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NXP Semiconductors MK60DN256VMC10

Part No.:
MK60DN256VMC10
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
121-LFBGA
Datasheet:
AetrixMK60DN256VMC10.pdf
Description:
IC MCU 32B 256KB FLASH 121MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,313

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Product details

Overview

MK60DN256VMC10 from NXP (formerly Freescale) is a 32-bit ARM Cortex-M4 microcontroller with DSP extensions, operating up to 100 MHz, featuring 256 KB on-chip flash memory, 128 KB RAM, and integrated analog peripherals including dual 16-bit SAR ADCs and two 12-bit DACs. It targets industrial control, motor drive, and smart sensor applications requiring deterministic real-time performance and mixed-signal integration.

For engineers reviewing the MK60DN256VMC10 datasheet, MK60DN256VMC10 pinout, MK60DN256VMC10 application, or MK60DN256VMC10 equivalent, key selection considerations include its -40°C to +105°C extended temperature grade, FlexBus external memory interface, IEEE 1588-capable Ethernet controller, dual CAN modules, and hardware cryptographic acceleration for AES/SHA-256.

Technical Context

The MK60DN256VMC10 implements an ARM Cortex-M4 core with single-cycle DSP instructions and a Memory Protection Unit (MPU), supporting deterministic interrupt latency down to 12 cycles. Its clock system integrates a multi-purpose clock generator with 3–32 MHz crystal oscillator input, 32 kHz RTC oscillator, and internal precision reference for low-power operation.

Peripherals are organized into autonomous domains: dual ADCs with integrated PGA (up to ×64 gain) and transimpedance amplifiers support high-resolution sensor signal conditioning; the FlexNVM architecture is absent (M = N in part number), confirming flash-only memory configuration; security modules include hardware CRC, TRNG, and full AES/SHA-256 engines enabling secure boot and firmware updates.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M4 with DSP extensions, 100 MHz max - delivers 125 DMIPS for real-time control loops and sensor fusion.
Flash Memory256 KB program flash - sufficient for complex firmware with bootloader, communication stacks, and application logic.
RAM128 KB SRAM - supports large buffers for Ethernet packet handling, audio processing, or multi-threaded RTOS operation.
ADCDual 16-bit SAR ADCs with PGA (×1–×64) - enables direct connection to low-level transducer outputs without external amplification.
DACTwo 12-bit DACs - provides precise analog output for closed-loop actuator control or calibration signals.
Temperature Range-40°C to +105°C - qualified for under-hood automotive, industrial PLC, and outdoor embedded systems.
SecurityHardware AES-128/256, SHA-1/256, TRNG, CRC - enables FIPS-compliant secure boot and encrypted firmware updates.

Pinout & Package

Package: 121-pin MAPBGA (8 mm × 8 mm, MC suffix), 0.5 mm pitch, RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VSS, VSSAPower and ground railsSeparate digital/analog supplies enable noise isolation for precision ADC/DAC operation; VDDA must track VDD within ±0.1 V.
EXTAL/XTAL, EXTAL32/XTAL32Crystal oscillator inputsSupports primary 3–32 MHz system clock and independent 32.768 kHz RTC crystal - enables simultaneous high-speed operation and ultra-low-power timekeeping.
PTA0–PTA31, PTB0–PTB17, etc.GPIO with multiplexingAll I/O pins support 5 V tolerant inputs and configurable slew rate/drive strength - simplifies interface to legacy 5 V logic and reduces external level-shifting.
ENET_RXD0–ENET_TXD1, ENET_MDC/MDIOEthernet PHY interfaceMII/RMII-capable Ethernet controller with hardware timestamping per IEEE 1588 - enables deterministic industrial networking without external MAC.
CAN0_TX/CAN0_RX, CAN1_TX/CAN1_RXCAN bus transceiver interfaceDual independent CAN 2.0B controllers with flexible message buffering - supports redundant fieldbus or multi-network gateway designs.

