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NXP Semiconductors MK82FN256VDC15

Part No.:
MK82FN256VDC15
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
121-XFBGA
Datasheet:
AetrixMK82FN256VDC15.pdf
Description:
IC MCU 32BIT 256KB FLSH 121XFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:975

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Product details

Overview

MK82FN256VDC15 from NXP Semiconductors is a high-performance ARM® Cortex®-M4F microcontroller featuring 256 KB flash, 256 KB SRAM, full-speed USB On-The-Go, QuadSPI with OTF decryption, and hardware-accelerated AES128/AES256/ECC security. It operates up to 150 MHz with DSP instructions and single-precision FPU, targeting secure industrial gateways requiring local code execution from encrypted serial NOR flash.

For engineers reviewing the MK82FN256VDC15 datasheet, MK82FN256VDC15 pinout, MK82FN256VDC15 application, or MK82FN256VDC15 equivalent, key selection criteria include its 121-pin XFBGA package, dual QuadSPI interface with XIP support, -40°C to 105°C extended temperature rating, and integrated LP Trusted Cryptography (LTC) engine for secure boot and runtime encryption.

Technical Context

The MK82FN256VDC15 implements an ARM Cortex-M4F core with hardware floating-point unit and DSP extensions, coupled with a crossbar switch enabling concurrent access to flash, SRAM, and peripherals. Its memory subsystem includes 256 KB on-chip flash with error correction, 256 KB SRAM split across multiple banks, and dual QuadSPI controllers supporting octal/SDR/DDR serial flash with on-the-fly (OTF) AES decryption and execute-in-place (XIP).

Security is implemented via dedicated LP Trusted Cryptography (LTC) hardware accelerators for AES128/192/256, DES/3DES, RSA, and ECC with side-channel attack protection, plus a true random number generator (TRNG) and multi-level flash security lock bits. The device supports five low-power modes including VLLS0 with POR detection and RTC operation from independent VBAT domain.

Key Specifications

Parameter Value and Actual Design Meaning
Core ARM Cortex-M4F @ up to 150 MHz with DSP instructions and single-precision FPU - enables real-time signal processing and floating-point math in motor control or sensor fusion.
Memory 256 KB flash + 256 KB SRAM - supports large firmware images, real-time OS stacks, and buffered communication protocols without external memory.
QuadSPI Dual QuadSPI interfaces with OTF AES decryption and XIP - allows secure boot and direct code execution from encrypted serial NOR flash, eliminating need for RAM decompression.
Security LP Trusted Cryptography (LTC) engine with AES128/256, ECC, TRNG, and flash security lock - provides hardware-enforced secure boot, key management, and runtime data protection.
Temperature Range -40°C to +105°C ambient - qualified for industrial automation, building controls, and automotive under-hood applications requiring extended thermal stability.
I/O Count 87 GPIO pins - sufficient for complex human-machine interfaces, multi-sensor systems, and peripheral expansion in edge-node designs.
USB Full-/low-speed USB On-The-Go controller with DCD - enables host/peripheral mode switching and device enumeration without external PHY.

Pinout & Package

Package: 121-pin XFBGA (8 mm × 8 mm, 0.65 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal Circuit Role Design Meaning
VDD / VDDA / VDDIO_E Power supply domains Independent digital (VDD), analog (VDDA), and QuadSPI I/O (VDDIO_E) rails - enable mixed-signal integrity and flexible power sequencing per JEDEC JESD22-A103.
PTA–PTE General-purpose I/O banks 87 configurable GPIOs across five ports with programmable pull-up/down, slew rate control, and interrupt capability - support multiplexed peripheral functions including FlexIO, LPUART, and TSI.
QSPI0 / QSPI1 QuadSPI interface signals Dual 8-line QuadSPI buses (QSPI0_A/B/C/D, QSPI1_A/B/C/D) - provide parallel non-volatile memory access with hardware decryption for secure firmware storage.
USB0_DP / USB0_DM USB differential pair Full-/low-speed USB 2.0 differential signaling with integrated transceiver - eliminates external PHY and reduces BOM cost in embedded host/peripheral implementations.
RTC_CLKIN / RTC_WAKEUP_b Real-time clock domain Independent 32 kHz crystal input and wake-up pin with dedicated 3.3 V power domain - maintains timekeeping and system wake-up during deep sleep (VLLS0/VLLS1) with sub-μA current draw.

