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NXP Semiconductors MK53DX256CMD10

Part No.:
MK53DX256CMD10
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
144-LBGA
Datasheet:
AetrixMK53DX256CMD10.pdf
Description:
IC MCU 32B 256KB FLASH 144MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,811

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Product details

Overview

MK53DX256CMD10 from NXP Semiconductors (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extension, designed for embedded control applications requiring integrated analog, security, and connectivity. It features 256 KB program flash + 256 KB FlexNVM + 4 KB FlexRAM + 128 KB SRAM, operates from 1.71–3.6 V at –40 to +85°C, and delivers 125 DMIPS @ 100 MHz - used in industrial HMI, smart metering, and secure IoT edge nodes.

For engineers reviewing the MK53DX256CMD10 datasheet, MK53DX256CMD10 pinout, MK53DX256CMD10 application, or MK53DX256CMD10 equivalent, key selection criteria include its FlexMemory architecture, hardware AES/SHA-256 acceleration, dual 16-bit ADCs with PGA, Ethernet + USB OTG + SDHC interfaces, and support for low-power stop modes down to 2.1 µA (VLLS1).

Technical Context

This Kinetis K53-series MCU integrates an ARM Cortex-M4 core with floating-point unit disabled (D-series), FlexMemory enabling EEPROM-like wear leveling in FlexNVM, and a multi-layer AHB bus matrix supporting concurrent access to flash, RAM, and peripherals. Its clock system combines a 3–32 MHz main crystal oscillator, 32 kHz RTC oscillator, and MCG with FLL/PLL for precise frequency synthesis up to 100 MHz.

The device implements a full peripheral suite including IEEE 1588-capable Ethernet MAC, USB full-speed OTG with on-chip transceiver, six UARTs, three SPIs, two I²Cs, SDHC, I²S, and a segment LCD controller supporting up to 44×4 segments - all managed via a 16-channel DMA controller and memory protection unit (MPU) for safety-critical operation.

Key Specifications

Parameter Value and Actual Design Meaning
Core ARM Cortex-M4 with DSP instructions, no FPU - enables deterministic real-time control and signal processing without floating-point overhead.
Max Clock Frequency 100 MHz - delivers 125 DMIPS performance, sufficient for motor control loops, protocol stacks, and sensor fusion.
Flash / FlexNVM / RAM 256 KB program flash + 256 KB FlexNVM + 4 KB FlexRAM + 128 KB SRAM - FlexNVM allows emulated EEPROM with configurable sector sizes and wear leveling.
Analog Peripherals Dual 16-bit SAR ADCs (each with x64 PGA), two 12-bit DACs, two op-amps, three analog comparators with 6-bit DACs - supports precision sensor conditioning and closed-loop analog control.
Security Modules Hardware AES-128/256, DES/3DES, SHA-1/256, MD5, CRC-32, RNG, and 128-bit unique ID - enables secure boot, firmware authentication, and encrypted data storage.
Communication Interfaces Ethernet MAC (MII/RMII), USB 2.0 FS OTG, SDHC, I²S, six UARTs, three SPIs, two I²Cs - supports wired connectivity, multimedia, and multi-protocol fieldbus integration.
Low-Power Modes VLLS1/VLLS2/VLLS3 stop modes drawing 2.1–23 µA - enables battery-powered operation with fast wake-up (<130 µs) and RTC+LPWU retention.

Pinout & Package

Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal Circuit Role Design Meaning
VDD / VSS Digital power supply / ground Multiple dedicated pairs ensure stable core voltage delivery and noise isolation across high-speed digital domains.
VDDA / VSSA Analog power supply / ground Separate analog rail (1.71–3.6 V) with ≤0.1 V differential vs. VDD - critical for ADC/DAC accuracy and noise-sensitive analog modules.
EXTAL / XTAL Main crystal oscillator input/output Supports 3–32 MHz fundamental-mode crystals - provides primary clock source for CPU, bus, and peripheral timing.
EXTAL32 / XTAL32 32 kHz RTC crystal input/output Enables autonomous real-time clock operation during ultra-low-power stop modes (VLLSx) with battery backup capability.
USB_DP / USB_DM USB 2.0 full-speed differential pair On-chip transceiver eliminates external PHY; supports host/device/OTG roles with suspend/resume and battery charging detection.
ENET_RXD0–3 / TXD0–3 / CRS_DV / RX_ER / TX_EN / TX_CLK / REF_CLK Ethernet MAC physical interface Full MII interface; RMII supported via pin multiplexing - enables direct connection to external PHY without glue logic.

