NXP Semiconductors MK52DN512ZCLQ10
- Part No.:
- MK52DN512ZCLQ10
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
MK52DN512ZCLQ10.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MK52DN512ZCLQ10 from NXP Semiconductors (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, operating at up to 100 MHz, featuring 512 KB on-chip flash, 128 KB RAM, and integrated Ethernet, USB OTG, dual 16-bit ADCs, and hardware crypto acceleration. It targets industrial control and connected edge nodes requiring deterministic real-time response and secure connectivity.
For engineers reviewing the MK52DN512ZCLQ10 datasheet, MK52DN512ZCLQ10 pinout, MK52DN512ZCLQ10 application, or MK52DN512ZCLQ10 equivalent, key selection criteria include its 100 MHz Cortex-M4 core with IEEE 1588 timing support, FlexBus external memory interface, 144-pin LQFP package, -40°C to +85°C temperature grade, and integrated security modules (AES/SHA-256/CRC/RNG).
Technical Context
The MK52DN512ZCLQ10 implements a full-featured Kinetis K52 sub-family architecture with dual 16-bit SAR ADCs each incorporating programmable gain amplifiers (up to ×64), two 12-bit DACs, and three analog comparators with integrated 6-bit DACs. Its clock system includes 3–32 MHz and 32 kHz crystal oscillators plus a multi-purpose clock generator supporting dynamic frequency scaling.
System-level integration includes an Ethernet MAC with MII/RMII and hardware IEEE 1588 timestamping, USB full-/low-speed On-The-Go controller with on-chip transceiver, six UARTs, three SPIs, two I²Cs, SDHC, and I²S - all managed via a 16-channel DMA controller supporting 63 request sources and coordinated by a memory protection unit with multi-master protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4 with DSP instructions, 100 MHz max - delivers 125 DMIPS for real-time signal processing in motor control or sensor fusion. |
| Memory | 512 KB program flash, 128 KB RAM - sufficient for complex protocol stacks (e.g., TCP/IP + TLS) and firmware-over-the-air updates. |
| Analog Peripherals | Dual 16-bit SAR ADCs (with PGA up to ×64), two 12-bit DACs, three analog comparators - enables high-precision sensor acquisition and closed-loop analog control without external signal conditioning. |
| Communication | Ethernet MAC (MII/RMII), USB OTG, six UARTs, three SPIs, two I²Cs, SDHC, I²S - supports simultaneous wired connectivity, peripheral expansion, and audio/data streaming. |
| Security | Hardware AES/SHA-256/MD5/DES/3DES, CRC, RNG, 128-bit UID - accelerates cryptographic operations for secure boot, firmware authentication, and encrypted communication. |
| Operating Range | 1.71–3.6 V supply, -40°C to +85°C ambient - suitable for industrial environments with wide input voltage and thermal variation. |
| Package | 144-pin LQFP (20 mm × 20 mm) - provides robust mechanical mounting and accessible routing for high-pin-count mixed-signal designs. |
Pinout & Package
Package: 144-pin LQFP (20 mm × 20 mm), RoHS-compliant, moisture sensitivity level 3 (MSL3), lead-free reflow profile (260°C peak).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VSS, VSSA | Power and ground rails | Separate digital/analog supplies enable noise isolation; VDDA must track VDD within ±0.1 V for ADC/DAC accuracy. |
| EXTAL/XTAL, EXTAL32/XTAL32 | Crystal oscillator inputs | Supports primary 3–32 MHz system clock and independent 32 kHz RTC clock - critical for time-sensitive applications like IEEE 1588 synchronization. |
| ENET_RXD0–3, ENET_TXD0–3, ENET_MDIO/MDC | Ethernet physical layer interface | Direct MII connection to external PHY; hardware timestamping registers allow sub-microsecond packet timing for industrial Ethernet protocols. |
| USB_DP/USB_DM | USB 2.0 differential data lines | On-chip transceiver eliminates external PHY; supports device/host/OTG roles - simplifies USB-based firmware update or HID interface design. |
| ADC0_SE0–15, ADC1_SE0–15 | Analog input channels | 32 total single-ended ADC inputs across two modules; each ADC integrates PGA and reference selection - reduces BOM count for precision measurement front-ends. |
| FLEXBUS_AD0–31, FLEXBUS_A0–23, FLEXBUS_OE/WE/CS | External memory bus signals | 8/16-bit parallel interface supporting NOR/NAND flash, SRAM, or FPGA co-processors - extends code/data space beyond on-chip memory limits. |
