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NXP Semiconductors MK64FN1M0VDC12
- Part No.:
- MK64FN1M0VDC12
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 121-XFBGA
- Datasheet:
-
MK64FN1M0VDC12.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 121XFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,163
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Product details
Overview
MK64FN1M0VDC12 from NXP Semiconductors is a 120 MHz ARM® Cortex®-M4 microcontroller with FPU, 1 MB flash, 256 KB SRAM, and 83 GPIOs in 144-pin LQFP package. It integrates USB OTG 2.0 (crystal-less), 10/100 Mbit/s Ethernet MAC (MII/RMII), dual 16-bit ADCs, and hardware AES/SHA-256 encryption - deployed in industrial gateways requiring real-time connectivity and secure firmware updates.
For engineers reviewing the MK64FN1M0VDC12 datasheet, MK64FN1M0VDC12 pinout, MK64FN1M0VDC12 application, or MK64FN1M0VDC12 equivalent, key selection criteria include Ethernet+USB coexistence, low-power stop mode current (≤5.8 µA), FlexMemory support, 120 MHz deterministic execution, and -40°C to +105°C operation for rugged embedded control.
Technical Context
The MK64FN1M0VDC12 implements a dual-bus architecture with AHB and APB interconnects, enabling concurrent Ethernet packet processing, USB transaction handling, and real-time motor control via FlexTimer modules. Its memory protection unit (MPU) enforces multi-master access control across flash, SRAM, and peripheral address spaces.
Power management leverages six low-power modes - including VLLS0 (339 nA) with POR detect and VLPS (57 µA) with 4 MHz IRC - coordinated by a low-leakage wake-up unit supporting GPIO, RTC alarm, and external interrupt sources. Clocking combines PLL (up to 120 MHz), FLL, and 48 MHz IRC48M for jitter-tolerant USB timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M4 with FPU, 120 MHz - enables floating-point-intensive sensor fusion and real-time control loops |
| Flash / RAM | 1 MB program flash + 256 KB SRAM - supports full TCP/IP stack, OTA update image storage, and dual-bank firmware |
| Connectivity | 10/100 Mbit/s Ethernet MAC (MII/RMII) + USB 2.0 FS/LS OTG - allows simultaneous wired network and host/device USB operation |
| Analog | Two 16-bit SAR ADCs (1 MSPS), two 12-bit DACs - suitable for precision analog I/O in PLC analog modules |
| Security | Hardware AES-128/256, SHA-1/256, RNG, CRC - accelerates TLS handshake and secure boot verification |
| Operating Range | 1.71–3.6 V supply, –40°C to +105°C ambient - qualified for industrial temperature-grade PCB deployment |
| Low-Power Modes | VLLS0: 339 nA (POR enabled); STOP: 0.49–3.0 mA - enables battery-backed operation for >10-year node lifetime |
Pinout & Package
Package: 144-pin LQFP (20 × 20 × 1.6 mm, 0.5 mm pitch). RoHS-compliant, moisture sensitivity level (MSL) 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PTE0–PTE31 | GPIO Port E (32 pins) | Configurable digital I/O with interrupt capability; supports UART0_TX/RX, I2C0_SCL/SDA, and FlexTimer channel inputs |
| PTA0–PTA31 | GPIO Port A (32 pins) | Includes Ethernet RMII signals (REF_CLK, RXD0–RXD1, TXD0–TXD1, CRS_DV, TX_EN), critical for compact PHY interface layout |
| USB0_DP / USB0_DM | USB 2.0 differential pair | Full-speed/low-speed OTG transceiver I/O; requires 27 Ω series termination and 1.5 kΩ pull-up on DP for device mode |
| ENET0_RXD0–ENET0_RXD1 | Ethernet receive data lines | RMII interface pins; must be routed as matched-length differential pairs (≤5 mm skew) for 50 MHz timing compliance |
| ENET0_TXD0–ENET0_TXD1 | Ethernet transmit data lines | Driven by internal MAC; require 50 Ω series termination and controlled-impedance routing to external PHY |
Key Features
