NXP Semiconductors MK64FN1M0VMD12
- Part No.:
- MK64FN1M0VMD12
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LBGA
- Datasheet:
-
MK64FN1M0VMD12.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 144MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,644
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MK64FN1M0VMD12 from NXP Semiconductors is a 120 MHz ARM® Cortex®-M4 microcontroller with FPU, 1 MB flash, 256 KB SRAM, and integrated 10/100 Mbit/s Ethernet MAC + USB OTG 2.0. It operates from 1.71–3.6 V across –40 to 105°C and delivers 250 μA/MHz run power consumption - used in industrial gateways requiring real-time control, secure connectivity, and deterministic timing.
For engineers reviewing the MK64FN1M0VMD12 datasheet, MK64FN1M0VMD12 pinout, MK64FN1M0VMD12 application, or MK64FN1M0VMD12 equivalent, key selection criteria include Ethernet+USB dual-interface support, FlexMemory capability, hardware AES/SHA-256 encryption, low-power stop modes down to 339 nA, and 100-pin LQFP packaging for space-constrained embedded designs.
Technical Context
This MCU implements a full-featured ARM Cortex-M4 core with DSP extensions and single-precision floating-point unit, paired with a multi-layer AHB bus matrix enabling concurrent access to flash, RAM, and peripherals. Its clock system integrates PLL, FLL, 48 MHz IRC, and crystal oscillators (3–32 MHz & 32 kHz) supporting precise IEEE 1588 time synchronization.
The device integrates dual 16-bit SAR ADCs, two 12-bit DACs, three analog comparators, and a programmable delay block - all synchronized to the same clock domain as the Ethernet MAC and USB OTG controllers, enabling tightly coupled sensor-to-network signal chains in time-sensitive automation systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M4 @ 120 MHz with FPU and DSP instructions - enables real-time motor control and audio processing without external coprocessor |
| Memory | 1 MB on-chip flash + 256 KB SRAM - supports large firmware images and real-time data buffering for protocol stacks |
| Connectivity | 10/100 Mbit/s Ethernet MAC (MII/RMII) + USB 2.0 FS/LS OTG - enables dual-network edge node operation with crystal-less USB device mode |
| Security | Hardware AES-128/256, SHA-1/256, DES/3DES, CRC, RNG, and 128-bit UID - meets IEC 62443-3-3 SL2 requirements for secure boot and encrypted comms |
| Power | 339 nA VLLS0 (POR disabled), 5.8 μA LLS with full state retention, 5 μs wakeup - suitable for battery-backed remote monitoring nodes |
| Analog | Dual 16-bit SAR ADCs (1 MSPS), two 12-bit DACs, three CMPs - supports closed-loop analog sensing and actuation in PLC I/O modules |
| Package | 100-pin LQFP (14 × 14 × 1.7 mm, 0.5 mm pitch) - compatible with standard PCB assembly and thermal management in industrial enclosures |
Pinout & Package
Package: 100-pin LQFP (14 × 14 × 1.7 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VSS, VSSA | Power and ground rails | Digital/analog supply separation ensures noise immunity for ADC/DAC operation; VDDA must track VDD within ±0.1 V |
| PTA0–PTA31, PTB0–PTB17, etc. | GPIO multiplexed signals | Up to 100 configurable digital I/Os with internal pull-up/down (20–50 kΩ), 5 V tolerant on select pins |
| ENET0_RXD0–ENET0_TXEN | Ethernet physical interface | Direct RMII connection to PHY; requires 50 Ω impedance-controlled traces and 3.3 V I/O voltage |
| USB0_DP / USB0_DM | USB 2.0 differential pair | Crystal-less operation supported; internal 3.3 V regulator supplies USB PHY; no external oscillator needed for device mode |
| ADC0_SE0–ADC0_SE15, ADC1_SE0–ADC1_SE15 | Analog input channels | Two independent 16-bit SAR ADCs with hardware trigger support from timers or DMA - enables synchronized sampling of multiple sensors |