Key Features
| Feature | Design Value |
|---|---|
| IEEE 1588 Precision Time Protocol support | Hardware timestamping engine synchronizes networked devices to sub-microsecond accuracy - essential for distributed control systems and time-critical automation. |
| FlexBus external bus interface | Configurable 8/16-bit parallel bus with programmable wait states - enables direct attachment of legacy peripherals, FPGA accelerators, or external memory without glue logic. |
| Low-power modes with wake-up units | Multiple stop/very-low-leakage modes (e.g., VLLS1: 2.1 μA @ –40°C) and low-leakage wakeup unit - extends battery life in always-on edge sensors while retaining RTC and interrupt capability. |
| Integrated touch sensing interface (TSI) | Capacitive touch controller with hardware charge-transfer measurement - supports up to 16 self-capacitance or mutual-capacitance electrodes without external components. |
| Hardware encryption acceleration | Dedicated AES/SHA-256 engines offload CPU during TLS handshake or secure firmware update - reduces latency and power vs. software-only crypto. |
Applications
| Industrial Ethernet Gateway | Smart Sensor Node |
|---|---|
Use Scenario: Aggregating Modbus RTU fieldbus data and bridging to EtherNet/IP or PROFINET networks in factory automation. IC Role / Device Role / Timing Role: Primary MCU executing protocol stack, managing dual Ethernet interfaces (MII + RMII), and performing real-time packet timestamping via IEEE 1588 hardware. Use Value: Eliminates need for external Ethernet PHY and timing co-processor; 100 MHz Cortex-M4 handles concurrent protocol translation and diagnostics without performance bottleneck. | Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and gas concentration with wireless upload via cellular or LoRaWAN. IC Role / Device Role / Timing Role: System-on-chip integrating sensor ADC acquisition, low-power RTC wake-up scheduling, hardware AES encryption, and USB/UART debug interface. Use Value: Single-chip solution reduces PCB area and bill-of-materials; VLLS3 mode (3.1 μA) enables multi-year operation on coin-cell batteries. |
| Secure Firmware Update Terminal | Motor Control & Drive Interface |
Use Scenario: Field-deployed HMI panel receiving signed firmware images over USB or Ethernet and validating authenticity before flashing. IC Role / Device Role / Timing Role: Trusted execution environment using hardware RNG, SHA-256, and AES decryption to verify digital signatures and decrypt payloads prior to flash programming. Use Value: Prevents unauthorized firmware modification; cryptographic operations complete in microseconds - no perceptible delay during OTA update process. | Use Scenario: Closed-loop servo drive controlling PMSM motors with position feedback from encoders and current sensing via shunt resistors. IC Role / Device Role / Timing Role: Real-time controller running FOC algorithm, sampling dual ADCs at 1 MSps, generating PWM via eight-channel timer, and communicating via CAN or UART. Use Value: Integrated PGA and 16-bit ADC resolution resolve <1 mΩ shunt voltage; hardware quadrature decoder timers simplify encoder interface design. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| K64F120M120ACLR | 120 MHz Cortex-M4F with FPU, 1 MB flash, 256 KB RAM, same 144-LQFP package | Better floating-point performance for advanced motor control or audio DSP; larger memory for complex GUI or protocol stacks | Select when FPU-enabled math or >512 KB flash is required; pin-compatible but requires updated flash layout and clock configuration. |
| STM32H743VIT6 | 480 MHz Cortex-M7, dual-core option, 2 MB flash, 1 MB RAM, 100-pin LQFP (smaller footprint) | Higher compute throughput for AI inference or video preprocessing; lacks integrated Ethernet MAC with IEEE 1588 | Choose for maximum performance per watt where Ethernet timestamping is not mandatory; requires redesign due to different pinout and peripheral mapping. |
Compared with K64F120M120ACLR, MK52DN512ZCLQ10 offers identical package and peripheral compatibility but lower clock speed and memory - ideal for cost-sensitive industrial gateways. Versus STM32H743VIT6, it trades raw performance for deterministic IEEE 1588 timing and simpler migration from legacy Kinetis designs.