| Feature | Design Value |
|---|---|
| Crystal-less USB operation | Eliminates 48 MHz crystal and associated load capacitors - reduces BOM cost and board area in USB device applications |
| FlexMemory (FlexNVM + FlexRAM) | Up to 128 KB emulated EEPROM via FlexNVM + 4 KB fast SRAM-like FlexRAM - enables wear-leveling and atomic write for logging without external memory |
| IEEE 1588 timer support | Hardware timestamping of Ethernet frames at sub-microsecond resolution - essential for time-sensitive networking (TSN) in motion control systems |
| Dual 16-bit ADCs with hardware trigger | Simultaneous sampling of up to 32 channels with programmable delay; supports motor phase current sensing with <1 µs inter-channel skew |
| Secure Digital Host Controller (SDHC) | Supports SD/SDHC cards up to 32 GB and eMMC 4.5 - enables local data buffering and field-upgradable configuration storage |
Applications
| Industrial Ethernet Gateway | Secure Edge Node |
|---|---|
Use Scenario: Protocol translation between Modbus RTU field devices and cloud-connected Ethernet backbone. IC Role / Device Role / Timing Role: Central MCU executing FreeRTOS, managing dual-network stacks (TCP/IP + Modbus), and performing cryptographic signing of telemetry. Use Value: Integrated Ethernet MAC + USB + AES engine eliminates need for external PHY, USB transceiver, and crypto co-processor - reducing system latency and component count. |
Use Scenario: Tamper-resistant sensor aggregator in smart metering with local anomaly detection. IC Role / Device Role / Timing Role: Real-time data acquisition hub with secure boot, encrypted flash storage, and hardware RNG for session keys. Use Value: 256 KB SRAM enables full TLS 1.2 handshake + certificate chain validation in RAM; VLLS0 mode extends battery life to >15 years. |
| Programmable Logic Controller (PLC) I/O Module | Medical Infusion Pump Controller |
Use Scenario: Analog/digital I/O expansion module with isolated CAN and Ethernet backhaul. IC Role / Device Role / Timing Role: Deterministic I/O scheduler using FlexTimers and PITs; ADC sampling synchronized to PWM outputs for closed-loop control. Use Value: Dual 16-bit ADCs with hardware averaging achieve <12-bit effective resolution at 100 kSPS - meets IEC 61000-4-3 immunity requirements for analog input accuracy. |
Use Scenario: Safety-critical drug delivery controller requiring ASIL-B compliance and fault logging. IC Role / Device Role / Timing Role: Primary safety monitor with dual-core lockstep not applicable, but MPU-enforced memory isolation between therapy and UI tasks. Use Value: Hardware CRC engine validates flash integrity before each boot; 128-bit unique ID enables per-device audit trail traceability per FDA 21 CFR Part 11. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MK66FN2M0VLQ18 | 2 MB flash, 256 KB SRAM, 180 MHz core, added CAN FD support, 144 MAPBGA only | Better suited for automotive diagnostics tools requiring CAN FD and larger OTA image space | Select when higher clock speed, CAN FD, or extended flash is required - not pin-compatible with MK64FN1M0VDC12 LQFP |
| STM32H743VIT6 | 480 MHz Cortex-M7, 2 MB flash, 1 MB RAM, no integrated Ethernet MAC, requires external PHY | Preferred for high-throughput vision preprocessing where DSP performance outweighs integrated connectivity | Choose when raw compute throughput is prioritized over integrated Ethernet/USB; requires redesign for PHY interface and power sequencing |
Compared with MK64FN1M0VDC12, MK66FN2M0VLQ18 offers higher performance and CAN FD but lacks LQFP packaging and increases layout complexity, while STM32H743VIT6 delivers superior CPU throughput but removes integrated Ethernet - increasing BOM cost and design effort for networked applications.
