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NXP Semiconductors MK53DX256ZCMD10

Part No.:
MK53DX256ZCMD10
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
144-LBGA
Datasheet:
AetrixMK53DX256ZCMD10.pdf
Description:
IC MCU 32B 256KB FLASH 144MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,608

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Product details

Overview

MK53DX256ZCMD10 from NXP Semiconductors (formerly Freescale) is a 100 MHz ARM Cortex-M4 microcontroller with DSP extensions, 256 KB program flash, 256 KB FlexNVM, 128 KB SRAM, and 4 KB FlexRAM configured as EEPROM. It features dual 16-bit ADCs (21/22 SE + 3 DP channels), two 12-bit DACs, three analog comparators, two op-amps, two transimpedance amplifiers, USB OTG LS/FS with device charger detect, six UARTs, three SPI modules, two I²C interfaces, I²S, capacitive touch sensing, and segment LCD controller supporting up to 38×8 segments. It targets industrial control and medical instrumentation requiring mixed-signal precision and low-power operation.

For engineers reviewing the MK53DX256ZCMD10 datasheet, MK53DX256ZCMD10 pinout, MK53DX256ZCMD10 application, or MK53DX256ZCMD10 equivalent, this page delivers verified specifications, package mapping to 144-pin MAPBGA (13×13 mm), functional pin roles, real-world use cases in sensor fusion and portable diagnostics, and two validated alternative parts with documented technical and application differences.

Technical Context

This MCU implements an ARM Cortex-M4 core with hardware-accelerated DSP instructions but no floating-point unit. Its memory subsystem integrates FlexMemory-partitionable FlexNVM for data flash or EEPROM backup and FlexRAM for byte-write EEPROM emulation with up to 10 million endurance cycles at full voltage/temperature range.

The analog subsystem includes two independent 16-bit SAR ADCs with programmable gain amplifiers and differential inputs, dual 12-bit DACs for waveform generation, and dedicated analog comparators with integrated 6-bit DACs for threshold detection. Timing is managed by multiple flexible timers (FTM, PIT, PDB, CMT) and a low-power timer, all synchronized via a multi-source clock generator with FLL and PLL support.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M4 @ 100 MHz with DSP instruction set; enables real-time signal processing without external co-processor
Flash Memory256 KB main program flash + 256 KB FlexNVM; supports concurrent code execution and firmware updates
SRAM128 KB on-chip SRAM; sufficient for complex RTOS stacks and real-time buffering of sensor data streams
Analog InputsDual 16-bit ADCs: ADC0 with 21 SE + 3 DP channels, ADC1 with 22 SE + 3 DP channels; enables simultaneous multi-sensor acquisition
USB InterfaceFull-Speed/Low-Speed USB OTG with integrated transceiver and Device Charger Detect (DCD); allows direct battery charging negotiation and host/peripheral mode switching
Operating Voltage1.71 V to 3.6 V; permits direct interface with Li-ion battery systems and wide-range industrial power rails
Temperature Range–40 °C to +105 °C; qualified for under-hood automotive and industrial edge computing environments
Package144-pin MAPBGA (13 mm × 13 mm); provides high I/O density and thermal performance for compact embedded designs

Pinout & Package

Package: 144-pin MAPBGA (13 mm × 13 mm, 0.8 mm pitch), ball grid array with standard footprint per NXP documentation.

Pin/TerminalCircuit RoleDesign Meaning
VDDA/VSSAAnalog power supply/groundIndependent analog domain power pins; must be decoupled separately to maintain 16-bit ADC accuracy
PTA0–PTA31GPIO port A signals32-bit general-purpose I/O bank with interrupt capability, 5 V tolerant, configurable for UART/SPI/I²C multiplexing
ADC0_SE0–ADC0_SE20Analog input channels21 single-ended inputs for ADC0; mapped to physical pins across PORTA/PORTB/PORTC for flexible sensor routing
USB0_DP/USB0_DMUSB differential pairIntegrated full-speed USB transceiver I/O; requires 27 Ω series resistors and proper PCB length matching
XTAL0/EXTAL0Primary crystal oscillator3–32 MHz crystal connection; enables precise timing for USB frame sync and real-time control loops

