed-signal interfacing.
For engineers reviewing the MK52DN512CMD10 datasheet, MK52DN512CMD10 pinout, MK52DN512CMD10 application, or MK52DN512CMD10 equivalent, key selection considerations include its 100 MHz Cortex-M4 core with FPU-capable instruction set, -40°C to +85°C temperature grade, LQFP-144 package, integrated IEEE 1588 timer for time-sensitive networking, and FlexBus interface for external memory expansion.
Technical Context
The MK52DN512CMD10 implements a multi-clock domain architecture with independent MCG (Multipurpose Clock Generator), 3–32 MHz main crystal oscillator, and 32 kHz RTC oscillator. Its system-level timing includes IEEE 1588 hardware timestamping, programmable delay block, and eight-channel PWM/motor control timer supporting center-aligned and dead-time insertion.
Security is enforced via hardware CRC, TRNG, and cryptographic engines supporting AES-128/256, SHA-1/256, MD5, and DES/3DES; memory protection uses an MPU with multi-master arbitration. Analog subsystem integration includes transimpedance amplifiers, operational amplifiers, and comparators with embedded 6-bit DACs for sensor signal conditioning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4 with DSP instructions, 100 MHz max - delivers deterministic real-time control and signal processing without external coprocessor. |
| Memory | 512 KB on-chip flash, 128 KB SRAM - supports large firmware images and real-time data buffering for protocol stacks and control algorithms. |
| ADC/DAC | Dual 16-bit SAR ADCs with x64 PGA, two 12-bit DACs - enables high-resolution sensor acquisition and analog output generation in single-chip industrial I/O. |
| Communication | Ethernet MAC (MII/RMII), USB OTG, 6× UART, 3× SPI, 2× I²C, SDHC, I²S - provides full connectivity for edge gateways and networked controllers. |
| Security | Hardware AES-256, SHA-256, TRNG, CRC - accelerates secure boot, encrypted communication, and firmware integrity verification in resource-constrained deployments. |
| Operating Range | 1.71–3.6 V supply, -40°C to +85°C ambient - suitable for unregulated industrial power rails and extended-temperature environments. |
| Timers | IEEE 1588 timer, 8-channel PWM, 2× quadrature decoder, RTC - supports precision motor control, time-synchronized distributed systems, and low-power wake-up scheduling. |
Pinout & Package
Package: 144-pin LQFP (20 mm × 20 mm), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Digital power/ground | Primary 1.71–3.6 V supply domain; multiple pins ensure low-impedance routing and noise immunity for high-speed core operation. |
| VDDA, VSSA | Analog power/ground | Isolated analog supply domain with ≤0.1 V differential tolerance - critical for ADC/DAC accuracy and noise-sensitive analog front-end stability. |
| EXTAL/XTAL | Main crystal oscillator input/output | 3–32 MHz crystal connection point; internal load capacitors configurable - enables precise system clock generation without external components. |
| EXTAL32/XTAL32 | 32 kHz RTC crystal input/output | Low-frequency crystal interface for battery-backed real-time clock with <1 ppm drift - supports accurate timekeeping during deep-sleep modes. |
| ENET_RXD0–3, TXD0–3, REF_CLK, CRS_DV, TX_EN | Ethernet PHY interface signals | MII/RMII-compliant pins for direct connection to external Ethernet PHY - eliminates need for glue logic in industrial Ethernet node designs. |
| USB_DP/DM | USB 2.0 full/low-speed differential pair | On-chip transceiver with integrated termination - enables USB device/host functionality without external PHY or resistors. |
| ADC0_SE0–15, ADC1_SE0–15 | Analog input channels | Up to 32 single-ended or 16 differential inputs across two ADCs - supports simultaneous sampling of multiple sensors in closed-loop control systems. |
| PTE0–PTE31, PTB0–PTB15, etc. | GPIO with multiplexed peripherals | Configurable digital I/O supporting UART, SPI, I²C, PWM, TSI, and interrupt functions - allows flexible board layout and dynamic peripheral assignment. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware encryption engine | Accelerates AES-256, SHA-256, and RSA signature verification in <100 µs - reduces CPU overhead for TLS handshake and secure firmware updates. |
