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NXP Semiconductors MK64FX512VDC12

Part No.:
MK64FX512VDC12
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
121-XFBGA
Datasheet:
AetrixMK64FX512VDC12.pdf
Description:
IC MCU 32BIT 512KB FLSH 121XFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,260

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Product details

Overview

MK64FX512VDC12 from NXP Semiconductors is a 120 MHz ARM® Cortex®-M4 microcontroller with FPU, 512 KB flash, 256 KB SRAM, and 83 GPIOs in a 144-pin LQFP package. It integrates USB OTG 2.0 (crystal-less), 10/100 Mbit/s Ethernet MAC (MII/RMII), dual 16-bit ADCs, two 12-bit DACs, CAN, six UARTs, and hardware AES/SHA-256 encryption - deployed in industrial gateways requiring real-time connectivity and secure edge processing.

For engineers reviewing the MK64FX512VDC12 datasheet, MK64FX512VDC12 pinout, MK64FX512VDC12 application, or MK64FX512VDC12 equivalent, key selection criteria include its 144 LQFP mechanical compatibility, Ethernet+USB coexistence capability, low-power stop mode current (≤5.8 µA with full state retention), and FlexMemory support for data logging in resource-constrained embedded systems.

Technical Context

The MK64FX512VDC12 implements a multi-layer bus architecture with AHB crossbar, supporting concurrent access to flash, SRAM, and peripherals. Its clock system includes PLL, FLL, 48 MHz IRC48M, and configurable 3–32 MHz crystal oscillator - enabling precise timing control for IEEE 1588 Ethernet synchronization and deterministic motor control via FlexTimer modules.

Security is enforced through dedicated hardware blocks: CRC engine for memory integrity, TRNG for key generation, and cryptographic accelerators for DES/3DES/AES/SHA-1/SHA-256 - all operating independently of the CPU core to maintain real-time responsiveness during encrypted communication or firmware updates.

Key Specifications

Parameter Value and Actual Design Meaning
Core ARM Cortex-M4 @ 120 MHz with FPU and DSP instructions - enables floating-point math for sensor fusion and motor algorithms without software emulation overhead.
Memory 512 KB on-chip flash + 256 KB SRAM + 128 KB FlexNVM - supports over-the-air (OTA) firmware updates with dual-bank operation and nonvolatile data storage.
Power Consumption 5.8 µA in Stop mode with full state retention and 5 µs wakeup - allows battery-powered remote nodes to operate for years on coin-cell power.
Connectivity 10/100 Mbit/s Ethernet MAC (MII/RMII) + USB 2.0 LS/FS OTG (crystal-less) - eliminates external PHY and USB clock crystal, reducing BOM count and PCB area.
Analog Peripherals Two 16-bit SAR ADCs (1 MSPS), two 12-bit DACs, three analog comparators - sufficient for closed-loop analog control in PLC I/O modules and precision instrumentation.
Crypto Acceleration Hardware AES-128/192/256, SHA-1/SHA-256, DES/3DES - offloads TLS handshake and secure boot verification, reducing CPU load by >70% vs. software-only implementation.
Operating Range 1.71–3.6 V supply, –40°C to +105°C ambient - qualified for under-hood automotive ECUs and industrial control cabinets without derating.

Pinout & Package

Package: 144-pin LQFP (20 × 20 × 1.6 mm, 0.5 mm pitch). RoHS-compliant, moisture sensitivity level (MSL) 3 per J-STD-020.

Pin/Terminal Circuit Role Design Meaning
VDD/VSS Digital power/ground Multiple dedicated pairs ensure stable core voltage under dynamic load; decoupling required per datasheet layout guidelines (98ASS23177W1).
VDDA/VSSA Analog power/ground Isolated analog domain supplies ADC/DAC/CMP; requires separate low-noise filtering to achieve 16-bit effective resolution.
USB0_DP/USB0_DM USB 2.0 differential data On-die termination and ESD protection meet USB-IF compliance; crystal-less operation enabled via internal 48 MHz IRC48M clock source.
ENET0_RXD0–3 / ENET0_TXD0–3 Ethernet MII data lines Supports 10/100 Mbit/s full-duplex; requires external magnetics and 50 Ω impedance-controlled routing for EMC compliance.
PTA0–31 / PTB0–16 / etc. GPIO multiplexed signals 83 total usable I/O pins with configurable pull-up/down, slew rate, and drive strength - enables flexible peripheral mapping for custom carrier boards.