Availability
MK52DN512ZCLQ10 is available at Aetrix Electronics and suitable for industrial automation, smart metering, and embedded networking applications requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability validation.
Supply support for MK52DN512ZCLQ10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.
The MK52DN512ZCLQ10 belongs to the Kinetis K52 family, designed specifically for industrial Ethernet edge nodes requiring integrated timing precision (IEEE 1588), hardware security, and mixed-signal flexibility in harsh environments.
FAQ
What is the maximum operating frequency and core type of the MK52DN512ZCLQ10?
The MK52DN512ZCLQ10 features an ARM Cortex-M4 core with DSP extensions, rated for up to 100 MHz operation. This delivers 1.25 Dhrystone MIPS per MHz (125 DMIPS), enabling efficient execution of real-time control algorithms, communication stacks, and signal processing tasks without external co-processors. The MK52DN512ZCLQ10 achieves this performance within its specified 1.71–3.6 V supply and -40°C to +85°C temperature range.
Does the MK52DN512ZCLQ10 support IEEE 1588 Precision Time Protocol?
Yes, the MK52DN512ZCLQ10 includes dedicated hardware for IEEE 1588 timestamping within its Ethernet MAC module. It supports both MII and RMII interfaces and provides hardware capture of transmit/receive packet timestamps with sub-microsecond resolution - critical for time-synchronized industrial automation, power grid monitoring, and distributed test systems. This capability is intrinsic to the MK52DN512ZCLQ10 and requires no external timing ICs.
What analog peripherals are integrated into the MK52DN512ZCLQ10?
The MK52DN512ZCLQ10 integrates two independent 16-bit SAR ADCs, each with a programmable gain amplifier (PGA) offering gains up to ×64, two 12-bit DACs, three analog comparators (each with a built-in 6-bit DAC and programmable reference), two operational amplifiers, two transimpedance amplifiers, and a precision voltage reference. These resources enable high-fidelity sensor interfacing, closed-loop analog control, and mixed-signal signal conditioning directly on the MK52DN512ZCLQ10 die.
What security features does the MK52DN512ZCLQ10 provide?
The MK52DN512ZCLQ10 includes hardware-accelerated cryptographic modules supporting AES (128/192/256), DES, 3DES, SHA-1, SHA-256, and MD5; a hardware random number generator (RNG); a cyclic redundancy check (CRC) engine; and a unique 128-bit chip identification number. These features enable secure boot, firmware authentication, encrypted communication, and tamper-resistant key storage - all implemented in dedicated silicon within the MK52DN512ZCLQ10 to minimize software overhead and attack surface.
What package type and pin count does the MK52DN512ZCLQ10 use?
The MK52DN512ZCLQ10 is housed in a 144-pin LQFP package (20 mm × 20 mm body, 0.5 mm pitch), designated by the 'LQ' suffix in its part number. This package provides full access to all peripherals including Ethernet, USB, FlexBus, and dual ADC channels, while maintaining manufacturability in standard SMT assembly lines. The MK52DN512ZCLQ10's pin assignment aligns with the Kinetis K52 family's signal multiplexing scheme documented in the official datasheet.
MK52DN512ZCLQ10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- Kinetis K50
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 96
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 41x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK52DN512ZCLQ10 FAQ
1.How can I place an order for MK52DN512ZCLQ10 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK52DN512ZCLQ10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK52DN512ZCLQ10 reliable?
The price and inventory of MK52DN512ZCLQ10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK52DN512ZCLQ10 is usually 5 days.
3.What payment methods are accepted for MK52DN512ZCLQ10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK52DN512ZCLQ10 transactions.
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4.How is shipping managed for MK52DN512ZCLQ10?
MK52DN512ZCLQ10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK52DN512ZCLQ10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK52DN512ZCLQ10?
For technical support, including MK52DN512ZCLQ10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK52DN512ZCLQ10 requirements.
6.How does Aetrix verify that MK52DN512ZCLQ10 is sourced from the original manufacturer or authorized distributors?
All MK52DN512ZCLQ10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK52DN512ZCLQ10 meets industry standards.
7.What is the process for return or replacement of MK52DN512ZCLQ10?
All MK52DN512ZCLQ10 units undergo pre-shipment inspection (PSI). If there is an issue with MK52DN512ZCLQ10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK52DN512ZCLQ10 part is unused and in its original packaging.
Return procedure for MK52DN512ZCLQ10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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