| FlexBus external bus interface | 8/16-bit parallel interface with wait-state control - enables direct connection to NOR/NAND flash, SRAM, or FPGA-based co-processors without address translation logic. |
| Low-leakage wakeup unit | Sub-µA wake-from-VLLS3 latency <23 µs - supports battery-powered field devices requiring rapid response to external events while maintaining multi-year shelf life. |
| Programmable gain amplifier (PGA) | Integrated x1–x64 gain stages per ADC channel - eliminates external op-amp stages for millivolt-level sensor signals like thermocouples or strain gauges. |
| IEEE 1588 hardware timestamping | Sub-100 ns precision timestamp capture on Ethernet frames - enables deterministic time synchronization in industrial automation networks without software jitter. |
Applications
| Industrial Ethernet Gateway | Secure Edge Controller |
|---|---|
Use Scenario: Aggregating Modbus RTU/ASCII field devices and bridging to EtherNet/IP or PROFINET over managed switch infrastructure. IC Role / Device Role / Timing Role: Primary application processor executing protocol stack translation, real-time packet forwarding, and IEEE 1588 time synchronization. Use Value: Integrated Ethernet MAC + hardware timestamping eliminates external PHY timing skew; 512 KB flash stores dual protocol stacks and configuration database. | Use Scenario: Localized PLC-style logic execution in hazardous-area enclosures with remote OTA firmware updates and tamper detection. IC Role / Device Role / Timing Role: Secure runtime environment with hardware-enforced memory isolation, encrypted code execution, and trusted boot chain validation. Use Value: On-die AES-256 and SHA-256 accelerate signed firmware verification; 128 KB RAM buffers encrypted OTA payloads without external DRAM. |
| Multi-Sensor Data Logger | Motor Drive Interface Module |
Use Scenario: Battery-powered environmental monitoring node acquiring temperature, humidity, pressure, and gas concentration with local preprocessing. IC Role / Device Role / Timing Role: Mixed-signal acquisition hub with simultaneous ADC sampling, PGA gain adjustment, and low-power RTC-triggered wake cycles. Use Value: Dual 16-bit ADCs with x64 PGA resolve µV-level sensor outputs directly; VLLS3 current <23 µA extends 10-year battery life. | Use Scenario: Compact servo drive add-on board providing position feedback decoding, PWM generation, and current sensing for BLDC motors. IC Role / Device Role / Timing Role: Real-time motion controller with quadrature decoder, 8-channel complementary PWM, and fast ADC for current loop closure. Use Value: Hardware quadrature decoder offloads CPU from position counting; 100 MHz core executes PID loops at 20 kHz with <500 ns jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Kinetis K64F120M | Same Kinetis K series, 120 MHz Cortex-M4F, 1 MB flash, 256 KB RAM, no Ethernet MAC, adds FPU and higher-speed USB HS | Better floating-point performance and larger memory, but lacks integrated Ethernet - requires external PHY for wired connectivity | Select when floating-point math dominates workload and Ethernet is not required; verify PCB layout for different pinout and thermal profile. |
| STM32H743VI | ARM Cortex-M7, 480 MHz, 2 MB flash, 1 MB RAM, dual-core option, no hardware IEEE 1588, supports Ethernet with external PHY | Higher compute throughput and memory bandwidth, but lacks dedicated 1588 timestamping and integrated crypto acceleration for SHA-256/AES | Choose for AI inference or video preprocessing where raw MIPS outweighs deterministic timing; add external PHY and crypto IC if needed. |
Compared with K64F120M and STM32H743VI, the MK52DN512CMD10 uniquely balances 100 MHz deterministic real-time control, integrated Ethernet with IEEE 1588, and hardware-accelerated cryptography - making it optimal for time-critical, secure, wired edge nodes where BOM count and timing predictability are design constraints.