Key Features

Feature Design Value
Floating-point unit (FPU) IEEE 754 single-precision compliant - accelerates FFT, PID tuning, and Kalman filtering in real-time motion control applications.
FlexTimer modules Four independent FlexTimers (two 8-channel, two 2-channel) with PWM, quadrature decode, and dead-time insertion - supports BLDC motor commutation and encoder-based position feedback.
Secure Digital Host Controller (SDHC) Full-speed SD/MMC interface with DMA support - enables local data buffering and firmware staging on removable media without CPU intervention.
Low-leakage wake-up unit (LWU) Configurable edge-triggered inputs from GPIO, RTC, or analog comparators - allows selective wake-up from VLLS0 mode with <340 nA quiescent current.
Memory Protection Unit (MPU) 8-region MPU with multi-master access control - enforces privilege separation between RTOS tasks and prevents unauthorized peripheral access in safety-critical firmware.

Applications

Industrial Ethernet Gateway Secure Edge Node

Use Scenario: Protocol translation between Modbus TCP and CANopen in factory automation networks.

IC Role / Device Role / Timing Role: Central MCU managing dual-network stacks, time-synchronized packet forwarding, and watchdog-monitored failover.

Use Value: Integrated Ethernet MAC + USB OTG eliminates need for external PHY and USB transceiver, reducing component count by ≥4 while maintaining IEEE 1588 timestamp accuracy within ±50 ns.

Use Scenario: Tamper-resistant sensor aggregator in smart metering infrastructure with OTA update capability.

IC Role / Device Role / Timing Role: Secure boot loader, encrypted data acquisition engine, and TLS 1.2 endpoint for cloud telemetry.

Use Value: Hardware AES/SHA-256 acceleration reduces firmware update verification time from 120 ms (software) to 18 ms, enabling sub-second secure reprogramming.

Programmable Logic Controller (PLC) I/O Module Medical Diagnostic Instrument

Use Scenario: Analog input/output expansion module with isolated current/voltage sensing and actuator drive.

IC Role / Device Role / Timing Role: Real-time analog signal conditioner, digital I/O controller, and EtherCAT slave node processor.

Use Value: Dual 16-bit ADCs + two 12-bit DACs + 83 GPIOs enable simultaneous sampling of 16 channels at 100 kSPS with programmable gain, meeting IEC 61000-4-5 surge immunity requirements.

Use Scenario: Portable ultrasound front-end with beamforming and RF signal conditioning.

IC Role / Device Role / Timing Role: Time-critical waveform generator, ADC data preprocessor, and USB HID interface to host PC.

Use Value: 120 MHz Cortex-M4+FPU executes FIR filter kernels in ≤2.3 µs per sample, achieving real-time B-mode image reconstruction at 30 fps with 12-bit depth.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MK66FN2M0VLQ18 2 MB flash, 256 KB SRAM, 180 MHz core, same 144 LQFP package - adds USB HS, dual Ethernet, and enhanced crypto (RSA/ECC). Better suited for high-throughput gateway applications requiring dual Ethernet ports or USB host functionality. Select when higher flash density, faster core speed, or USB 2.0 high-speed host capability is required; pin-compatible but requires updated clock tree configuration.
STM32H743VIT6 480 MHz Cortex-M7, 2 MB flash, 1 MB RAM, no integrated Ethernet PHY - requires external RMII PHY; lacks crystal-less USB. Preferred for compute-intensive AI inference at edge, where raw MIPS outweighs integrated connectivity. Choose when maximum computational throughput is critical and external Ethernet PHY is acceptable; not pin-compatible - new PCB layout required.

Compared with MK64FX512VDC12, MK66FN2M0VLQ18 offers higher performance and richer connectivity in identical footprint, while STM32H743VIT6 delivers superior CPU throughput at the cost of added BOM complexity and loss of crystal-less USB convenience.