Key Features

Feature Design Value
FlexMemory Architecture 256 KB FlexNVM + 4 KB FlexRAM enables byte-erasable, wear-levelled data storage - replaces external EEPROM and simplifies firmware updates.
Hardware Cryptographic Acceleration Dedicated AES/SHA/DES engines execute encryption in <100 cycles per block - offloads CPU, reduces latency, and ensures side-channel resistant operation.
Dual High-Resolution ADCs with PGA Two independent 16-bit SAR ADCs, each with programmable gain amplifier (up to ×64) and internal reference - achieves >90 dB SNR for precision current/voltage sensing.
IEEE 1588-2008 Time Stamping Hardware timestamping on Ethernet frames with sub-microsecond resolution - enables deterministic industrial networking and synchronized distributed control.
Low-Leakage Wakeup Unit (LPWU) Configurable wakeup sources (GPIO, RTC, comparator, TSI) with <1 µA standby current - extends battery life in always-on sensor nodes.

Applications

Industrial HMI Control Panel Smart Electricity Meter

Use Scenario: Touch-enabled front panel with LCD display, relay drivers, and communication to utility backend via Ethernet or PLC.

IC Role / Device Role / Timing Role: Central controller managing touch sensing (TSI), segment LCD drive, energy measurement ADCs, secure firmware updates, and IEEE 1588-synchronized data logging.

Use Value: Integrated FlexNVM stores tariff tables and event logs with EEPROM-like reliability; hardware crypto secures OTA updates and metering data integrity.

Use Scenario: Revenue-grade meter with polyphase voltage/current sampling, tamper detection, and DLMS/COSEM protocol stack over Ethernet or RF.

IC Role / Device Role / Timing Role: Metrology processor interfacing dual 16-bit ADCs with PGA for anti-aliasing and gain calibration, running secure DLMS stack with AES-128 encryption.

Use Value: On-chip AES/SHA-256 accelerates DLMS authentication; 128 KB RAM hosts protocol buffers and real-time calculations without external memory.

Secure Edge Gateway Motor Drive Controller

Use Scenario: Field gateway aggregating Modbus RTU/ASCII sensors via UARTs and forwarding to cloud via Ethernet or cellular modem.

IC Role / Device Role / Timing Role: Protocol translation hub with multiple UARTs, Ethernet MAC, USB OTG for configuration, and hardware RNG for TLS session keys.

Use Value: Six UARTs eliminate external level shifters; hardware RNG meets NIST SP 800-90A requirements for cryptographic key generation.

Use Scenario: BLDC/PMSM inverter control with current sensing, PWM generation, encoder feedback, and thermal monitoring.

IC Role / Device Role / Timing Role: Real-time motor controller executing FOC algorithm using 100 MHz Cortex-M4, eight-channel PWM timer, and dual ADCs for simultaneous current sampling.

Use Value: Eight-channel motor control timer supports complementary PWM with dead-time insertion; FlexRAM stores PID coefficients with fast read/write access.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
K28FN2M0LVM15 ARM Cortex-M4F (with FPU), 2 MB flash, no FlexNVM, 256 KB RAM, same 144-LQFP package - higher performance but lacks EEPROM emulation and hardware crypto acceleration. Better suited for floating-point intensive tasks (e.g., advanced motor control, audio processing); unsuitable where field-upgradable nonvolatile data storage is required. Select when FPU and large flash are prioritized over secure data logging and wear-levelled storage.
RT1052DVJ6B ARM Cortex-M7 @ 600 MHz, 512 KB SRAM, no FlexMemory, no hardware SHA/AES, QSPI interface for external flash - vastly higher compute throughput but no integrated secure crypto or analog subsystem. Ideal for Linux-capable edge AI inference or high-bandwidth video processing; lacks integrated metrology-grade ADCs and secure boot root-of-trust. Choose for applications demanding >500 MHz performance and external memory expansion, not for cost-sensitive, analog-rich, or security-critical embedded control.