Key Features

FeatureDesign Value
FlexBus External Bus InterfaceEnables direct connection to NOR/NAND flash, SRAM, or FPGA peripherals at up to 50 MHz - extends memory and peripheral capability beyond on-chip resources.
Low-Power Timer (LPTMR)16-bit timer running from 32 kHz source during VLPS/VLLS modes - maintains timing accuracy while consuming sub-1 μA, critical for battery-backed applications.
Touch Sensing Interface (TSI)Hardware-accelerated capacitive touch sensing on up to 16 channels - eliminates CPU overhead for HMI implementation and supports wake-from-sleep on touch event.
Programmable Delay Block (PDB)High-resolution timing engine synchronized to ADC conversions - enables precise phase-shifted PWM generation for three-phase motor control.
USB OTG ControllerFull-/low-speed USB 2.0 On-The-Go with integrated transceiver - supports device/host mode switching and HID/CDC class implementations without external PHY.

Applications

Industrial Motor ControlSmart Energy Metering

Use Scenario: Closed-loop servo control of BLDC/PMSM motors in factory automation drives.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms, synchronized ADC sampling, and 6-channel complementary PWM generation with dead-time insertion.

Use Value: Integrated PDB and dual ADCs eliminate external timing ICs and reduce BOM count; 100 MHz core ensures <5 μs current loop update time.

Use Scenario: High-accuracy polyphase electricity meter with harmonic analysis and tamper detection.

IC Role / Device Role / Timing Role: Simultaneous sampling of voltage/current channels via dual ADCs, real-time FFT computation, and secure data logging to external flash.

Use Value: Hardware AES encryption protects meter firmware and consumption logs; 128 KB RAM accommodates multiple harmonic bins and secure boot code.

Building Automation GatewayMedical Sensor Hub

Use Scenario: Protocol translation between BACnet MS/TP, Modbus RTU, and Ethernet/IP networks in HVAC controllers.

IC Role / Device Role / Timing Role: Dual CAN interfaces handle fieldbus traffic; Ethernet controller manages IP stack and time synchronization via IEEE 1588.

Use Value: Deterministic Ethernet timing enables sub-100 ns clock alignment across distributed sensors; FlexBus supports external protocol co-processor if needed.

Use Scenario: Portable patient monitor aggregating ECG, SpO₂, and temperature data with local display and BLE upload.

IC Role / Device Role / Timing Role: Low-noise analog front-end (PGA + ADC) conditions biopotential signals; TSI detects electrode contact; USB handles firmware updates.

Use Value: 16-bit ADC resolution and programmable gain support µV-level ECG signal acquisition; -40°C to +105°C rating covers sterilization temperature profiles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MK60DN512VMC10512 KB flash, same package and pinout - no change to PCB layout required.Supports larger firmware images (e.g., dual-bank OTA, full TCP/IP stack with TLS).Select when future firmware growth or secure OTA updates require >256 KB flash.
MK64FN1M0VLL121 MB flash, 256 KB RAM, 120 MHz core, added USB HS - different 100-pin LQFP package (LL suffix).Better suited for high-throughput data loggers or USB host applications needing faster bulk transfers.Choose only if higher clock speed, USB HS, or larger memory is mandatory - requires PCB redesign.

Compared with MK60DN256VMC10, MK60DN512VMC10 offers seamless scalability within identical thermal and mechanical constraints, while MK64FN1M0VLL12 trades pin compatibility for significantly higher performance and memory - making it suitable for next-generation designs where layout revision is acceptable.

Availability

MK60DN256VMC10 is available at Aetrix Electronics and suitable for industrial motor control, smart energy metering, and building automation gateway applications requiring stable component supply, long-term lifecycle assurance, and extended temperature operation.

Supply support for MK60DN256VMC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.

The K60 series - including MK60DN256VMC10 - was designed for demanding embedded applications requiring real-time determinism, rich analog integration, and hardware security, particularly in industrial automation and networked sensor systems.