Key Features

Feature Design Value
LP Trusted Cryptography (LTC) Hardware acceleration for AES128/192/256, ECC, RSA, and SHA - reduces cryptographic latency by >10× vs software-only implementation and prevents timing-based side-channel attacks.
Dual QuadSPI with OTF Decryption On-the-fly AES decryption of serial NOR flash contents during read - enables secure XIP execution without exposing decrypted firmware in RAM.
Flexible Low-Power Modes Seven power modes including VLLS0 (0.62 μA typical) with POR detection and RTC wake-up - extends battery life in always-on industrial sensors and remote monitoring nodes.
16-bit SAR ADC + Dual DACs One 16-bit ADC (up to 1 MSPS), one 12-bit DAC, and two 6-bit DACs - supports high-resolution analog sensing and precision actuator control in closed-loop systems.
FlexIO Subsystem Programmable logic block supporting custom serial protocols (e.g., DMX512, UNI/O, custom SPI variants) - replaces discrete glue logic and enables rapid interface adaptation without FPGA.

Applications

Industrial Gateway Secure Edge Node

Use Scenario: Local protocol translation between Modbus RTU field devices and cloud-connected Ethernet/Wi-Fi uplinks in factory automation.

IC Role / Device Role / Timing Role: Central MCU managing dual network stacks, encrypted firmware updates, and real-time deterministic I/O scanning.

Use Value: Dual QuadSPI enables secure firmware storage and OTA update rollback; LTC engine validates signed update packages before flash programming.

Use Scenario: Battery-powered environmental sensor node performing local anomaly detection before transmitting compressed data over LoRaWAN.

IC Role / Device Role / Timing Role: Low-power host executing sensor fusion algorithms, managing crypto-secured data signing, and scheduling radio transmissions.

Use Value: VLLS0 mode draws only 0.62 μA while maintaining RTC alarm wake-up; 16-bit ADC ensures high-fidelity temperature/humidity sampling.

Medical Data Logger Smart Building Controller

Use Scenario: HIPAA-compliant patient vital sign recorder storing encrypted ECG waveforms locally before HIPAA-auditable upload.

IC Role / Device Role / Timing Role: Secure data acquisition MCU with tamper-evident logging, cryptographic timestamping, and audit-trail generation.

Use Value: Hardware AES256 and TRNG meet FIPS 140-2 Level 1 requirements; independent VBAT domain preserves RTC and register state during main power loss.

Use Scenario: HVAC zone controller integrating occupancy sensing, temperature regulation, and BACnet/IP communication in commercial buildings.

IC Role / Device Role / Timing Role: Real-time control MCU handling PID loops, touch interface (TSI), and multi-protocol networking (BACnet MS/TP + Ethernet).

Use Value: TSI interface supports capacitive touch buttons without external ICs; LPUART modules handle legacy RS-485 fieldbus integration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MK66FN2M0VLQ18 ARM Cortex-M4F @ 180 MHz, 2 MB flash, 256 KB SRAM, no QuadSPI OTF decryption, CAU crypto accelerator only Lacks hardware OTF AES decryption and XIP support; requires RAM-based decryption for secure boot Select when higher clock speed and larger flash are prioritized over secure serial flash execution.
STM32H743ZIT6 ARM Cortex-M7 @ 480 MHz, 2 MB flash, 1 MB SRAM, no integrated OTF decryption, uses external crypto co-processor for AES Requires external secure element for comparable security; lacks native QuadSPI XIP with decryption Choose for maximum compute throughput in non-security-critical vision or AI-edge applications where external crypto is acceptable.

Compared with MK66FN2M0VLQ18 and STM32H743ZIT6, the MK82FN256VDC15 uniquely integrates dual QuadSPI with hardware OTF AES decryption and XIP-enabling secure, low-latency code execution directly from encrypted serial NOR flash without RAM overhead or external components.

Availability

MK82FN256VDC15 is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, medical data loggers, smart building controllers, and battery-powered environmental sensors requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for MK82FN256VDC15 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and hardware security IP.

