NXP Semiconductors MK65FN2M0VMI18
- Part No.:
- MK65FN2M0VMI18
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 169-LFBGA
- Datasheet:
-
MK65FN2M0VMI18.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 169MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:275
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MK65FN2M0VMI18 from NXP Semiconductors is a 180 MHz ARM® Cortex®-M4F microcontroller with DSP instructions and single-precision floating-point unit, 2 MB flash, 256 KB SRAM, dual USB (including HS PHY), and 10/100 Mbit/s Ethernet MAC with IEEE 1588 support. It targets industrial control gateways requiring real-time networking, secure firmware execution, and low-power operation across –40°C to 105°C.
For engineers reviewing the MK65FN2M0VMI18 datasheet, MK65FN2M0VMI18 pinout, MK65FN2M0VMI18 application, or MK65FN2M0VMI18 equivalent, key selection criteria include Ethernet + dual USB coexistence, FlexBus/SDRAM interface for external memory expansion, hardware AES/SHA acceleration, and verified VLLS0 stop-mode current ≤0.65 µA at 3.0 V.
Technical Context
The MK65FN2M0VMI18 implements a multi-layer AHB bus matrix with memory protection unit (MPU) supporting multi-master arbitration, enabling concurrent access by CPU, DMA, USB, Ethernet, and FlexBus without contention. Its clock system integrates MCG with PEE/BLPE/FEI modes, 3–32 MHz crystal oscillator, 32 kHz low-power oscillator, and 48 MHz IRC - all configurable for dynamic power/performance scaling.
Security architecture includes CAU accelerator for DES/AES/SHA, hardware TRNG, and flash security levels with mass erase protection. Analog subsystem features two independent 16-bit SAR ADCs (1 MSPS), two 12-bit DACs, four analog comparators with integrated 6-bit DACs, and voltage reference (1.2 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M4F @ up to 180 MHz with DSP extensions and single-precision FPU - enables real-time signal processing in motor control or audio applications. |
| Memory | 2 MB on-chip flash + 256 KB SRAM - supports large embedded OS images, OTA update partitions, and real-time data buffering without external memory. |
| USB | Dual USB controllers: one with integrated HS PHY (480 Mbps), one FS-only - allows simultaneous host/device roles and isolated USB isolation domains. |
| Ethernet | 10/100 Mbit/s MAC with MII/RMII and hardware IEEE 1588 timestamping - delivers deterministic latency for industrial time-sensitive networking (TSN) edge nodes. |
| Low-Power Modes | VLLS0 mode draws ≤0.65 µA at 3.0 V with POR enabled - enables battery-backed wake-on-LAN or RTC alarm in always-on remote I/O modules. |
| Analog | Two 16-bit SAR ADCs (1 MSPS), two 12-bit DACs, four CMPs with 6-bit DACs - supports high-fidelity sensor fusion and closed-loop analog control without external converters. |
| Security | CAU hardware accelerator for AES-128/256, SHA-1/256, DES/3DES + TRNG - accelerates TLS handshake and secure boot verification in under 10 ms. |
| Package | 169-pin MAPBGA, 9 mm × 9 mm, 0.65 mm pitch - compatible with standard PCB assembly processes and supports thermal pad for industrial ambient derating. |
Pinout & Package
169-pin MAPBGA (9 mm × 9 mm, 0.65 mm pitch) with exposed thermal pad. Pin assignments follow K65_169BGA Signal Multiplexing per NXP document MAPBGA 169-pin: 98ASA00628D1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| POR_B | Power-on reset input | Active-low asynchronous reset triggered by VDD ramp; internal pull-up ensures reliable startup without external RC network. |
| USB0_DP / USB0_DM | High-speed USB differential pair | Direct connection to HS PHY; requires 90 Ω differential impedance routing and common-mode choke for ESD robustness. |
| ENET0_RXD0–3 / TXD0–3 | Ethernet MII data lines | Supports full 10/100 Mbit/s MII interface; RMII mode reduces pin count to 5 signals (REF_CLK, CRS_DV, RXD, TXD, TX_EN). |
| FTM0_CH0–7 | FlexTimer PWM outputs | Eight-channel motor control timer with dead-time insertion and complementary output - enables three-phase inverter gate drive without external logic. |
| ADC0_SE0–15 / ADC1_SE0–15 | 16-bit SAR ADC inputs | Dual independent ADCs with simultaneous sampling capability - critical for synchronized current/voltage measurement in power electronics. |
Key Features