Key Features

FeatureDesign Value
FlexMemory architecture256 KB FlexNVM + 4 KB FlexRAM enables field-upgradable bootloader storage and 10M-cycle EEPROM emulation without external ICs
Dual 16-bit ADCs with PGASimultaneous sampling of up to 44 analog channels with programmable gain (1×–32×) eliminates need for external signal conditioning in sensor nodes
USB OTG with DCDHardware-based charger detection negotiates current limits with USB hosts and chargers, enabling safe battery-powered operation
Segment LCD controllerDrives up to 38×8 segment displays directly; reduces BOM cost and firmware overhead versus external display drivers
Low-power timer & LLWUSub-microamp wake-up unit with configurable pin triggers and 1 kHz low-power oscillator enables years of battery life in sleep modes
100 MHz Cortex-M4 with DSP1.25 DMIPS/MHz performance with MAC and saturating arithmetic accelerates FFTs, FIR filters, and motor control algorithms

Applications

Industrial Sensor HubPortable Medical Monitor

Use Scenario: Centralized acquisition of temperature, pressure, and gas concentration sensors in factory automation panels.

IC Role / Device Role / Timing Role: Primary controller executing sensor fusion algorithms, managing CAN/UART fieldbus communication, and driving local LCD status display.

Use Value: Dual 16-bit ADCs capture correlated multi-sensor data simultaneously; FlexNVM stores calibration tables and firmware updates without external flash.

Use Scenario: Battery-powered ECG and SpO₂ monitor with graphical display and USB data export.

IC Role / Device Role / Timing Role: Signal acquisition MCU handling analog front-end conditioning, real-time QRS detection, and USB mass-storage-class data logging.

Use Value: 100 MHz CPU executes digital filtering in real time; USB DCD ensures safe charging from hospital-grade USB power supplies.

Smart Energy MeterAutomotive Body Control Module

Use Scenario: DIN-rail mounted electricity meter with harmonic analysis and tamper detection.

IC Role / Device Role / Timing Role: High-precision metrology engine performing 3-phase voltage/current sampling and IEEE 1588 time-stamping for grid synchronization.

Use Value: 16-bit ADC resolution and internal voltage reference enable Class 0.5 accuracy; 105 °C rating supports transformer-cabinet mounting.

Use Scenario: Door module controlling window lift, mirror adjustment, and interior lighting with LIN bus interface.

IC Role / Device Role / Timing Role: Mixed-signal node managing analog potentiometer feedback, PWM motor drives, and capacitive touch buttons.

Use Value: Integrated op-amps and transimpedance amplifiers condition position sensor signals; TSI peripheral enables seamless touch-gesture UI without extra ICs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MK53DN512ZCMD10512 KB main flash (vs. 256 KB), no FlexNVM; same 128 KB SRAM, 144 MAPBGA, 100 MHz coreBetter suited for large firmware images or dual-bank OTA updates; lacks FlexNVM-based EEPROM emulationSelect when bootloaders or data logging require >256 KB dedicated flash and external EEPROM is acceptable
MK64FN1M0VLL12120 MHz Cortex-M4F with FPU, 1 MB flash, 256 KB SRAM, no FlexMemory; adds Ethernet MAC and SDHCTargeted at networked edge devices needing floating-point math and wired connectivity, not low-power mixed-signal edge nodesSelect when IEEE 802.3 compliance or hardware floating-point acceleration is mandatory, and FlexMemory is not required

Compared with MK53DN512ZCMD10, MK53DX256ZCMD10 trades flash capacity for on-chip EEPROM functionality via FlexNVM/FlexRAM-critical for calibration storage in field-deployed instruments. Against MK64FN1M0VLL12, it prioritizes analog integration and power efficiency over raw compute and networking, reducing BOM cost in sensor-centric designs.

Availability

MK53DX256ZCMD10 is available at Aetrix Electronics and suitable for industrial sensor hubs, portable medical monitors, smart energy meters, and automotive body control modules requiring stable component supply, long-term lifecycle support, and guaranteed traceability.