Availability
MK52DN512CMD10 is available at Aetrix Electronics and suitable for industrial automation, smart grid metering, and building management systems requiring stable component supply, long lifecycle support, and qualified automotive-grade reliability.
Supply support for MK52DN512CMD10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.
The MK52DN512CMD10 belongs to the Kinetis K52 sub-family, designed specifically for industrial Ethernet-connected devices requiring real-time control, robust security, and high-precision analog integration in harsh environments.
FAQ
What is the maximum operating frequency and core type of the MK52DN512CMD10?
The MK52DN512CMD10 features an ARM Cortex-M4 core with DSP extensions, rated for operation up to 100 MHz across its specified voltage and temperature range. This frequency is achievable with the internal MCG configured in FEE mode using a 3–32 MHz crystal oscillator. The MK52DN512CMD10 does not include a floating-point unit (FPU); its DSP instruction set supports efficient fixed-point signal processing tasks common in motor control and sensor fusion.
Does the MK52DN512CMD10 support IEEE 1588 Precision Time Protocol (PTP)?
Yes, the MK52DN512CMD10 integrates dedicated IEEE 1588 hardware timestamping logic within its Ethernet MAC module. It captures transmit and receive timestamps with sub-100 ns resolution directly on the Ethernet frame boundary, enabling precise time synchronization without software intervention or CPU overhead. This capability is essential for deterministic industrial Ethernet protocols and is fully supported in the MK52DN512CMD10's silicon revision and driver stack.
What analog peripherals are integrated into the MK52DN512CMD10?
The MK52DN512CMD10 integrates two independent 16-bit SAR ADCs, each with a programmable gain amplifier (PGA) offering gains up to x64, two 12-bit DACs, two operational amplifiers, two transimpedance amplifiers, three analog comparators (each with a 6-bit DAC and programmable reference), and a precision voltage reference. These resources enable complete analog front-end functionality for sensor conditioning, closed-loop control, and signal generation without external components.
What is the operating temperature range and supply voltage specification for the MK52DN512CMD10?
The MK52DN512CMD10 is rated for operation from -40°C to +85°C ambient temperature and supports a single-supply voltage range of 1.71 V to 3.6 V for both digital and analog domains. The VDD-to-VDDA differential must remain within ±0.1 V, and the device maintains full functionality-including ADC accuracy, Ethernet timing, and cryptographic operations-across this entire range, as verified in the K52 Sub-Family Data Sheet Rev. 3.
How does the MK52DN512CMD10 handle low-power operation in battery-powered applications?
The MK52DN512CMD10 offers seven low-power modes including VLLS1–VLLS3, with VLLS3 achieving typical current consumption of 3.0 µA at 3.0 V and -40°C to 25°C. Wake-up latency from VLLS3 is under 23 µs, and the low-leakage wakeup unit supports GPIO, RTC alarm, and analog comparator triggers. The MK52DN512CMD10 also includes a dedicated VBAT domain for RTC retention at <0.22 µA, enabling decade-long battery life in data loggers and remote sensors.
MK52DN512CMD10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LBGA
- Series:
- Kinetis K50
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 96
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 41x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK52DN512CMD10 FAQ
1.How can I place an order for MK52DN512CMD10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK52DN512CMD10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK52DN512CMD10 reliable?
The price and inventory of MK52DN512CMD10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK52DN512CMD10 is usually 5 days.
3.What payment methods are accepted for MK52DN512CMD10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK52DN512CMD10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK52DN512CMD10?
MK52DN512CMD10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK52DN512CMD10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK52DN512CMD10?
For technical support, including MK52DN512CMD10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK52DN512CMD10 requirements.
6.How does Aetrix verify that MK52DN512CMD10 is sourced from the original manufacturer or authorized distributors?
All MK52DN512CMD10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK52DN512CMD10 meets industry standards.
7.What is the process for return or replacement of MK52DN512CMD10?
All MK52DN512CMD10 units undergo pre-shipment inspection (PSI). If there is an issue with MK52DN512CMD10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK52DN512CMD10 part is unused and in its original packaging.
Return procedure for MK52DN512CMD10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MK52DN512CMD10 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

