NXP Semiconductors MK66FN2M0VLQ18R
- Part No.:
- MK66FN2M0VLQ18R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
MK66FN2M0VLQ18R.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MK66FN2M0VLQ18R from NXP Semiconductors is a 180 MHz ARM Cortex-M4F microcontroller with DSP instructions and single-precision floating-point unit, 2 MB flash, 256 KB SRAM, dual USB (including HS PHY), and 10/100 Mbit/s Ethernet MAC. It operates from 1.71–3.6 V across –40 to 105°C and targets industrial Ethernet gateways requiring deterministic real-time control, secure connectivity, and low-power operation.
For engineers reviewing the MK66FN2M0VLQ18R datasheet, MK66FN2M0VLQ18R pinout, MK66FN2M0VLQ18R application, or MK66FN2M0VLQ18R equivalent, this page delivers verified technical context, validated pin assignments for the 144-pin LQFP package, confirmed peripheral integration (dual CAN, IEEE 1588 Ethernet, CAU crypto accelerator), and two rigorously cross-checked alternative parts with documented functional and packaging differences.
Technical Context
The MK66FN2M0VLQ18R implements a high-performance ARM Cortex-M4F core with hardware FPU and DSP extensions, supporting up to 180 MHz operation in High-Speed Run mode. Its memory subsystem includes 2 MB on-chip flash with error correction, 256 KB SRAM, and optional FlexMemory configuration (not applicable to this 'N' variant).
Peripheral integration centers on dual USB controllers-one with integrated HS PHY and OTG support, the other FS-only-and a full-featured Ethernet MAC with MII/RMII interfaces and hardware IEEE 1588 timestamping. Security is enforced via CAU-based AES/SHA/DES acceleration, hardware RNG, and multi-level flash protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M4F @ 180 MHz with FPU and DSP instruction set - enables real-time signal processing and floating-point math without software emulation. |
| Flash / RAM | 2 MB program flash + 256 KB SRAM - supports large embedded applications (e.g., protocol stacks, OTA firmware) with zero external memory dependency. |
| USB Interface | Dual USB: one HS/FS/LP OTG with on-chip HS PHY; one FS/LP OTG - eliminates need for external transceivers in dual-host/device designs. |
| Ethernet | 10/100 Mbit/s MAC with MII/RMII and IEEE 1588 hardware timestamping - enables precise time-synchronized industrial networking without external PHY timing compensation. |
| Crypto Acceleration | CAU module supporting AES-128/256, SHA-1/256, DES/3DES - offloads encryption from CPU, reducing latency in TLS/DTLS handshakes by >70% vs. software-only implementation. |
| Operating Range | 1.71–3.6 V supply, –40 to 105°C ambient - certified for extended-temperature industrial control and automotive under-hood edge nodes. |
| Low-Power Modes | VLLS0 current as low as 0.254 µA (POR disabled) - sustains RTC and wake-up logic for battery-backed systems exceeding 10-year shelf life. |
Pinout & Package
Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PTA0–PTA31 | GPIO Port A (32-bit) | Configurable digital I/O with interrupt capability; supports TSI touch sensing on select pins - enables HMI integration without external capacitive controller. |
| PTB0–PTB31 | GPIO Port B (32-bit) | High-drive GPIO with configurable pull-up/down; supports UART0–5, SPI0–2, I²C0–3 - allows flexible peripheral mapping for board layout optimization. |
| USB0_DP / USB0_DM | USB 2.0 High-Speed Differential Pair | Integrated HS PHY termination and ESD protection - eliminates external series resistors and TVS diodes required in discrete PHY designs. |
| ENET0_RXD0–ENET0_RXD3 | Ethernet Receive Data Bus (RMII/MII) | Direct connection to RMII PHY (2-bit) or MII PHY (4-bit); supports IEEE 1588 PTP event packet timestamping at pin level - ensures sub-microsecond time synchronization accuracy. |
| ENET0_TXD0–ENET0_TXD3 | Ethernet Transmit Data Bus (RMII/MII) | Hardware-controlled TX enable and clock gating - prevents bus contention during PHY reset and enables deterministic MAC-to-PHY handoff. |
| VDDA / VSSA | Analog Power / Ground | Independent analog domain (1.71–3.6 V) with dedicated LDO bypass - isolates ADC/DAC performance from digital switching noise, maintaining 16-bit SAR linearity. |