Availability

MK64FX512VDC12 is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, PLC I/O modules, and medical diagnostic instruments requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MK64FX512VDC12 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.

The Kinetis K64 family targets cost-sensitive, low-power industrial and networking applications requiring integrated Ethernet, USB, security, and analog peripherals - designed to accelerate development of certified, production-ready edge devices.

FAQ

What is the maximum operating frequency of the MK64FX512VDC12 core?

The MK64FX512VDC12 features an ARM Cortex-M4 core rated for up to 120 MHz operation. This frequency is achievable with the internal PLL locked to a 3–32 MHz crystal or external clock source, and requires proper VDD regulation (1.71–3.6 V) and thermal management within the –40°C to +105°C ambient range. The MK64FX512VDC12 maintains full peripheral functionality including Ethernet and USB at this speed.

Does the MK64FX512VDC12 support crystal-less USB operation?

Yes, the MK64FX512VDC12 supports crystal-less USB full-speed and low-speed device operation using its internal 48 MHz IRC48M oscillator. This eliminates the need for an external 48 MHz crystal or oscillator, reducing BOM cost and PCB space. The MK64FX512VDC12 meets USB-IF electrical compliance requirements in this mode per its validated reference design (AN5015).

What is the SRAM capacity of the MK64FX512VDC12 and how is it allocated?

The MK64FX512VDC12 integrates 256 KB of on-chip SRAM, organized as a unified block accessible by the CPU and DMA. It supports configurable memory protection via the MPU and can be partitioned into cacheable/non-cacheable regions. This SRAM capacity enables real-time buffering of Ethernet frames, USB transactions, and sensor data streams without external memory - a key advantage of the MK64FX512VDC12 in latency-sensitive applications.

Which low-power modes does the MK64FX512VDC12 support and what is the lowest current draw?

The MK64FX512VDC12 supports seven low-power modes including VLLS0 (Very-Low-Leakage Stop 0), which achieves as low as 339 nA at 3.0 V with POR circuit disabled and full register retention. Wakeup occurs in 5 µs. Other modes include Stop (0.49 mA typical), VLPS (57 µA), and LLS (5.8 µA) - all verified across –40°C to +105°C. These capabilities make the MK64FX512VDC12 ideal for battery-backed industrial monitoring nodes.

Is the MK64FX512VDC12 pin-compatible with other K64 family members in the same package?

Yes, the MK64FX512VDC12 is pin-compatible with other K64 variants offered in the 144-pin LQFP package (e.g., MK64FN1M0VDC12, MK66FN2M0VLQ18), sharing identical mechanical footprint, power/ground pinout, and peripheral signal assignments. However, differences in flash size, FlexMemory configuration, and optional features require corresponding software and clock tree adjustments - the MK64FX512VDC12 remains electrically and physically interchangeable at board level.

MK64FX512VDC12 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
121-XFBGA
Series:
Kinetis K60
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
86
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
192K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 37x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MK64FX512VDC12 FAQ

1.How can I place an order for MK64FX512VDC12 through Aetrix?

Please submit a Request for Quotation (RFQ) for MK64FX512VDC12 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MK64FX512VDC12 reliable?

The price and inventory of MK64FX512VDC12 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK64FX512VDC12 is usually 5 days.

3.What payment methods are accepted for MK64FX512VDC12?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK64FX512VDC12 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MK64FX512VDC12?

MK64FX512VDC12 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MK64FX512VDC12 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MK64FX512VDC12?

For technical support, including MK64FX512VDC12 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK64FX512VDC12 requirements.

6.How does Aetrix verify that MK64FX512VDC12 is sourced from the original manufacturer or authorized distributors?

All MK64FX512VDC12 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK64FX512VDC12 meets industry standards.

7.What is the process for return or replacement of MK64FX512VDC12?

All MK64FX512VDC12 units undergo pre-shipment inspection (PSI). If there is an issue with MK64FX512VDC12, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MK64FX512VDC12 part is unused and in its original packaging.

Return procedure for MK64FX512VDC12:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MK64FX512VDC12 Tags

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