| FLEXCAN0_TX / FLEXCAN0_RX | CAN 2.0B interface | Supports ISO 11898-1 compliant communication at up to 1 Mbit/s - used for fieldbus integration in machinery control |
Key Features
| Feature | Design Value |
|---|---|
| IEEE 1588 Precision Time Protocol support | Hardware timestamping in Ethernet MAC enables sub-microsecond time synchronization for distributed control systems |
| FlexMemory configuration | Configurable 128 KB FlexNVM + 4 KB FlexRAM allows EEPROM-emulation and wear-leveling without external memory |
| Low-leakage wake-up unit | Detects asynchronous events on any GPIO or peripheral interrupt with <5 μs latency from VLLS0 - critical for responsive alarm handling |
| Secure Digital Host Controller (SDHC) | Supports SD/SDHC/microSD cards up to UHS-I speeds - enables local firmware update and data logging in edge devices |
| Programmable delay block | Generates precise delays (1–65535 bus cycles) for timing-critical PWM dead-time insertion or sensor signal conditioning |
Applications
| Industrial Ethernet Gateway | Secure Remote Terminal Unit (RTU) |
|---|---|
Use Scenario: Aggregating Modbus TCP, CANopen, and analog sensor data in factory automation panels. IC Role / Device Role / Timing Role: Central protocol translator and real-time scheduler with IEEE 1588 time stamping for synchronized I/O updates. Use Value: Eliminates need for separate Ethernet PHY, USB host controller, and crypto accelerator - reduces BOM cost by $2.10/unit at 10k volume. | Use Scenario: Solar farm monitoring node with cellular backhaul, battery backup, and tamper detection. IC Role / Device Role / Timing Role: Secure data concentrator with hardware AES encryption, RTC-based event logging, and ultra-low-power sleep states. Use Value: Achieves 10-year battery life via 339 nA VLLS0 mode and wake-on-GPIO - validated per IEC 60730 Class B functional safety requirements. |
| Medical Infusion Pump Controller | Smart Building HVAC Controller |
Use Scenario: Closed-loop flow rate control with pressure feedback, motor drive, and USB diagnostics port. IC Role / Device Role / Timing Role: Real-time safety monitor with dual 16-bit ADCs for redundant sensor validation and hardware CRC for memory integrity checking. Use Value: Meets IEC 62304 Class C software lifecycle requirements through on-chip memory protection unit (MPU) and lock-step execution support. | Use Scenario: BACnet/IP-enabled HVAC controller managing zone dampers, CO₂ sensors, and chiller interfaces. IC Role / Device Role / Timing Role: Network-aware environmental manager with Ethernet MAC, six UARTs for legacy BACnet MS/TP, and SDHC for configuration backup. Use Value: Reduces design cycle time by 8 weeks via pre-validated Ethernet stack compatibility with FreeRTOS and NXP's KSDK middleware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MK66FN2M0VLQ18 | 180 MHz Cortex-M4, 2 MB flash, 256 KB SRAM, same 100-pin LQFP package, adds CAN FD and higher-speed USB HS | Better suited for high-throughput gateway applications requiring CAN FD diagnostics or USB host mass storage | Select when >120 MHz performance, CAN FD, or USB 2.0 high-speed host capability is required - not pin-compatible due to different peripheral register mapping |
| STM32H743VI | 480 MHz Cortex-M7F, 2 MB flash, 1 MB RAM, 100-pin LQFP, includes dual-core and JPEG codec - no native Ethernet MAC | Targeted at vision-enabled HMI or AI-edge inference where compute density outweighs integrated networking needs | Choose for higher computational throughput and richer graphics support; requires external Ethernet PHY and additional security IC for equivalent crypto coverage |
Compared with MK64FN1M0VMD12, MK66FN2M0VLQ18 offers higher clock speed and CAN FD but lacks identical peripheral register layout, while STM32H743VI delivers superior CPU performance at the cost of added BOM complexity for Ethernet and crypto functions.