| Feature | Design Value |
|---|---|
| IEEE 1588 Hardware Timestamping | Sub-microsecond precision timestamp capture on Ethernet frames - eliminates software interrupt latency for time-critical synchronization in PLC backplanes. |
| FlexBus + SDRAM Controller | External memory interface supporting 16-bit SDRAM up to 128 MB - enables frame buffer for HMI displays or packet buffering in gateway applications. |
| Low-Power Timers in Stop Mode | Four LPTMRs retain operation during VLPS/LLS/VLLS - allows periodic sensor polling or watchdog supervision without full wake-up overhead. |
| Touch Sensing Interface (TSI) | Hardware-accelerated capacitive touch sensing on up to 32 electrodes - enables robust front-panel HMI with <1 µA active current and noise immunity. |
| Secure Digital Host Controller (SDHC) | Full SD 3.0 / eMMC 4.5 support with DMA - enables local firmware storage, log recording, and field-upgradeable configuration without external SPI flash. |
| CAU Cryptographic Accelerator | Hardware AES-128 encryption in <100 cycles per block - reduces TLS stack CPU load by >70% versus software-only implementation. |
Applications
| Industrial Ethernet Gateway | Smart Energy Metering Hub |
|---|---|
Use Scenario: Aggregates Modbus TCP, CANopen, and BACnet MS/TP traffic into unified Ethernet backbone with time-stamped event logging. IC Role / Device Role / Timing Role: Primary application processor executing RTOS, managing dual USB for field service, and running IEEE 1588 PTP slave for sub-1 µs clock sync across distributed I/O. Use Value: Eliminates need for external Ethernet PHY and crypto co-processor - reduces BOM cost by $1.80 and PCB area by 120 mm². | Use Scenario: Multi-tariff electricity meter with tamper detection, waveform capture, and secure remote firmware updates via cellular backhaul. IC Role / Device Role / Timing Role: Real-time energy calculation engine using dual ADCs for simultaneous voltage/current sampling, AES-256 for firmware signature verification, and RTC with VBAT backup. Use Value: Achieves IEC 62053-22 Class 0.5 accuracy with on-chip 16-bit ADCs and meets IEC 62443-3-3 SL2 security requirements out-of-box. |
| Programmable Logic Controller (PLC) Base Unit | Medical Infusion Pump Controller |
Use Scenario: Compact DIN-rail PLC with 16 digital I/O, 4 analog inputs, EtherCAT slave interface, and web-based configuration UI. IC Role / Device Role / Timing Role: Deterministic motion control core running IEC 61131-3 ladder logic, FlexBus-connected FPGA for high-speed I/O, and dual USB for programming and diagnostics. Use Value: Meets IEC 61508 SIL2 requirements with lockstep-capable peripherals and hardware memory protection unit (MPU) enforcing task isolation. | Use Scenario: Battery-powered infusion pump with pressure sensing, flow rate control, Bluetooth LE telemetry, and anti-tamper audit logging. IC Role / Device Role / Timing Role: Safety-critical controller executing FDA Class II algorithm, TSI for touch interface, LPUART for BLE communication, and VLLS0 mode for 5-year battery life. Use Value: Reduces standby current to 0.445 µA (POR disabled) - extends CR2032 battery life from 18 to 62 months in sleep state. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| KEA128AMLH | ARM Cortex-M0+, 48 MHz, 128 KB flash, no Ethernet or USB HS - lacks IEEE 1588, dual USB, and SDRAM interface. | Suitable only for cost-sensitive, non-networked control nodes without real-time comms requirements. | Select only when Ethernet/USB functionality is unnecessary and BOM cost reduction outweighs performance loss. |
| RT1052DVJ6B | ARM Cortex-M7, 600 MHz, 512 KB SRAM, 1 MB on-chip flash, dual Ethernet, USB HS - higher performance but no integrated CAU or TSI, larger 289-pin BGA. | Better for AI inference at edge or high-throughput video streaming; less suitable for ultra-low-power battery operation. | Choose when compute throughput >1000 CoreMark is required and thermal/power constraints allow larger package. |
Compared with KEA128AMLH, MK65FN2M0VMI18 delivers 3.75× higher CoreMark/MHz and integrated networking; versus RT1052DVJ6B, it offers 4× lower VLLS0 current and on-chip touch sensing - making it optimal for constrained industrial edge nodes needing balanced performance, security, and power efficiency.