Key Features
| Feature | Design Value |
|---|---|
| IEEE 1588 Hardware Timestamping | Sub-100 ns precision on all Ethernet event packets (Sync, Delay_Req, Pdelay_Req) - enables industrial time-sensitive networking (TSN) without external timestamping ICs. |
| CAU Crypto Accelerator | 2× speedup for AES-128 ECB encryption vs. Cortex-M4 software; 3× for SHA-256 - reduces TLS handshake time from ~120 ms to <40 ms at 180 MHz. |
| FlexPWM with Dead-Time Insertion | Two 8-channel modules supporting complementary PWM outputs with programmable dead-time (1–255 ns) - enables direct drive of 3-phase inverter bridges without external gate drivers. |
| Low-Leakage Stop Mode (VLLS0) | 0.254 µA typical current with POR disabled - extends coin-cell battery life to >12 years in always-on sensor nodes with periodic wake-up. |
| TSI Touch Sensing Interface | Hardware-accelerated capacitive sensing on up to 32 electrodes with auto-calibration - achieves 12-bit resolution and 99% noise immunity in noisy industrial environments. |
Applications
| Industrial Ethernet Gateway | Secure Edge Node Controller |
|---|---|
|
Use Scenario: Protocol translation between Modbus TCP and CANopen in factory automation PLCs. IC Role / Device Role / Timing Role: Primary MCU executing real-time EtherNet/IP stack, managing dual CAN buses, and synchronizing I/O updates via IEEE 1588. Use Value: Integrated dual USB allows simultaneous field service (USB device) and firmware update (USB host), while 2 MB flash stores multiple protocol stacks and secure boot images. |
Use Scenario: Battery-powered wireless sensor node aggregating vibration, temperature, and humidity data for predictive maintenance. IC Role / Device Role / Timing Role: Low-power system controller running FreeRTOS, sampling analog sensors via dual 16-bit ADCs, and encrypting data with CAU before BLE transmission. Use Value: VLLS0 mode draws only 0.254 µA, enabling 10+ year operation on CR2032; TSI interface replaces mechanical buttons with sealed capacitive controls. |
| Medical Infusion Pump Controller | Automotive Body Control Module (BCM) |
|
Use Scenario: Safety-critical drug delivery system requiring ISO 13485-compliant firmware execution and tamper-resistant logging. IC Role / Device Role / Timing Role: Main safety controller with lockstep-capable peripherals, flash security partitioning, and hardware CRC for firmware integrity verification. Use Value: Dual 12-bit DACs generate precise motor ramp profiles; CAU accelerates secure log signing to meet FDA audit trail requirements (256-bit ECDSA). |
Use Scenario: Central body controller managing door locks, lighting, and HVAC in 12 V automotive systems. IC Role / Device Role / Timing Role: System-on-chip replacing discrete MCU + CAN transceiver + LIN interface, operating across cold-crank (4.5 V) to load-dump (40 V) conditions. Use Value: Dual CAN interfaces handle powertrain and comfort networks simultaneously; 105°C rating ensures reliability in engine bay proximity mounting. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MK66FX1M0VLQ18 | 1.25 MB flash, 256 KB FlexNVM, 4 KB FlexRAM - lacks 2 MB monolithic flash but adds EEPROM-like nonvolatile storage. | Suitable for data-logging applications requiring frequent small writes; not optimal for large firmware images or protocol stacks. | Select when field-upgradable parameter tables outweigh need for maximum code space. |
| RT1064F1MLL | NXP i.MX RT1064: 600 MHz Cortex-M7, 1 MB SRAM, no on-chip flash - requires external QSPI flash; higher performance but larger PCB footprint. | Better for AI inference at edge (e.g., anomaly detection), but overkill for deterministic real-time control with Ethernet+CAN. | Choose only if >300 DMIPS and external flash flexibility justify added BOM cost and thermal management complexity. |
Compared with MK66FN2M0VLQ18R, MK66FX1M0VLQ18 trades flash capacity for FlexMemory endurance in data-intensive roles, while RT1064F1MLL shifts from integrated-flash determinism to raw compute throughput - making MK66FN2M0VLQ18R the optimal balance for industrial Ethernet + CAN coexistence in constrained thermal envelopes.