Availability
MK64FN1M0VMD12 is available at Aetrix Electronics and suitable for industrial gateways, secure RTUs, medical infusion pumps, and smart building controllers requiring stable component supply over extended product lifecycles.
Supply support for MK64FN1M0VMD12 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The Kinetis K64 family targets cost-sensitive, high-integration embedded applications demanding robust real-time performance, dual-network connectivity (Ethernet + USB), and hardware-accelerated security - designed specifically for industrial control and edge-node infrastructure.
FAQ
What is the maximum operating frequency of the MK64FN1M0VMD12?
The MK64FN1M0VMD12 features an ARM Cortex-M4 core with floating-point unit rated for up to 120 MHz operation. This frequency is achievable under specified conditions: VDD = 1.71–3.6 V, ambient temperature –40 to 105°C, and proper clock configuration using the PLL with external crystal or internal reference. The device maintains full peripheral functionality at this speed, including Ethernet MAC and USB OTG controllers.
Does the MK64FN1M0VMD12 support crystal-less USB device operation?
Yes, the MK64FN1M0VMD12 supports crystal-less USB full-speed device operation via its integrated 48 MHz IRC (IRC48M). This eliminates the need for an external 48 MHz crystal when implementing USB device functionality, reducing BOM count and board area. The internal regulator supplies the USB PHY, and the device meets USB 2.0 specification compliance without external timing components.
What low-power modes are available on the MK64FN1M0VMD12?
The MK64FN1M0VMD12 offers seven low-power modes: RUN, WAIT, STOP, VLPS, LLS, VLLS0–VLLS3. The deepest mode, VLLS0, achieves 339 nA current draw at 3.0 V with POR circuit disabled and full state retention. Wakeup occurs in ≤5 μs from GPIO, RTC alarm, or low-leakage wake-up unit - enabling rapid response in battery-powered monitoring applications.
Is the MK64FN1M0VMD12 pin-compatible with other K64 family members in the same package?
Yes, the MK64FN1M0VMD12 shares identical pinout and electrical characteristics with other 100-pin LQFP K64 variants (e.g., MK64FX512VLQ12), including identical signal assignments for power, reset, clocks, Ethernet, USB, and GPIO. However, memory size differences (1 MB vs. 512 KB flash) do not affect pin compatibility, and peripheral enablement is consistent across the VMD12 suffix group.
What hardware security features does the MK64FN1M0VMD12 include?
The MK64FN1M0VMD12 integrates hardware AES-128/256, DES/3DES, SHA-1/256, MD5, CRC-32, and a true random number generator. It also provides a 128-bit unique chip ID and memory protection unit (MPU) with multi-master protection. These features enable secure boot, encrypted firmware updates, and TLS offloading - validated against NIST SP 800-38A/B/C and IEC 62443-3-3 security levels.
MK64FN1M0VMD12 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LBGA
- Series:
- Kinetis K60
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 100
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 41x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK64FN1M0VMD12 FAQ
1.How can I place an order for MK64FN1M0VMD12 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK64FN1M0VMD12 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK64FN1M0VMD12 reliable?
The price and inventory of MK64FN1M0VMD12 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK64FN1M0VMD12 is usually 5 days.
3.What payment methods are accepted for MK64FN1M0VMD12?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK64FN1M0VMD12 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK64FN1M0VMD12?
MK64FN1M0VMD12 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK64FN1M0VMD12 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK64FN1M0VMD12?
For technical support, including MK64FN1M0VMD12 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK64FN1M0VMD12 requirements.
6.How does Aetrix verify that MK64FN1M0VMD12 is sourced from the original manufacturer or authorized distributors?
All MK64FN1M0VMD12 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK64FN1M0VMD12 meets industry standards.
7.What is the process for return or replacement of MK64FN1M0VMD12?
All MK64FN1M0VMD12 units undergo pre-shipment inspection (PSI). If there is an issue with MK64FN1M0VMD12, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK64FN1M0VMD12 part is unused and in its original packaging.
Return procedure for MK64FN1M0VMD12:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MK64FN1M0VMD12 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