FAQ

What is the maximum operating frequency and core type of the MK60DN256VMC10?

The MK60DN256VMC10 features an ARM Cortex-M4 core with DSP extensions, rated for operation up to 100 MHz. This delivers 1.25 Dhrystone MIPS per MHz (125 DMIPS total), enabling high-performance real-time control, digital signal processing, and protocol stack execution. The core includes a single-cycle MAC unit and optional floating-point unit (not present in MK60DN256VMC10, as indicated by 'D' not 'F' in part number). All timing specifications in the datasheet assume this 100 MHz maximum frequency.

Does the MK60DN256VMC10 include hardware cryptographic acceleration?

Yes, the MK60DN256VMC10 integrates dedicated hardware security modules including AES-128/256, SHA-1/256, MD5, DES/3DES engines, a true random number generator (TRNG), and CRC accelerator. These are accessible via memory-mapped registers and supported by NXP's Kinetis SDK. This allows secure boot verification, encrypted firmware updates, and TLS handshake acceleration without burdening the Cortex-M4 core - a key differentiator for IoT edge devices requiring FIPS-aligned security.

What analog peripherals are integrated into the MK60DN256VMC10?

The MK60DN256VMC10 integrates two independent 16-bit SAR ADCs, each with a programmable gain amplifier (PGA) offering gains from ×1 to ×64, two 12-bit DACs, three analog comparators (each with a 6-bit DAC and programmable reference), two transimpedance amplifiers, and a precision voltage reference. This analog subsystem supports high-fidelity sensor signal acquisition and conditioning - for example, directly interfacing strain gauges, thermocouples, or photodiode arrays without external op-amps or ADC drivers.

Is the MK60DN256VMC10 pin-compatible with other K60 family members?

The MK60DN256VMC10 uses the 121-pin MAPBGA (MC) package. Within the K60 family, it shares identical pinout and footprint with other MC-package variants such as MK60DN512VMC10 and MK60DX256VMC10 - confirmed by Freescale's K60 Sub-Family Data Sheet Rev. 3, Section 8.2. This enables drop-in replacement for flash size or FlexMemory capability upgrades without PCB modification. However, it is not pin-compatible with LQFP or QFN-packaged K60 devices.

What communication interfaces does the MK60DN256VMC10 support?

The MK60DN256VMC10 supports Ethernet (MII/RMII with IEEE 1588 hardware timestamping), USB full-/low-speed OTG with on-chip transceiver, two CAN 2.0B controllers, three SPI modules, two I²C modules, six UARTs, SDHC, and I²S. This comprehensive interface set enables complex multi-protocol gateways - for instance, bridging CAN fieldbus to Ethernet/IP while simultaneously hosting a USB debug interface and SD card data logger, all managed concurrently by the 100 MHz Cortex-M4 core.

MK60DN256VMC10 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
121-LFBGA
Series:
Kinetis K60
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
100
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 42x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MK60DN256VMC10 FAQ

1.How can I place an order for MK60DN256VMC10 through Aetrix?

Please submit a Request for Quotation (RFQ) for MK60DN256VMC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MK60DN256VMC10 reliable?

The price and inventory of MK60DN256VMC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK60DN256VMC10 is usually 5 days.

3.What payment methods are accepted for MK60DN256VMC10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK60DN256VMC10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MK60DN256VMC10?

MK60DN256VMC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MK60DN256VMC10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MK60DN256VMC10?

For technical support, including MK60DN256VMC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK60DN256VMC10 requirements.

6.How does Aetrix verify that MK60DN256VMC10 is sourced from the original manufacturer or authorized distributors?

All MK60DN256VMC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK60DN256VMC10 meets industry standards.

7.What is the process for return or replacement of MK60DN256VMC10?

All MK60DN256VMC10 units undergo pre-shipment inspection (PSI). If there is an issue with MK60DN256VMC10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MK60DN256VMC10 part is unused and in its original packaging.

Return procedure for MK60DN256VMC10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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