The MK82FN256VDC15 belongs to the Kinetis K82 sub-family, designed specifically for secure, high-performance edge computing in industrial and medical applications requiring encrypted firmware storage, real-time control, and extended temperature operation.

FAQ

What is the maximum operating frequency of the MK82FN256VDC15?

The MK82FN256VDC15 features an ARM Cortex-M4F core rated for up to 150 MHz operation. This frequency is achievable under specified voltage (1.71–3.6 V) and temperature (-40°C to 105°C) conditions with appropriate clock configuration (e.g., PEE mode using the PLL). At 150 MHz, the device delivers 196.2 CoreMark/MHz performance with full DSP and FPU support. MK82FN256VDC15 maintains timing compliance across its full industrial temperature range when operated within datasheet voltage and decoupling guidelines.

Does the MK82FN256VDC15 support secure boot from serial NOR flash?

Yes, the MK82FN256VDC15 supports secure boot from serial NOR flash via its dual QuadSPI interfaces with on-the-fly (OTF) AES128/AES256 decryption and execute-in-place (XIP) capability. The LP Trusted Cryptography (LTC) engine decrypts flash contents transparently during read access, allowing authenticated and encrypted firmware to execute directly without loading into RAM. MK82FN256VDC15 requires proper key provisioning and flash image formatting per NXP's K82 Security Reference Manual to enable this feature.

What package type and pin count does the MK82FN256VDC15 use?

The MK82FN256VDC15 is packaged in a 121-pin XFBGA (8 mm × 8 mm, 0.65 mm pitch) with exposed thermal pad. This package provides 87 general-purpose I/O pins, plus dedicated power, ground, clock, reset, and debug signals. MK82FN256VDC15's XFBGA footprint is optimized for high-density PCB layouts and thermal performance in space-constrained industrial modules, and it complies with JEDEC JESD22-A103 for moisture sensitivity level 3 handling.

Which low-power modes are available on the MK82FN256VDC15, and what is the lowest current draw?

The MK82FN256VDC15 offers seven low-power modes, including VLLS0 (Very-Low-Leakage Stop Mode 0) with POR detection enabled, which achieves a typical current draw of 0.62 μA at 25°C and 3.0 V. In VLLS0, the RTC remains active in its independent 3.3 V domain, and wake-up can occur via RTC alarm, external pin, or low-power timer. MK82FN256VDC15 maintains full register retention and secure state in all stop modes, with recovery times as low as 5.3 μs from VLPS to RUN mode.

What analog peripherals are integrated into the MK82FN256VDC15?

The MK82FN256VDC15 integrates a 16-bit SAR ADC (up to 1 MSPS), one 12-bit DAC, two 6-bit DACs (embedded in analog comparators), two analog comparators with programmable reference inputs, and a 1.2 V internal voltage reference. These peripherals support precision sensor interfacing, closed-loop control, and waveform generation. MK82FN256VDC15's ADC features hardware averaging and programmable oversampling, while its DACs enable fast analog output for calibration or actuator drive without external components.

MK82FN256VDC15 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
121-XFBGA
Series:
Kinetis K8x
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, I2S, LVD, POR, PWM
Number of I/O:
87
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 18x16b; D/A 2x6b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MK82FN256VDC15 FAQ

1.How can I place an order for MK82FN256VDC15 through Aetrix?

Please submit a Request for Quotation (RFQ) for MK82FN256VDC15 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MK82FN256VDC15 reliable?

The price and inventory of MK82FN256VDC15 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MK82FN256VDC15 is usually 5 days.

3.What payment methods are accepted for MK82FN256VDC15?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MK82FN256VDC15 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MK82FN256VDC15?

MK82FN256VDC15 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MK82FN256VDC15 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MK82FN256VDC15?

For technical support, including MK82FN256VDC15 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MK82FN256VDC15 requirements.

6.How does Aetrix verify that MK82FN256VDC15 is sourced from the original manufacturer or authorized distributors?

All MK82FN256VDC15 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MK82FN256VDC15 meets industry standards.

7.What is the process for return or replacement of MK82FN256VDC15?

All MK82FN256VDC15 units undergo pre-shipment inspection (PSI). If there is an issue with MK82FN256VDC15, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MK82FN256VDC15 part is unused and in its original packaging.

Return procedure for MK82FN256VDC15:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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