Supply support for MK53DX256ZCMD10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The Kinetis K53 family was designed specifically for high-precision, low-power mixed-signal applications-integrating advanced analog peripherals, USB OTG, and FlexMemory to replace discrete signal chains in medical, test equipment, and industrial control systems.

FAQ

What is the maximum operating frequency and core type of the MK53DX256ZCMD10?

The MK53DX256ZCMD10 features an ARM Cortex-M4 core rated at 100 MHz with DSP instruction support but no integrated floating-point unit. It achieves 1.25 DMIPS/MHz performance and includes hardware-accelerated multiply-accumulate (MAC) operations essential for real-time signal processing tasks. The core operates across the full 1.71–3.6 V supply range and supports debug via SWD and JTAG interfaces.

Does the MK53DX256ZCMD10 include on-chip EEPROM functionality, and how is it implemented?

Yes, the MK53DX256ZCMD10 implements EEPROM functionality using FlexMemory: 256 KB FlexNVM and 4 KB FlexRAM are configured to provide high-endurance byte-write/erase EEPROM storage. This configuration supports up to 10 million write/erase cycles across the full –40 °C to +105 °C temperature range and eliminates the need for external EEPROM ICs in applications like calibration data retention.

What analog peripherals are integrated into the MK53DX256ZCMD10, and how many channels do they support?

The MK53DX256ZCMD10 integrates dual 16-bit SAR ADCs (ADC0 and ADC1), each supporting differential and single-ended inputs: ADC0 offers 21 single-ended + 3 differential-pair channels, ADC1 offers 22 single-ended + 3 differential-pair channels. It also includes two 12-bit DACs, three analog comparators (each with integrated 6-bit DAC), two programmable gain amplifiers, two op-amps, and two transimpedance amplifiers-all accessible via shared GPIO pins with flexible multiplexing.

What USB capabilities does the MK53DX256ZCMD10 support, and does it include a physical transceiver?

The MK53DX256ZCMD10 supports USB On-The-Go (OTG) at Full-Speed (12 Mbps) and Low-Speed (1.5 Mbps) with an integrated on-die transceiver. It includes Device Charger Detect (DCD) logic compliant with USB Battery Charging Specification v1.2, enabling automatic negotiation of charging current from USB hosts and wall adapters without external circuitry.

What package type and pin count does the MK53DX256ZCMD10 use, and is it pin-compatible with other Kinetis devices?

The MK53DX256ZCMD10 uses a 144-pin MAPBGA package with 13 mm × 13 mm footprint and 0.8 mm ball pitch. Within the K53 sub-family, devices sharing the same package identifier (e.g., CMD) are pin-for-pin compatible. However, compatibility with K50/K51/K52 families is not guaranteed due to differing peripheral mappings and signal multiplexing configurations-even when pin count and package match.

MK53DX256ZCMD10 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
144-LBGA
Series:
Kinetis K50
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
94
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 41x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MK53DX256ZCMD10 FAQ

1.How can I place an order for MK53DX256ZCMD10 through Aetrix?

Please submit a Request for Quotation (RFQ) for MK53DX256ZCMD10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MK53DX256ZCMD10 reliable?

The price and inventory of MK53DX256ZCMD10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK53DX256ZCMD10 is usually 5 days.

3.What payment methods are accepted for MK53DX256ZCMD10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK53DX256ZCMD10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MK53DX256ZCMD10?

MK53DX256ZCMD10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MK53DX256ZCMD10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MK53DX256ZCMD10?

For technical support, including MK53DX256ZCMD10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK53DX256ZCMD10 requirements.

6.How does Aetrix verify that MK53DX256ZCMD10 is sourced from the original manufacturer or authorized distributors?

All MK53DX256ZCMD10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK53DX256ZCMD10 meets industry standards.

7.What is the process for return or replacement of MK53DX256ZCMD10?

All MK53DX256ZCMD10 units undergo pre-shipment inspection (PSI). If there is an issue with MK53DX256ZCMD10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MK53DX256ZCMD10 part is unused and in its original packaging.

Return procedure for MK53DX256ZCMD10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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