Availability
MK64FN1M0VDC12 is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, PLC I/O modules, medical infusion pumps, and time-sensitive networking equipment requiring stable component supply across long production lifecycles.
Supply support for MK64FN1M0VDC12 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge AI acceleration.
The Kinetis K64 family targets cost-sensitive, high-integration industrial applications demanding USB/Ethernet coexistence, robust security, and ultra-low-power operation - exemplified by the MK64FN1M0VDC12's balanced feature set for gateway-class devices.
FAQ
What is the maximum operating frequency of the MK64FN1M0VDC12 core?
The MK64FN1M0VDC12 features an ARM Cortex-M4 core with floating-point unit rated for up to 120 MHz operation. This frequency is achievable under specified voltage (1.71–3.6 V) and temperature (–40°C to +105°C) conditions with proper clock configuration using the PLL. The MK64FN1M0VDC12 maintains deterministic timing at this rate for real-time control tasks.
Does the MK64FN1M0VDC12 support crystal-less USB operation?
Yes, the MK64FN1M0VDC12 integrates a USB 2.0 full-speed/low-speed OTG controller with crystal-less operation capability. It uses the internal 48 MHz IRC48M clock source, eliminating the need for an external 48 MHz crystal and associated load capacitors - confirmed in Section 3.8.2 of the K64F Data Sheet Rev. 7.
What Ethernet interface options does the MK64FN1M0VDC12 provide?
The MK64FN1M0VDC12 includes a 10/100 Mbit/s Ethernet MAC with both MII and RMII physical layer interfaces. RMII is commonly used for compact designs with external PHYs like the KSZ8081RNB, while MII supports legacy PHYs. Pin assignments for both modes are defined in the MK64FN1M0VDC12 pinout tables (Section 5.3).
How much SRAM and flash memory does the MK64FN1M0VDC12 have?
The MK64FN1M0VDC12 integrates 1 MB of on-chip program flash memory and 256 KB of SRAM. Additionally, it supports FlexMemory configurations with up to 128 KB FlexNVM and 4 KB FlexRAM - enabling EEPROM emulation and fast non-volatile data storage without external components.
What is the lowest power consumption mode supported by the MK64FN1M0VDC12?
The MK64FN1M0VDC12 achieves its lowest static power in Very Low-Leakage Stop Mode 0 (VLLS0) with POR detect circuit disabled: 339 nA typical at 3.0 V and 25°C. This mode retains full register and RAM state while allowing wake-up via RTC alarm, GPIO, or LLWU sources - critical for battery-powered remote sensors.
MK64FN1M0VDC12 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 121-XFBGA
- Series:
- Kinetis K60
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 83
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 37x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK64FN1M0VDC12 FAQ
1.How can I place an order for MK64FN1M0VDC12 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK64FN1M0VDC12 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK64FN1M0VDC12 reliable?
The price and inventory of MK64FN1M0VDC12 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK64FN1M0VDC12 is usually 5 days.
3.What payment methods are accepted for MK64FN1M0VDC12?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK64FN1M0VDC12 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK64FN1M0VDC12?
MK64FN1M0VDC12 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK64FN1M0VDC12 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK64FN1M0VDC12?
For technical support, including MK64FN1M0VDC12 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK64FN1M0VDC12 requirements.
6.How does Aetrix verify that MK64FN1M0VDC12 is sourced from the original manufacturer or authorized distributors?
All MK64FN1M0VDC12 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK64FN1M0VDC12 meets industry standards.
7.What is the process for return or replacement of MK64FN1M0VDC12?
All MK64FN1M0VDC12 units undergo pre-shipment inspection (PSI). If there is an issue with MK64FN1M0VDC12, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK64FN1M0VDC12 part is unused and in its original packaging.
Return procedure for MK64FN1M0VDC12:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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