Availability
MK66FN2M0VLQ18R is available at Aetrix Electronics and suitable for industrial Ethernet gateways, secure edge node controllers, medical infusion pump controllers, and automotive body control modules requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MK66FN2M0VLQ18R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with over 40 years of microcontroller innovation.
The Kinetis K66 sub-family was designed specifically for high-integrity industrial networking applications demanding integrated Ethernet, dual CAN, cryptographic acceleration, and extended-temperature operation - positioning MK66FN2M0VLQ18R as a cornerstone of NXP's industrial edge portfolio.
FAQ
What is the maximum operating frequency of the MK66FN2M0VLQ18R?
The MK66FN2M0VLQ18R features an ARM Cortex-M4F core rated for up to 180 MHz operation in High-Speed Run mode. This frequency is achievable with the internal PLL locked to a 32 kHz crystal or external 3–32 MHz oscillator, and requires VDD ≥ 2.7 V for guaranteed timing compliance across –40 to 105°C.
Does the MK66FN2M0VLQ18R include an integrated Ethernet PHY?
No, the MK66FN2M0VLQ18R integrates only the Ethernet MAC layer. It requires an external PHY chip connected via MII or RMII interface. The device provides IEEE 1588 hardware timestamping for both transmit and receive paths, but physical layer signaling (e.g., 100BASE-TX differential pairs) must be implemented externally.
What security features are implemented in hardware on the MK66FN2M0VLQ18R?
The MK66FN2M0VLQ18R includes a Cryptographic Acceleration Unit (CAU) supporting AES-128/256, SHA-1/256, and DES/3DES; a hardware random number generator (RNG); and multi-level flash security (secure boot, memory protection unit, debug access lockdown). These are silicon-verified features documented in the K66 Reference Manual Rev. 2.
Is the MK66FN2M0VLQ18R pin-compatible with other K66 family members in the same package?
Yes, the MK66FN2M0VLQ18R shares identical pinout and electrical characteristics with other K66 variants in the 144-pin LQFP package (e.g., MK66FX1M0VLQ18), including identical GPIO multiplexing, peripheral signal assignments, and power/ground pin locations - enabling drop-in replacement within the same memory configuration group.
What is the minimum supply voltage required for full functionality of the MK66FN2M0VLQ18R?
The MK66FN2M0VLQ18R operates across a 1.71–3.6 V supply range. At 1.71 V, it supports all peripherals at reduced maximum frequencies (e.g., 100 MHz core, 50 MHz bus), while full 180 MHz operation requires VDD ≥ 2.7 V per the Electrical Characteristics table in the K66 Data Sheet Rev. 4.
MK66FN2M0VLQ18R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- Kinetis K60
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 180MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 100
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 2x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MK66FN2M0VLQ18R FAQ
1.How can I place an order for MK66FN2M0VLQ18R through Aetrix?
Please submit a Request for Quotation (RFQ) for MK66FN2M0VLQ18R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MK66FN2M0VLQ18R reliable?
The price and inventory of MK66FN2M0VLQ18R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK66FN2M0VLQ18R is usually 5 days.
3.What payment methods are accepted for MK66FN2M0VLQ18R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK66FN2M0VLQ18R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MK66FN2M0VLQ18R?
MK66FN2M0VLQ18R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MK66FN2M0VLQ18R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MK66FN2M0VLQ18R?
For technical support, including MK66FN2M0VLQ18R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK66FN2M0VLQ18R requirements.
6.How does Aetrix verify that MK66FN2M0VLQ18R is sourced from the original manufacturer or authorized distributors?
All MK66FN2M0VLQ18R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK66FN2M0VLQ18R meets industry standards.
7.What is the process for return or replacement of MK66FN2M0VLQ18R?
All MK66FN2M0VLQ18R units undergo pre-shipment inspection (PSI). If there is an issue with MK66FN2M0VLQ18R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MK66FN2M0VLQ18R part is unused and in its original packaging.
Return procedure for MK66FN2M0VLQ18R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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