Compared with K28FN2M0LVM15 and RT1052DVJ6B, MK53DX256CMD10 uniquely balances 100 MHz deterministic control, on-chip FlexNVM for robust data logging, hardware crypto for secure firmware updates, and dual high-precision ADCs - making it optimal for certified metering, industrial HMI, and battery-backed edge nodes where integration, security, and analog fidelity outweigh raw speed.

Availability

MK53DX256CMD10 is available at Aetrix Electronics and suitable for industrial automation, smart metering, and secure IoT gateway designs requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for MK53DX256CMD10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.

MK53DX256CMD10 belongs to the Kinetis K53 family - designed specifically for industrial control and smart infrastructure applications requiring integrated analog, security, Ethernet, and ultra-low-power operation in harsh environments.

FAQ

What is the maximum operating frequency and core type of the MK53DX256CMD10?

The MK53DX256CMD10 features an ARM Cortex-M4 core with DSP extensions (no FPU) and operates at a maximum frequency of 100 MHz. This delivers 125 DMIPS performance and is validated across the full temperature range (–40°C to +85°C) under 1.71–3.6 V supply conditions. The MK53DX256CMD10 uses the MCG clock generator with PLL to achieve stable 100 MHz operation from a 3–32 MHz crystal source.

Does the MK53DX256CMD10 include hardware cryptographic acceleration?

Yes, the MK53DX256CMD10 integrates dedicated hardware modules for AES-128/256, DES/3DES, SHA-1/256, MD5, CRC-32, and a true random number generator (TRNG). These accelerate cryptographic operations without CPU intervention - enabling secure boot, firmware signature verification, and encrypted data storage in the FlexNVM. The MK53DX256CMD10 also includes a 128-bit unique chip ID for device authentication.

What analog peripherals are integrated into the MK53DX256CMD10?

The MK53DX256CMD10 integrates two independent 16-bit SAR ADCs (each with programmable gain amplifier up to ×64), two 12-bit DACs, two operational amplifiers, three analog comparators (each with integrated 6-bit DAC and programmable reference), two transimpedance amplifiers, and a precision voltage reference. These enable high-fidelity sensor signal conditioning, closed-loop analog control, and metrology-grade measurements - all without external components.

What package and pin count does the MK53DX256CMD10 use?

The MK53DX256CMD10 is housed in a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch), designated by the "LQ" suffix in its part number format. This package provides full access to all peripherals including Ethernet MII signals, USB DP/DM, multiple UART/SPI/I²C interfaces, ADC/DAC pins, and FlexBus external memory interface - verified in the official K53 Sub-Family Data Sheet Rev. 3.

How does the FlexMemory architecture work in the MK53DX256CMD10?

The MK53DX256CMD10 implements FlexMemory comprising 256 KB FlexNVM and 4 KB FlexRAM. FlexNVM behaves like EEPROM - supporting byte-level writes, wear leveling, and configurable sector sizes - while FlexRAM serves as fast, nonvolatile data cache. This eliminates need for external EEPROM and simplifies firmware update handling. The MK53DX256CMD10's FlexMemory is managed via dedicated FTFL controller registers and requires no external hardware.

MK53DX256CMD10 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
144-LBGA
Series:
Kinetis K50
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
94
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 41x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MK53DX256CMD10 FAQ

1.How can I place an order for MK53DX256CMD10 through Aetrix?

Please submit a Request for Quotation (RFQ) for MK53DX256CMD10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MK53DX256CMD10 reliable?

The price and inventory of MK53DX256CMD10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK53DX256CMD10 is usually 5 days.

3.What payment methods are accepted for MK53DX256CMD10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK53DX256CMD10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MK53DX256CMD10?

MK53DX256CMD10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MK53DX256CMD10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MK53DX256CMD10?

For technical support, including MK53DX256CMD10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK53DX256CMD10 requirements.

6.How does Aetrix verify that MK53DX256CMD10 is sourced from the original manufacturer or authorized distributors?

All MK53DX256CMD10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK53DX256CMD10 meets industry standards.

7.What is the process for return or replacement of MK53DX256CMD10?

All MK53DX256CMD10 units undergo pre-shipment inspection (PSI). If there is an issue with MK53DX256CMD10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MK53DX256CMD10 part is unused and in its original packaging.

Return procedure for MK53DX256CMD10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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