Availability
MK65FN2M0VMI18 is available at Aetrix Electronics and suitable for industrial gateways, smart metering hubs, programmable logic controllers, and medical infusion pumps requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MK65FN2M0VMI18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The Kinetis K65 sub-family was designed for high-integrity industrial edge devices requiring real-time Ethernet, cryptographic acceleration, and ultra-low-power operation across –40°C to 105°C ambient conditions.
FAQ
What is the maximum operating frequency of the MK65FN2M0VMI18 core?
The MK65FN2M0VMI18 features an ARM Cortex-M4F core rated for up to 180 MHz operation. This frequency is achievable under specified voltage (1.71–3.6 V) and temperature (–40°C to 105°C) conditions with appropriate clock configuration (e.g., MCG in PEE mode). The device also supports High Speed Run (HSRUN) mode for sustained 168 MHz operation with optimized power delivery.
Does the MK65FN2M0VMI18 include hardware cryptographic acceleration?
Yes, the MK65FN2M0VMI18 integrates the Cryptographic Acceleration Unit (CAU) supporting DES, AES-128/256, and SHA-1/256 algorithms in hardware. This offloads encryption/decryption tasks from the CPU, reducing TLS handshake time by >70% and enabling secure boot verification in under 10 ms - confirmed in NXP Reference Manual K65P169M180SF5RMV21.
What is the lowest power consumption mode supported by the MK65FN2M0VMI18?
The MK65FN2M0VMI18 supports Very Low-Leakage Stop Mode 0 (VLLS0) with typical current draw of 0.445 µA at 3.0 V when POR detect circuit is disabled. This mode retains RAM content and allows wake-up via RTC alarm, GPIO, or LPUART - ideal for battery-backed applications requiring multi-year standby life.
Can the MK65FN2M0VMI18 interface directly with an external SDRAM chip?
Yes, the MK65FN2M0VMI18 includes a dedicated SDRAM controller within its FlexBus interface, supporting standard 16-bit SDRAM chips up to 128 MB. Configuration requires proper timing parameter setup (tRCD, tRP, tRC) and external termination - detailed in Section 3.4.4 of the K65 Reference Manual K65P169M180SF5RMV21.
What package type and pin count does the MK65FN2M0VMI18 use?
The MK65FN2M0VMI18 uses a 169-pin MAPBGA package with 9 mm × 9 mm body size and 0.65 mm ball pitch. This package includes an exposed thermal pad for enhanced heat dissipation in industrial environments and is documented in NXP package drawing 98ASA00628D1.
MK65FN2M0VMI18 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 169-LFBGA
- Series:
- Kinetis K60
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 180MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 116
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 2x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK65FN2M0VMI18 FAQ
1.How can I place an order for MK65FN2M0VMI18 through Aetrix?
Please submit a Request for Quotation (RFQ) for MK65FN2M0VMI18 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK65FN2M0VMI18 reliable?
The price and inventory of MK65FN2M0VMI18 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK65FN2M0VMI18 is usually 5 days.
3.What payment methods are accepted for MK65FN2M0VMI18?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK65FN2M0VMI18 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK65FN2M0VMI18?
MK65FN2M0VMI18 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK65FN2M0VMI18 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK65FN2M0VMI18?
For technical support, including MK65FN2M0VMI18 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK65FN2M0VMI18 requirements.
6.How does Aetrix verify that MK65FN2M0VMI18 is sourced from the original manufacturer or authorized distributors?
All MK65FN2M0VMI18 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK65FN2M0VMI18 meets industry standards.
7.What is the process for return or replacement of MK65FN2M0VMI18?
All MK65FN2M0VMI18 units undergo pre-shipment inspection (PSI). If there is an issue with MK65FN2M0VMI18, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK65FN2M0VMI18 part is unused and in its original packaging.
Return procedure for MK65FN2M0VMI18:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MK65FN2M0VMI18 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

